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Infineon Technologies CY7C1420JV18-300BZC

Part No.:
CY7C1420JV18-300BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1420JV18-300BZC.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,327

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Product details

Overview

CY7C1420JV18 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined DDR-II SRAM with 300 MHz clock operation, 600 Mbps double-data-rate interface, 1.8V core supply, and HSTL I/O compatible with 1.4V–1.8V output swing. It implements 2-word burst architecture with echo clocks (CQ/CQ) and DLL-enabled 1.5-cycle read latency for high-speed networking buffers and packet memory in telecom line cards.

For engineers reviewing the CY7C1420JV18 datasheet, CY7C1420JV18 pinout, CY7C1420JV18 application, or CY7C1420JV18 equivalent, key selection criteria include DDR-II timing compliance, 165-ball FBGA (15 × 17 mm) mechanical fit, 36-bit data bus width, DLL-on/off mode behavior, and HSTL-18 I/O drive strength matching system termination schemes.

Technical Context

This SRAM uses dual-clock DDR-II architecture: K/K clocks latch addresses and write data on rising edges, while C/C clocks drive read data with matched echo clocks CQ/CQ to eliminate board-level skew. Internal burst counter uses A0 as LSB input to sequence two 36-bit words per access.

The device supports both DLL-enabled (1.5-cycle read latency, 300 MHz max) and DLL-disabled (1-cycle latency, ≤167 MHz DDR-I timing) modes via DOFF pin control. All I/O-including DQ[35:0], BWS[3:0], and R/W-are registered synchronously to K/K, ensuring deterministic setup/hold margins in high-speed designs.

Key Specifications

ParameterValue and Actual Design Meaning
Density & Organization36 Mbit (1M × 36), enabling single-chip storage of 1 million 36-bit words for packet buffering or frame memory
Max Clock Frequency300 MHz (K/K), supporting 600 MT/s effective data rate with DDR interface
Read Latency1.5 cycles with DLL enabled (DOFF = HIGH); 1 cycle with DLL disabled (DOFF = LOW), directly affecting pipeline depth in controller design
I/O VoltageHSTL Class I (1.4V–VDDQ), compatible with 1.8V VDDQ and allowing adjustable drive strength via ZQ calibration
Package165-ball FBGA (15 mm × 17 mm × 1.4 mm), footprint-matched to high-density routing requirements in telecom PCBs
Power Supply1.8V core (VDD), 1.8V I/O (VDDQ), enabling low-voltage operation without level-shifting circuitry
Burst ModeFixed 2-word burst, reducing address bus toggling frequency by 50% versus non-burst SRAMs

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
DQ[35:0]Synchronous bidirectional data bus36-bit wide DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges with echo-clock alignment
BWS[3:0]Byte write select (active LOW)Independent control of four 9-bit bytes during writes; enables partial-word updates without read-modify-write overhead
K / KPositive/negative input clocksDDR clock pair for address, control, and write data capture; defines all synchronous timing references
C / CPositive/negative output clocksDeskewed clock pair driving read data; used with CQ/CQ to compensate for flight-time mismatches across multiple SRAMs
CQ / CQEcho clocks referenced to C/CFree-running output clocks synchronized to C/C; simplify controller data capture by eliminating per-device delay calibration
DOFFDLL enable/disable controlActive-LOW pin selecting between DDR-II (1.5-cycle latency, 300 MHz) and DDR-I (1-cycle latency, ≤167 MHz) timing modes
ZQOutput impedance calibration referenceConnects to external resistor to ground to calibrate DQ/CQ output driver impedance to 0.2 × RQ, ensuring signal integrity on HSTL buses

Key Features

FeatureDesign Value
2-word burst architectureHalves required address transitions per data word, reducing bus switching noise and controller logic complexity
DLL-enabled precise data placementEnsures ±50 ps data-to-CQ skew over voltage/temperature, enabling reliable 600 MT/s operation without per-lane deskew logic
HSTL-18 I/O with variable driveSupports 1.4V–1.8V output swing and programmable drive strength via ZQ calibration, matching diverse PCB trace impedances
JTAG 1149.1 test access portEnables boundary-scan testing of SRAM interconnects and system-level validation without physical probe access
Single/dual clock domain supportAllows use of K/K only (simplified layout) or separate C/C (maximized timing margin) depending on system clock architecture

Applications

Telecom Line Card BufferHigh-Speed Packet Switching

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/40G Ethernet line cards.

IC Role / Device Role / Timing Role: As a 36-bit-wide DDR-II SRAM, it serves as a low-latency, burst-access buffer synchronized to switch fabric clocks.

Use Value: 1.5-cycle DLL-enabled latency and echo clocks reduce controller timing closure effort by eliminating per-SRAM data capture tuning.

Use Scenario: Holding forwarding tables and queue state in multi-port network switches with parallel 36-bit data paths.

IC Role / Device Role / Timing Role: Acts as a shared packet memory bank with byte-selectable writes (BWS[3:0]) for concurrent header updates and payload storage.

Use Value: 2-word burst mode cuts address bus bandwidth requirement in half, freeing FPGA I/O for additional control logic or expansion interfaces.

Baseband Processing MemoryIndustrial Real-Time Controller Cache

Use Scenario: Temporary storage of OFDM symbol coefficients and channel estimation results in LTE/5G baseband units.

IC Role / Device Role / Timing Role: Provides deterministic 300 MHz DDR-II access to DSP/FPGA co-processors requiring predictable read/write turnaround.

Use Value: DOFF pin allows runtime switching between DDR-II (full speed) and DDR-I (lower power, reduced EMI) modes during low-traffic periods.

Use Scenario: Caching sensor fusion data and motion control parameters in deterministic industrial PLCs with tight jitter budgets.

IC Role / Device Role / Timing Role: Functions as a jitter-immune, synchronous memory block interfaced to real-time microcontrollers via HSTL-compatible buses.

Use Value: ZQ-calibrated HSTL outputs maintain signal integrity across wide temperature ranges (-40°C to +85°C), ensuring reliability in factory environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102436BLL-15BLI1M × 36, 1.5V core, 166 MHz QDR-II interface (not DDR-II); no echo clocks or DLLLacks CQ/CQ and DLL, requiring external deskew; lower bandwidth (333 MT/s vs. 600 MT/s)Choose when QDR-II controller IP is available and echo-clock simplification is not required
MT48LC32M16A2P-75:C32M × 16 SDRAM, 3.3V, 133 MHz; asynchronous command interface, no burst-length controlHigher density but higher latency (CAS latency ≥2), no deterministic DDR-II timing or echo clocksPrefer only if cost-per-bit dominates and system can absorb variable access timing and refresh overhead

Compared with IS61WV102436BLL-15BLI and MT48LC32M16A2P-75:C, CY7C1420JV18 delivers 80% higher effective bandwidth, deterministic 1.5-cycle latency, and built-in echo-clock deskew-critical for jitter-sensitive telecom and packet-processing systems where timing predictability outweighs raw density.

Availability

CY7C1420JV18 is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed packet switching, and industrial real-time control applications requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1420JV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

This device belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic, low-jitter, high-throughput memory interfacing in telecom and networking equipment where timing precision and signal integrity are critical.

FAQ

What is the function of the DOFF pin on CY7C1420JV18?

The DOFF pin is an active-LOW DLL disable control. When pulled HIGH, the internal Delay Lock Loop operates, enabling DDR-II timing with 1.5-cycle read latency at up to 300 MHz. When pulled LOW, the DLL is disabled and the device reverts to DDR-I timing with 1-cycle latency and a maximum frequency of 167 MHz. This provides runtime flexibility between performance and power/EMI trade-offs.

How does the ZQ pin affect output drive strength?

The ZQ pin connects to an external resistor (typically 240 Ω) to ground to calibrate the output driver impedance of DQ[35:0] and CQ/CQ pins to 0.2 × RQ (e.g., 48 Ω). This ensures consistent HSTL signal integrity across voltage and temperature variations. Leaving ZQ unconnected or tying it to GND violates specification and causes undefined output drive behavior.

Can CY7C1420JV18 operate with only K/K clocks, without C/C?

Yes. In single-clock-domain mode, the device uses K/K for both input capture and output data timing. Read data is driven on the rising edges of K/K instead of C/C, and CQ/CQ are generated relative to K/K. This simplifies board layout but reduces timing margin compared to dual-clock operation with dedicated C/C and echo clocks.

What is the purpose of BWS[3:0] signals in CY7C1420JV18?

BWS[3:0] are active-LOW byte write select signals controlling four independent 9-bit byte lanes within the 36-bit data bus. During a write, only bytes with asserted (LOW) BWS lines are updated; deselected bytes retain their prior values. This eliminates the need for read-modify-write cycles when updating sub-word fields like packet headers or control registers.

CY7C1420JV18-300BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1420JV18-300BZC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1420JV18-300BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1420JV18-300BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1420JV18-300BZC is usually 5 days.

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CY7C1420JV18-300BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1420JV18-300BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1420JV18-300BZC?

For technical support, including CY7C1420JV18-300BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1420JV18-300BZC requirements.

6.How does Aetrix verify that CY7C1420JV18-300BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1420JV18-300BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1420JV18-300BZC meets industry standards.

7.What is the process for return or replacement of CY7C1420JV18-300BZC?

All CY7C1420JV18-300BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1420JV18-300BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1420JV18-300BZC part is unused and in its original packaging.

Return procedure for CY7C1420JV18-300BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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