Infineon Technologies CY7C1418KV18-300BZXC

Overview

CY7C1418KV18-300BZXC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR II synchronous SRAM with two-word burst architecture, 333 MHz clock operation, 1.8 V core supply, HSTL I/O, and 165-ball FBGA package. It delivers 666 MT/s data transfer via double data rate interface and supports configurable read latency (1 or 1.5 cycles) via DOFF pin for high-bandwidth buffering in network packet processors.

For engineers reviewing the CY7C1418KV18-300BZXC datasheet, CY7C1418KV18-300BZXC pinout, CY7C1418KV18-300BZXC application, or CY7C1418KV18-300BZXC equivalent, key selection criteria include DDR-II timing compliance, echo clock (CQ/CQ) synchronization capability, burst-addressed 18-bit wide data path, and JTAG 1149.1 test port integration for system-level validation.

Technical Context

This SRAM implements a synchronous pipelined architecture with dual input clocks (K/K) for address/control latching and dual output clocks (C/C) for data strobing. Internal burst counter uses A0 to generate sequential 18-bit word addresses, enabling two-word bursts per access without external address incrementing.

It integrates a PLL for precise data placement, echo clocks (CQ/CQ) aligned to C/C for simplified high-speed data capture, and programmable output impedance via ZQ pin. Read latency is selectable between 1 cycle (DOFF = LOW) and 1.5 cycles (DOFF = HIGH), matching DDR-I or DDR-II timing models respectively.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 1.0 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Compared with AS7C33618B-333BIN and IS45S32800J-333BLI, CY7C1418KV18-300BZXC uniquely combines true SRAM simplicity (no refresh), echo-clock–assisted timing closure, and software-selectable latency-making it optimal for deterministic, high-speed embedded buffering where timing predictability outweighs raw density.

Availability

CY7C1418KV18-300BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and industrial real-time controller cache requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1418KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1418KV18 belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in networking and telecom infrastructure where predictable timing and signal integrity are critical.

FAQ

What is the function of the DOFF pin?

The DOFF pin configures read latency: when asserted HIGH, it enables DDR-II mode with 1.5-cycle latency for higher bandwidth efficiency; when LOW, it selects DDR-I mode with 1-cycle latency for minimal access delay. This setting directly affects controller timing budget and must be held stable during operation.

How do CQ and CQ clocks improve system timing?

CQ and CQ are echo clocks synchronized to C and C, respectively, and routed alongside DQ[17:0] to the memory controller. They allow source-synchronous data capture-eliminating the need to match individual DQ trace lengths-and reduce setup/hold timing uncertainty by up to 200 ps in multi-device configurations.

Can CY7C1418KV18-300BZXC operate with only K and K clocks?

Yes. In single-clock mode, C and C are unused; read data is driven on the rising edges of K and K instead. However, this forfeits echo-clock benefits and increases timing margin requirements due to lack of dedicated output strobes and increased clock-to-Q skew.

What is the role of the ZQ pin in system design?

ZQ connects to an external precision resistor (typically 240 Ω) to ground, enabling on-die calibration of DQ, CQ, and CQ output driver impedance. This ensures consistent 50 Ω termination across voltage/temperature variations, reducing signal reflections and improving eye diagram margins on high-speed buses.