Infineon Technologies CY7C1420KV18-250BZXI
- Part No.:
- CY7C1420KV18-250BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1420KV18-250BZXI.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1420KV18-250BZXI from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous DDR II SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, HSTL I/O, and echo clocks (CQ/CQ) for precise data capture in high-speed memory subsystems. It operates in DDR-II mode (1.5-cycle read latency when DOFF = HIGH) or DDR-I mode (1-cycle latency when DOFF = LOW), targeting network packet buffering and telecom line-card memory.
For engineers reviewing the CY7C1420KV18-250BZXI datasheet, CY7C1420KV18-250BZXI pinout, CY7C1420KV18-250BZXI application, or CY7C1420KV18-250BZXI equivalent, key selection criteria include burst depth (2×36-bit), dual-clock domain support (K/K and C/C), programmable output impedance via ZQ, JTAG 1149.1 test access, and FBGA-165 package compatibility with high-density PCB layouts.
Technical Context
The device implements a synchronous pipelined architecture with internal burst counter driven by A0, delivering two sequential 36-bit words per access. All address, control, and data inputs are registered on rising edges of K and K clocks, enabling deterministic timing at 250 MHz.
Read data is edge-aligned to C and C output clocks (or K/K in single-clock mode), while echo clocks CQ and CQ-phase-synchronized to C and C-eliminate board-level skew compensation. The integrated PLL ensures accurate data placement, and ZQ pin enables dynamic output impedance tuning to match 50 Ω system buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 36 Mbit (1M × 36); supports 512K × 36 dual-array configuration for interleaved burst access |
| Max Clock Frequency | 250 MHz K/K input clock; enables 500 MT/s effective data rate in DDR mode |
| Read Latency | 1 cycle (DDR-I) when DOFF = LOW; 1.5 cycles (DDR-II) when DOFF = HIGH - selectable per system timing budget |
| I/O Voltage | 1.8 V core; HSTL-compatible I/O with adjustable drive strength and 1.4–1.8 V VDDQ range |
| Output Impedance Control | ZQ pin calibrates DQ/CQ output drivers to 0.2 × external RQ resistor (e.g., 25 Ω → 5 Ω driver impedance) |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm); RoHS-compliant, Pb-free option available |
| JTAG Support | IEEE 1149.1 compliant TAP controller with boundary scan, instruction register, and IDCODE support |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 × 15 mm body, 0.8 mm ball pitch, 1.4 mm height, bottom-side thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges; tristated automatically on deselect |
| K / K | Differential input clock pair | Rising edges latch all synchronous inputs (A, R/W, LD, BWS); defines access initiation and write data capture timing |
| C / C | Differential output clock pair | Controls timing of read data output; used with CQ/CQ to deskew flight time across multiple SRAMs in parallel topology |
| CQ / CQ | Output echo clocks | Free-running clocks synchronized to C/C; provide receiver-side timing reference for source-synchronous data capture without external delay lines |
| DOFF | Read latency mode select | Active-HIGH enables DDR-II (1.5-cycle latency); active-LOW configures DDR-I (1-cycle latency) - sets internal pipeline depth |
| ZQ | Output impedance calibration input | Connects to external precision resistor (e.g., 24.9 Ω) to calibrate DQ/CQ driver strength; cannot be left floating or tied to GND |
| BWS[3:0] | Byte write enable inputs | Four active-LOW signals controlling 9-bit byte lanes (BWS0: D[8:0], BWS1: D[17:9], BWS2: D[26:18], BWS3: D[35:27]) |
| LD | Load strobe | Active-LOW synchronizes address and R/W setup; initiates burst transaction on next K edge; required for all valid accesses |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus toggling by 50% versus single-word SRAMs; cuts address trace count and routing congestion in high-pin-count designs |
| Programmable output impedance (ZQ) | Enables on-die termination matching to PCB trace impedance without external resistors - improves signal integrity and reduces BOM cost |
| Integrated echo clocks (CQ/CQ) | Eliminates need for external delay-locked loops (DLLs) or phase-locked loops (PLLs) at the controller side for DDR data capture |
| JTAG 1149.1 test access port | Supports boundary scan testing, in-system programming verification, and production test coverage without additional test fixtures |
| Configurable DDR-I/DDR-II latency | DOFF pin allows runtime selection between 1-cycle (low-latency control plane) and 1.5-cycle (higher bandwidth data plane) operation |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: High-throughput Layer 2/3 switching ASICs require low-latency, burst-capable memory for frame queuing and header processing. IC Role / Device Role / Timing Role: DDR II SRAM serves as primary packet buffer with 250 MHz clock domain aligned to switch fabric timing. Use Value: Two-word burst delivers 72 bits/cycle at 500 MT/s, reducing memory access overhead versus discrete SDR SRAMs and enabling deterministic jitter-free queuing. |
Use Scenario: Enterprise routers use deep buffers to absorb traffic bursts during congestion without packet loss. IC Role / Device Role / Timing Role: CY7C1420KV18 acts as synchronous burst memory interfaced directly to packet processor's DDR memory controller. Use Value: Echo clocks (CQ/CQ) simplify timing closure at 500 MT/s, eliminating interconnect skew compensation logic in FPGA-based controllers. |
| Baseband Processing Units | Industrial Real-Time Controllers |
|
Use Scenario: LTE/5G baseband units perform channel coding/decoding requiring rapid access to intermediate data matrices. IC Role / Device Role / Timing Role: SRAM provides scratchpad memory for turbo decoder kernels with strict 1.5-cycle latency constraints. Use Value: DOFF-selectable latency allows optimization: DDR-II mode for throughput-critical decoding, DDR-I mode for control-path metadata lookups. |
Use Scenario: Programmable logic controllers (PLCs) execute deterministic motion control loops requiring predictable memory access timing. IC Role / Device Role / Timing Role: SRAM functions as deterministic-access work memory for real-time firmware executing on ARM Cortex-R cores. Use Value: JTAG 1149.1 support enables in-field boundary scan diagnostics and firmware update validation without halting control execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33618B-250BIN | 36-Mbit (1M × 36), 250 MHz, 1.8 V, but uses SSTL-18 I/O instead of HSTL; no ZQ calibration or echo clocks | Lacks CQ/CQ and ZQ; requires external termination and tighter layout-controlled timing margins | Preferred where legacy SSTL-18 infrastructure exists and echo clock simplification is not required |
| IS45S32800J-25BLI | 32-Mbit (1M × 32), 250 MHz, 1.8 V, DDR2 SDRAM (not SRAM); includes refresh circuitry and longer latency (CAS=3) | Requires periodic refresh; higher density per pin but non-deterministic access due to bank conflicts and precharge penalties | Selected when cost-per-bit is critical and system can tolerate refresh overhead and variable latency |
Compared with AS7C33618B-250BIN and IS45S32800J-25BLI, CY7C1420KV18-250BZXI offers deterministic zero-refresh latency, on-die impedance tuning, and source-synchronous echo clocks - making it superior for hard real-time, jitter-sensitive, or high-reliability embedded memory subsystems.
Availability
CY7C1420KV18-250BZXI is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, baseband processing units, and industrial real-time controllers requiring stable component supply, long-lifecycle support, and guaranteed Pb-free compliance.
Supply support for CY7C1420KV18-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1420KV18 belongs to Cypress's DDR II SRAM product line, designed specifically for deterministic, low-jitter, high-bandwidth memory interfacing in networking and telecom infrastructure where burst efficiency and timing predictability outweigh raw density.
FAQ
What is the function of the DOFF pin on CY7C1420KV18-250BZXI?
The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle read latency; when LOW, it configures DDR-I mode with 1-cycle latency. This setting determines internal pipeline depth and must be held stable during operation - it is not dynamically switchable mid-burst.
Can CY7C1420KV18-250BZXI operate without external C and C clocks?
Yes - the device supports single-clock mode where K and K serve as both input and output clocks. In this mode, read data is driven on K/K edges, and CQ/CQ are generated relative to K/K. However, echo clock benefits (skew cancellation) are lost, and system timing margin decreases significantly above 200 MHz.
How does ZQ calibration affect signal integrity in high-speed designs?
ZQ calibration adjusts the output driver impedance of DQ and CQ pins to match the PCB trace characteristic impedance (typically 50 Ω). Using a 24.9 Ω resistor on ZQ yields ~5 Ω driver impedance (0.2 × RQ), minimizing reflections and improving eye diagram opening - especially critical for clean 500 MT/s DDR signaling without external termination.
Is CY7C1420KV18-250BZXI pin-compatible with CY7C1418KV18-250BZXI?
No - although both share the same 165-ball FBGA package, their pinouts differ significantly: CY7C1418KV18 uses DQ[17:0] and BWS[1:0], while CY7C1420KV18 uses DQ[35:0] and BWS[3:0]. Address mapping also differs (21-bit vs. 20-bit), and BWS pin assignments are reorganized to support 36-bit byte lanes - direct replacement is not possible without PCB redesign.
CY7C1420KV18-250BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1420KV18-250BZXI FAQ
1.How can I place an order for CY7C1420KV18-250BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1420KV18-250BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1420KV18-250BZXI reliable?
The price and inventory of CY7C1420KV18-250BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1420KV18-250BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1420KV18-250BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1420KV18-250BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1420KV18-250BZXI?
CY7C1420KV18-250BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1420KV18-250BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1420KV18-250BZXI?
For technical support, including CY7C1420KV18-250BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1420KV18-250BZXI requirements.
6.How does Aetrix verify that CY7C1420KV18-250BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1420KV18-250BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1420KV18-250BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1420KV18-250BZXI?
All CY7C1420KV18-250BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1420KV18-250BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1420KV18-250BZXI part is unused and in its original packaging.
Return procedure for CY7C1420KV18-250BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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