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Infineon Technologies CY7C1420BV18-200BZCT

Part No.:
CY7C1420BV18-200BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1420BV18-200BZCT.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,054

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Product details

Overview

CY7C1420BV18 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined DDR-II SRAM with 1.8V core supply, HSTL I/O, and 2-word burst architecture. It operates at up to 200 MHz clock frequency (400 MT/s effective data rate), supports DLL-enabled 1.5-cycle read latency, and uses dual input clocks (K/K) and dual output clocks (C/C) for precise timing control in high-speed memory subsystems used in network packet buffers and baseband processing.

For engineers reviewing the CY7C1420BV18 datasheet, CY7C1420BV18 pinout, CY7C1420BV18 application, or CY7C1420BV18 equivalent, key selection criteria include its 1M × 36 organization, 165-ball FBGA package, echo clock support (CQ/CQ), variable-drive HSTL outputs, and DLL-on/off mode flexibility for DDR-I/DDR-II interoperability.

Technical Context

This device implements a synchronous pipelined architecture where address and control signals are registered on rising edges of complementary K/K clocks, and data is transferred on both edges of C/C (DDR) or K/K (single-clock mode). Burst counter logic uses A0 as LSB input to sequence two 36-bit words per access.

It integrates a Delay Lock Loop (DLL) for accurate data placement relative to echo clocks CQ/CQ, enabling system-level deskew across multiple devices. Output impedance is tunable via ZQ pin using external resistor to ground, supporting 0.2×RQ matching to system bus impedance.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 organization)
Maximum Clock Frequency 200 MHz - defines maximum sustained burst transfer rate of 400 MT/s in DDR mode
Read Latency 1.5 cycles with DLL enabled; 1 cycle with DLL disabled (DOFF = LOW)
I/O Interface HSTL Class I - ensures compatible signaling with FPGA/ASIC memory controllers at 1.8V
Core Supply Voltage 1.8 V ± 0.1 V - powers internal SRAM array and logic; requires tight regulation
Package 165-ball FBGA (15 × 17 × 1.4 mm) - supports high-density PCB layout with controlled impedance routing
Burst Length 2-word fixed burst - reduces address bus toggling and simplifies controller address generation

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data I/O 36-bit wide data path; latched on K/K rising edges during write, driven on C/C rising edges during read; tri-stated automatically when deselected
A[19:0] Synchronous address input 20-bit address bus; A0 serves as LSB input to internal burst counter for sequential 36-bit word addressing
R/W Synchronous read/write control Active-HIGH = read, LOW = write; sampled with LD to define transaction type during burst cycle
LD Synchronous load enable Active-LOW signal initiating each 2-word burst; must meet setup/hold timing relative to K edge
BWS[3:0] Byte write select Four active-LOW signals controlling write enable per 8-bit byte; BWS0–BWS3 map to D[8:0], D[17:9], D[26:18], D[35:27] respectively
K / K Complementary input clocks Primary timing reference for all synchronous inputs; rising edges capture address, R/W, LD, and data during writes
C / C Complementary output clocks Drive read data timing; used with CQ/CQ to compensate for board flight-time skew between memory and controller
CQ / CQ Echo clocks Free-running clocks synchronized to C/C; simplify source-synchronous data capture at controller without complex deskew circuitry
ZQ Output impedance calibration Connect to external resistor to ground to set output driver impedance to 0.2×RQ; enables precise HSTL bus termination matching
DOFF DLL disable control Active-LOW pin disabling internal Delay Lock Loop; forces DDR-I timing mode with 1-cycle latency and ≤167 MHz operation

Key Features

Feature Design Value
2-word DDR-II burst architecture Reduces address bus frequency by 50% versus single-word access, lowering controller complexity and routing congestion
Programmable DLL mode (DOFF pin) Enables seamless migration between DDR-II (1.5-cycle latency, 200 MHz) and DDR-I (1-cycle latency, ≤167 MHz) timing modes
Variable-drive HSTL outputs Supports adjustable drive strength via ZQ calibration, ensuring signal integrity across varying trace lengths and loads
Echo clock outputs (CQ/CQ) Eliminates need for separate clock forwarding or phase alignment circuitry in multi-SRAM systems
JTAG 1149.1 test port Enables boundary-scan testing and in-system debug without requiring additional test pads or probes

Applications

Network Packet Buffering Baseband Signal Processing

Use Scenario: Temporary storage of Ethernet/SONET frames in line cards before classification or forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly with MAC or switch fabric controller via HSTL bus.

Use Value: 200 MHz DDR-II interface delivers 400 MT/s throughput sufficient for 10Gbps+ line rates; echo clocks ensure deterministic read capture timing.

Use Scenario: Real-time buffering of IQ samples between ADC/DAC and DSP in LTE/5G radio units.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM acting as ping-pong buffer for continuous data flow with minimal controller overhead.

Use Value: 1.5-cycle DLL-enabled latency minimizes pipeline stalls; 1M × 36 width matches common 36-bit datapaths in modem ASICs.

High-Speed Test Equipment Memory Industrial Imaging Frame Store

Use Scenario: Capturing high-resolution waveform data from multi-channel digitizers at >200 MS/s aggregate rate.

IC Role / Device Role / Timing Role: Burst-access memory providing deterministic write latency and jitter-free read timing for real-time analysis engines.

Use Value: Dual K/K clocking isolates address/control setup from data sampling; DOFF pin allows fallback to DDR-I mode if system clock margin is constrained.

Use Scenario: Storing full-frame sensor data from CMOS image sensors operating at >60 fps with 12-bit depth.

IC Role / Device Role / Timing Role: Low-power, high-reliability frame buffer interfaced to FPGA-based image processor with HSTL-compatible I/O banks.

Use Value: 1.8V core voltage reduces dynamic power vs. 2.5V SRAMs; 165-ball FBGA enables compact, thermally efficient PCB layout near sensor modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102436BLL-15BLI 256-Mbit (4M × 36), 15 ns async access, 3.3V core, no DDR or DLL Used in legacy systems requiring simple parallel interface and higher density, not DDR timing-critical paths Select when DDR timing control, echo clocks, or DLL-based latency tuning are unnecessary
MT48LC32M16A2P-6A:G 512-Mbit SDRAM, 166 MHz clock, 3.3V, 4-bank architecture, CAS latency 3 Targets cost-sensitive, moderate-bandwidth applications where burst length and refresh management are acceptable trade-offs Select when system already uses SDRAM controller IP and bandwidth requirements are ≤333 MB/s

Compared with IS61WV102436BLL-15BLI and MT48LC32M16A2P-6A:G, CY7C1420BV18 provides deterministic DDR-II timing, echo clock support for source-synchronous capture, and programmable DLL mode-critical for systems demanding sub-5ns read-to-data-valid timing consistency across temperature and voltage.

Availability

CY7C1420BV18 is available at Aetrix Electronics and suitable for network infrastructure, wireless baseband, high-speed test instrumentation, and industrial imaging applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1420BV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, emphasizing signal integrity and timing precision.

CY7C1420BV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for applications needing deterministic low-latency memory access with source-synchronous timing control in FPGA- and ASIC-based systems.

FAQ

What is the minimum supported clock frequency for CY7C1420BV18?

The device has no specified minimum clock frequency; it supports DC operation in DLL-off mode. In DLL-on mode, stable operation requires ≥100 MHz to maintain DLL lock. For guaranteed timing compliance, refer to the "DC Electrical Characteristics" and "Switching Characteristics" tables in Document Number 001-07033 Rev. *D, pages 18–24.

Can CY7C1420BV18 operate with only K clock (no K) in single-clock mode?

Yes - when K is tied to VDDQ and K is used as the sole input clock, the device operates in single-clock mode. In this configuration, read data is driven on rising edges of K/K, and C/C must be driven externally or tied off; CQ/CQ remain functional but derive from K instead of C/C.

How does ZQ calibration affect signal integrity in a multi-SRAM system?

ZQ calibration sets output driver impedance to 0.2×RQ, matching typical 50Ω transmission lines when RQ = 250Ω. This reduces reflections and improves eye diagram margins across all 36 DQ lines, especially critical in systems with >4 SRAMs sharing the same bus due to cumulative stub effects.

Is JTAG boundary-scan supported while the device is actively performing memory operations?

Yes - the IEEE 1149.1 TAP controller operates independently of memory access cycles. Boundary-scan instructions (SAMPLE/PRELOAD, EXTEST, INTEST) can be executed during idle periods or even mid-burst, provided TMS/TCK sequencing complies with JTAG state machine timing requirements in section 5.2 of the datasheet.

CY7C1420BV18-200BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1420BV18-200BZCT FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1420BV18-200BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1420BV18-200BZCT reliable?

The price and inventory of CY7C1420BV18-200BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1420BV18-200BZCT is usually 5 days.

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Once your CY7C1420BV18-200BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1420BV18-200BZCT?

For technical support, including CY7C1420BV18-200BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1420BV18-200BZCT requirements.

6.How does Aetrix verify that CY7C1420BV18-200BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1420BV18-200BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1420BV18-200BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1420BV18-200BZCT?

All CY7C1420BV18-200BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1420BV18-200BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1420BV18-200BZCT part is unused and in its original packaging.

Return procedure for CY7C1420BV18-200BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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