Infineon Technologies CY7C1420BV18-200BZCT
- Part No.:
- CY7C1420BV18-200BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1420BV18-200BZCT.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1420BV18 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined DDR-II SRAM with 1.8V core supply, HSTL I/O, and 2-word burst architecture. It operates at up to 200 MHz clock frequency (400 MT/s effective data rate), supports DLL-enabled 1.5-cycle read latency, and uses dual input clocks (K/K) and dual output clocks (C/C) for precise timing control in high-speed memory subsystems used in network packet buffers and baseband processing.
For engineers reviewing the CY7C1420BV18 datasheet, CY7C1420BV18 pinout, CY7C1420BV18 application, or CY7C1420BV18 equivalent, key selection criteria include its 1M × 36 organization, 165-ball FBGA package, echo clock support (CQ/CQ), variable-drive HSTL outputs, and DLL-on/off mode flexibility for DDR-I/DDR-II interoperability.
Technical Context
This device implements a synchronous pipelined architecture where address and control signals are registered on rising edges of complementary K/K clocks, and data is transferred on both edges of C/C (DDR) or K/K (single-clock mode). Burst counter logic uses A0 as LSB input to sequence two 36-bit words per access.
It integrates a Delay Lock Loop (DLL) for accurate data placement relative to echo clocks CQ/CQ, enabling system-level deskew across multiple devices. Output impedance is tunable via ZQ pin using external resistor to ground, supporting 0.2×RQ matching to system bus impedance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Maximum Clock Frequency | 200 MHz - defines maximum sustained burst transfer rate of 400 MT/s in DDR mode |
| Read Latency | 1.5 cycles with DLL enabled; 1 cycle with DLL disabled (DOFF = LOW) |
| I/O Interface | HSTL Class I - ensures compatible signaling with FPGA/ASIC memory controllers at 1.8V |
| Core Supply Voltage | 1.8 V ± 0.1 V - powers internal SRAM array and logic; requires tight regulation |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - supports high-density PCB layout with controlled impedance routing |
| Burst Length | 2-word fixed burst - reduces address bus toggling and simplifies controller address generation |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data I/O | 36-bit wide data path; latched on K/K rising edges during write, driven on C/C rising edges during read; tri-stated automatically when deselected |
| A[19:0] | Synchronous address input | 20-bit address bus; A0 serves as LSB input to internal burst counter for sequential 36-bit word addressing |
| R/W | Synchronous read/write control | Active-HIGH = read, LOW = write; sampled with LD to define transaction type during burst cycle |
| LD | Synchronous load enable | Active-LOW signal initiating each 2-word burst; must meet setup/hold timing relative to K edge |
| BWS[3:0] | Byte write select | Four active-LOW signals controlling write enable per 8-bit byte; BWS0–BWS3 map to D[8:0], D[17:9], D[26:18], D[35:27] respectively |
| K / K | Complementary input clocks | Primary timing reference for all synchronous inputs; rising edges capture address, R/W, LD, and data during writes |
| C / C | Complementary output clocks | Drive read data timing; used with CQ/CQ to compensate for board flight-time skew between memory and controller |
| CQ / CQ | Echo clocks | Free-running clocks synchronized to C/C; simplify source-synchronous data capture at controller without complex deskew circuitry |
| ZQ | Output impedance calibration | Connect to external resistor to ground to set output driver impedance to 0.2×RQ; enables precise HSTL bus termination matching |
| DOFF | DLL disable control | Active-LOW pin disabling internal Delay Lock Loop; forces DDR-I timing mode with 1-cycle latency and ≤167 MHz operation |
Key Features
| Feature | Design Value |
|---|---|
| 2-word DDR-II burst architecture | Reduces address bus frequency by 50% versus single-word access, lowering controller complexity and routing congestion |
| Programmable DLL mode (DOFF pin) | Enables seamless migration between DDR-II (1.5-cycle latency, 200 MHz) and DDR-I (1-cycle latency, ≤167 MHz) timing modes |
| Variable-drive HSTL outputs | Supports adjustable drive strength via ZQ calibration, ensuring signal integrity across varying trace lengths and loads |
| Echo clock outputs (CQ/CQ) | Eliminates need for separate clock forwarding or phase alignment circuitry in multi-SRAM systems |
| JTAG 1149.1 test port | Enables boundary-scan testing and in-system debug without requiring additional test pads or probes |
Applications
| Network Packet Buffering | Baseband Signal Processing |
|---|---|
|
Use Scenario: Temporary storage of Ethernet/SONET frames in line cards before classification or forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly with MAC or switch fabric controller via HSTL bus. Use Value: 200 MHz DDR-II interface delivers 400 MT/s throughput sufficient for 10Gbps+ line rates; echo clocks ensure deterministic read capture timing. |
Use Scenario: Real-time buffering of IQ samples between ADC/DAC and DSP in LTE/5G radio units. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM acting as ping-pong buffer for continuous data flow with minimal controller overhead. Use Value: 1.5-cycle DLL-enabled latency minimizes pipeline stalls; 1M × 36 width matches common 36-bit datapaths in modem ASICs. |
| High-Speed Test Equipment Memory | Industrial Imaging Frame Store |
|
Use Scenario: Capturing high-resolution waveform data from multi-channel digitizers at >200 MS/s aggregate rate. IC Role / Device Role / Timing Role: Burst-access memory providing deterministic write latency and jitter-free read timing for real-time analysis engines. Use Value: Dual K/K clocking isolates address/control setup from data sampling; DOFF pin allows fallback to DDR-I mode if system clock margin is constrained. |
Use Scenario: Storing full-frame sensor data from CMOS image sensors operating at >60 fps with 12-bit depth. IC Role / Device Role / Timing Role: Low-power, high-reliability frame buffer interfaced to FPGA-based image processor with HSTL-compatible I/O banks. Use Value: 1.8V core voltage reduces dynamic power vs. 2.5V SRAMs; 165-ball FBGA enables compact, thermally efficient PCB layout near sensor modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-15BLI | 256-Mbit (4M × 36), 15 ns async access, 3.3V core, no DDR or DLL | Used in legacy systems requiring simple parallel interface and higher density, not DDR timing-critical paths | Select when DDR timing control, echo clocks, or DLL-based latency tuning are unnecessary |
| MT48LC32M16A2P-6A:G | 512-Mbit SDRAM, 166 MHz clock, 3.3V, 4-bank architecture, CAS latency 3 | Targets cost-sensitive, moderate-bandwidth applications where burst length and refresh management are acceptable trade-offs | Select when system already uses SDRAM controller IP and bandwidth requirements are ≤333 MB/s |
Compared with IS61WV102436BLL-15BLI and MT48LC32M16A2P-6A:G, CY7C1420BV18 provides deterministic DDR-II timing, echo clock support for source-synchronous capture, and programmable DLL mode-critical for systems demanding sub-5ns read-to-data-valid timing consistency across temperature and voltage.
Availability
CY7C1420BV18 is available at Aetrix Electronics and suitable for network infrastructure, wireless baseband, high-speed test instrumentation, and industrial imaging applications requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1420BV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, emphasizing signal integrity and timing precision.
CY7C1420BV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for applications needing deterministic low-latency memory access with source-synchronous timing control in FPGA- and ASIC-based systems.
FAQ
What is the minimum supported clock frequency for CY7C1420BV18?
The device has no specified minimum clock frequency; it supports DC operation in DLL-off mode. In DLL-on mode, stable operation requires ≥100 MHz to maintain DLL lock. For guaranteed timing compliance, refer to the "DC Electrical Characteristics" and "Switching Characteristics" tables in Document Number 001-07033 Rev. *D, pages 18–24.
Can CY7C1420BV18 operate with only K clock (no K) in single-clock mode?
Yes - when K is tied to VDDQ and K is used as the sole input clock, the device operates in single-clock mode. In this configuration, read data is driven on rising edges of K/K, and C/C must be driven externally or tied off; CQ/CQ remain functional but derive from K instead of C/C.
How does ZQ calibration affect signal integrity in a multi-SRAM system?
ZQ calibration sets output driver impedance to 0.2×RQ, matching typical 50Ω transmission lines when RQ = 250Ω. This reduces reflections and improves eye diagram margins across all 36 DQ lines, especially critical in systems with >4 SRAMs sharing the same bus due to cumulative stub effects.
Is JTAG boundary-scan supported while the device is actively performing memory operations?
Yes - the IEEE 1149.1 TAP controller operates independently of memory access cycles. Boundary-scan instructions (SAMPLE/PRELOAD, EXTEST, INTEST) can be executed during idle periods or even mid-burst, provided TMS/TCK sequencing complies with JTAG state machine timing requirements in section 5.2 of the datasheet.
CY7C1420BV18-200BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1420BV18-200BZCT FAQ
1.How can I place an order for CY7C1420BV18-200BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1420BV18-200BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1420BV18-200BZCT reliable?
The price and inventory of CY7C1420BV18-200BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1420BV18-200BZCT is usually 5 days.
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Once your CY7C1420BV18-200BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1420BV18-200BZCT?
For technical support, including CY7C1420BV18-200BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1420BV18-200BZCT requirements.
6.How does Aetrix verify that CY7C1420BV18-200BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1420BV18-200BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1420BV18-200BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1420BV18-200BZCT?
All CY7C1420BV18-200BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1420BV18-200BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1420BV18-200BZCT part is unused and in its original packaging.
Return procedure for CY7C1420BV18-200BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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