Infineon Technologies CY7C1418KV18-250BZXC

Overview

CY7C1418KV18-250BZXC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR II synchronous SRAM with two-word burst architecture, 1.8 V core supply, HSTL I/O, and 250 MHz maximum clock frequency (400 Mbps data rate). It uses dual input clocks (K/K) and echo clocks (CQ/CQ) for precise DDR timing and supports programmable output impedance via ZQ pin. It is deployed in high-bandwidth packet buffering for telecom line cards and network switches.

For engineers reviewing the CY7C1418KV18-250BZXC datasheet, CY7C1418KV18-250BZXC pinout, CY7C1418KV18-250BZXC application, or CY7C1418KV18-250BZXC equivalent, key selection criteria include 250 MHz DDR clock support, 1.5-cycle read latency (DOFF = HIGH), 165-ball FBGA package compatibility, HSTL-18 I/O voltage range (1.4–1.8 V), and JTAG 1149.1 test access capability.

Technical Context

The device implements a synchronous pipelined architecture with internal burst counter driven by A0, latching addresses on alternate rising edges of K/K to enable two-word burst reads/writes. All synchronous inputs-including R/W, LD, BWS[1:0], and DQ[17:0]-are registered on K/K edges, while outputs are edge-aligned to C/C or K/K in single-clock mode.

It integrates a PLL for accurate data placement, echo clocks (CQ/CQ) synchronized to C/C for simplified high-speed data capture, and ZQ-controlled output impedance tuning (0.2 × RQ). DOFF pin selects between DDR-II mode (1.5-cycle latency) and DDR-I mode (1-cycle latency), enabling system-level timing flexibility without changing clock topology.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free (BZXC suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Compared with IS45S16160F-25BLI and MT47H64M16HR-25E:H, CY7C1418KV18-250BZXC delivers guaranteed latency, built-in deskew clocks, and on-die impedance control - making it uniquely suited for deterministic, high-reliability burst-buffer applications where timing predictability is non-negotiable.

Availability

CY7C1418KV18-250BZXC is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, industrial control systems, and avionics data acquisition requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1418KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1418KV18 belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in systems where DDR SDRAM unpredictability or asynchronous SRAM bandwidth limitations are unacceptable.

FAQ

What is the function of the DOFF pin on CY7C1418KV18-250BZXC?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, the device operates in DDR-II mode with 1.5-cycle read latency; when LOW, it reverts to DDR-I mode with 1-cycle latency. This selection directly affects tAC timing and must be set before initialization. The pin is sampled synchronously on the rising edge of K, and its state remains latched until power-on reset or hardware reset.

Can CY7C1418KV18-250BZXC operate without external C and C clocks?

Yes - the device supports single-clock mode where K and K serve as both command and output clocks. In this configuration, read data is driven on the rising edges of K and K instead of C and C, and CQ/CQ are generated relative to K. However, echo clock functionality and optimal deskew performance require dedicated C/C inputs, so single-clock mode trades timing margin for reduced clock routing complexity.

How is output impedance calibrated using the ZQ pin?

ZQ connects to an external precision resistor (RQ) tied to ground; the device measures RQ and calibrates all DQ and CQ output drivers to 0.2 × RQ. Typical RQ values are 240 Ω (yielding ~48 Ω drive), but values from 120 Ω to 330 Ω are supported. Connecting ZQ directly to VDDQ enables minimum-impedance mode (~30 Ω); floating or grounding ZQ is prohibited and may cause undefined behavior or damage.

Is CY7C1418KV18-250BZXC pin-compatible with other devices in the CY7C14xxKV18 family?

No - CY7C1418KV18-250BZXC (2M × 18) has different pin assignments than CY7C1420KV18 (1M × 36), particularly in BWS and DQ pin counts and locations. While both use the same 165-ball FBGA footprint, the signal mapping differs: BWS0/BWS1 vs. BWS0–BWS3, and DQ[17:0] vs. DQ[35:0]. Board-level replacement requires schematic and layout revision, not just BOM update.