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Infineon Technologies CY7C1420KV18-250BZXI

Part No.:
CY7C1420KV18-250BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1420KV18-250BZXI.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,904

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Product details

Overview

CY7C1420KV18-250BZXI from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous DDR II SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, HSTL I/O, and echo clocks (CQ/CQ) for precise data capture in high-speed memory subsystems. It operates in DDR-II mode (1.5-cycle read latency when DOFF = HIGH) or DDR-I mode (1-cycle latency when DOFF = LOW), targeting network packet buffering and telecom line-card memory.

For engineers reviewing the CY7C1420KV18-250BZXI datasheet, CY7C1420KV18-250BZXI pinout, CY7C1420KV18-250BZXI application, or CY7C1420KV18-250BZXI equivalent, key selection criteria include burst depth (2×36-bit), dual-clock domain support (K/K and C/C), programmable output impedance via ZQ, JTAG 1149.1 test access, and FBGA-165 package compatibility with high-density PCB layouts.

Technical Context

The device implements a synchronous pipelined architecture with internal burst counter driven by A0, delivering two sequential 36-bit words per access. All address, control, and data inputs are registered on rising edges of K and K clocks, enabling deterministic timing at 250 MHz.

Read data is edge-aligned to C and C output clocks (or K/K in single-clock mode), while echo clocks CQ and CQ-phase-synchronized to C and C-eliminate board-level skew compensation. The integrated PLL ensures accurate data placement, and ZQ pin enables dynamic output impedance tuning to match 50 Ω system buses.

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 36 Mbit (1M × 36); supports 512K × 36 dual-array configuration for interleaved burst access
Max Clock Frequency 250 MHz K/K input clock; enables 500 MT/s effective data rate in DDR mode
Read Latency 1 cycle (DDR-I) when DOFF = LOW; 1.5 cycles (DDR-II) when DOFF = HIGH - selectable per system timing budget
I/O Voltage 1.8 V core; HSTL-compatible I/O with adjustable drive strength and 1.4–1.8 V VDDQ range
Output Impedance Control ZQ pin calibrates DQ/CQ output drivers to 0.2 × external RQ resistor (e.g., 25 Ω → 5 Ω driver impedance)
Package 165-ball FBGA (13 mm × 15 mm × 1.4 mm); RoHS-compliant, Pb-free option available
JTAG Support IEEE 1149.1 compliant TAP controller with boundary scan, instruction register, and IDCODE support

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 × 15 mm body, 0.8 mm ball pitch, 1.4 mm height, bottom-side thermal pad not electrically connected.

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data bus 36-bit DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges; tristated automatically on deselect
K / K Differential input clock pair Rising edges latch all synchronous inputs (A, R/W, LD, BWS); defines access initiation and write data capture timing
C / C Differential output clock pair Controls timing of read data output; used with CQ/CQ to deskew flight time across multiple SRAMs in parallel topology
CQ / CQ Output echo clocks Free-running clocks synchronized to C/C; provide receiver-side timing reference for source-synchronous data capture without external delay lines
DOFF Read latency mode select Active-HIGH enables DDR-II (1.5-cycle latency); active-LOW configures DDR-I (1-cycle latency) - sets internal pipeline depth
ZQ Output impedance calibration input Connects to external precision resistor (e.g., 24.9 Ω) to calibrate DQ/CQ driver strength; cannot be left floating or tied to GND
BWS[3:0] Byte write enable inputs Four active-LOW signals controlling 9-bit byte lanes (BWS0: D[8:0], BWS1: D[17:9], BWS2: D[26:18], BWS3: D[35:27])
LD Load strobe Active-LOW synchronizes address and R/W setup; initiates burst transaction on next K edge; required for all valid accesses

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling by 50% versus single-word SRAMs; cuts address trace count and routing congestion in high-pin-count designs
Programmable output impedance (ZQ) Enables on-die termination matching to PCB trace impedance without external resistors - improves signal integrity and reduces BOM cost
Integrated echo clocks (CQ/CQ) Eliminates need for external delay-locked loops (DLLs) or phase-locked loops (PLLs) at the controller side for DDR data capture
JTAG 1149.1 test access port Supports boundary scan testing, in-system programming verification, and production test coverage without additional test fixtures
Configurable DDR-I/DDR-II latency DOFF pin allows runtime selection between 1-cycle (low-latency control plane) and 1.5-cycle (higher bandwidth data plane) operation

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: High-throughput Layer 2/3 switching ASICs require low-latency, burst-capable memory for frame queuing and header processing.

IC Role / Device Role / Timing Role: DDR II SRAM serves as primary packet buffer with 250 MHz clock domain aligned to switch fabric timing.

Use Value: Two-word burst delivers 72 bits/cycle at 500 MT/s, reducing memory access overhead versus discrete SDR SRAMs and enabling deterministic jitter-free queuing.

Use Scenario: Enterprise routers use deep buffers to absorb traffic bursts during congestion without packet loss.

IC Role / Device Role / Timing Role: CY7C1420KV18 acts as synchronous burst memory interfaced directly to packet processor's DDR memory controller.

Use Value: Echo clocks (CQ/CQ) simplify timing closure at 500 MT/s, eliminating interconnect skew compensation logic in FPGA-based controllers.

Baseband Processing Units Industrial Real-Time Controllers

Use Scenario: LTE/5G baseband units perform channel coding/decoding requiring rapid access to intermediate data matrices.

IC Role / Device Role / Timing Role: SRAM provides scratchpad memory for turbo decoder kernels with strict 1.5-cycle latency constraints.

Use Value: DOFF-selectable latency allows optimization: DDR-II mode for throughput-critical decoding, DDR-I mode for control-path metadata lookups.

Use Scenario: Programmable logic controllers (PLCs) execute deterministic motion control loops requiring predictable memory access timing.

IC Role / Device Role / Timing Role: SRAM functions as deterministic-access work memory for real-time firmware executing on ARM Cortex-R cores.

Use Value: JTAG 1149.1 support enables in-field boundary scan diagnostics and firmware update validation without halting control execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C33618B-250BIN 36-Mbit (1M × 36), 250 MHz, 1.8 V, but uses SSTL-18 I/O instead of HSTL; no ZQ calibration or echo clocks Lacks CQ/CQ and ZQ; requires external termination and tighter layout-controlled timing margins Preferred where legacy SSTL-18 infrastructure exists and echo clock simplification is not required
IS45S32800J-25BLI 32-Mbit (1M × 32), 250 MHz, 1.8 V, DDR2 SDRAM (not SRAM); includes refresh circuitry and longer latency (CAS=3) Requires periodic refresh; higher density per pin but non-deterministic access due to bank conflicts and precharge penalties Selected when cost-per-bit is critical and system can tolerate refresh overhead and variable latency

Compared with AS7C33618B-250BIN and IS45S32800J-25BLI, CY7C1420KV18-250BZXI offers deterministic zero-refresh latency, on-die impedance tuning, and source-synchronous echo clocks - making it superior for hard real-time, jitter-sensitive, or high-reliability embedded memory subsystems.

Availability

CY7C1420KV18-250BZXI is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, baseband processing units, and industrial real-time controllers requiring stable component supply, long-lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C1420KV18-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1420KV18 belongs to Cypress's DDR II SRAM product line, designed specifically for deterministic, low-jitter, high-bandwidth memory interfacing in networking and telecom infrastructure where burst efficiency and timing predictability outweigh raw density.

FAQ

What is the function of the DOFF pin on CY7C1420KV18-250BZXI?

The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle read latency; when LOW, it configures DDR-I mode with 1-cycle latency. This setting determines internal pipeline depth and must be held stable during operation - it is not dynamically switchable mid-burst.

Can CY7C1420KV18-250BZXI operate without external C and C clocks?

Yes - the device supports single-clock mode where K and K serve as both input and output clocks. In this mode, read data is driven on K/K edges, and CQ/CQ are generated relative to K/K. However, echo clock benefits (skew cancellation) are lost, and system timing margin decreases significantly above 200 MHz.

How does ZQ calibration affect signal integrity in high-speed designs?

ZQ calibration adjusts the output driver impedance of DQ and CQ pins to match the PCB trace characteristic impedance (typically 50 Ω). Using a 24.9 Ω resistor on ZQ yields ~5 Ω driver impedance (0.2 × RQ), minimizing reflections and improving eye diagram opening - especially critical for clean 500 MT/s DDR signaling without external termination.

Is CY7C1420KV18-250BZXI pin-compatible with CY7C1418KV18-250BZXI?

No - although both share the same 165-ball FBGA package, their pinouts differ significantly: CY7C1418KV18 uses DQ[17:0] and BWS[1:0], while CY7C1420KV18 uses DQ[35:0] and BWS[3:0]. Address mapping also differs (21-bit vs. 20-bit), and BWS pin assignments are reorganized to support 36-bit byte lanes - direct replacement is not possible without PCB redesign.

CY7C1420KV18-250BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1420KV18-250BZXI FAQ

1.How can I place an order for CY7C1420KV18-250BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1420KV18-250BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1420KV18-250BZXI reliable?

The price and inventory of CY7C1420KV18-250BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1420KV18-250BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1420KV18-250BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1420KV18-250BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1420KV18-250BZXI?

CY7C1420KV18-250BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1420KV18-250BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1420KV18-250BZXI?

For technical support, including CY7C1420KV18-250BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1420KV18-250BZXI requirements.

6.How does Aetrix verify that CY7C1420KV18-250BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1420KV18-250BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1420KV18-250BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1420KV18-250BZXI?

All CY7C1420KV18-250BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1420KV18-250BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1420KV18-250BZXI part is unused and in its original packaging.

Return procedure for CY7C1420KV18-250BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1420KV18-250BZXI Tags

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