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Infineon Technologies CY7C1423AV18-267BZC

Part No.:
CY7C1423AV18-267BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1423AV18-267BZC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,310

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Product details

Overview

CY7C1423AV18-267BZC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR-II Synchronous Pipelined SRAM with 300 MHz clock operation, 600 MHz effective data rate, and dual-port DDR-II SIO architecture supporting independent read/write data paths. It features echo clocks (CQ/CQ), DLL-based data alignment, and 1.8 V core with HSTL I/O for high-speed networking and packet buffering applications.

For engineers reviewing the CY7C1423AV18-267BZC datasheet, CY7C1423AV18-267BZC pinout, CY7C1423AV18-267BZC application, or CY7C1423AV18-267BZC equivalent, key selection criteria include burst depth (2-word), synchronous self-timed writes, variable-drive HSTL outputs, and 165-ball FBGA (15 × 17 × 1.4 mm) mechanical compatibility.

Technical Context

This SRAM implements a true separate I/O DDR architecture: read and write ports share the address bus but use independent data paths (D[17:0] inputs, Q[17:0] outputs), eliminating bus turnaround delay. Address latching occurs on alternate rising edges of K/K, enabling 2-word burst access per clock cycle.

Internal timing relies on a Delay Lock Loop (DLL) to align output data with echo clocks CQ/CQ, while synchronous writes are controlled by on-chip self-timed circuitry. All I/O uses HSTL-compatible signaling with programmable drive strength and expanded output voltage range (1.4 V to VDD).

Key Specifications

ParameterValue and Actual Design Meaning
Density & Organization36 Mbit / 2M × 18 configuration - supports 36-bit-wide data transfers in two 18-bit words per burst
Max Clock Frequency300 MHz - enables 600 MT/s effective throughput via double-data-rate transfers
I/O InterfaceDDR-II Separate I/O - eliminates bidirectional bus contention and turn-around latency
Core Voltage1.8 V ± 0.1 V - defines low-power, high-speed operation compatible with advanced logic families
Output StandardHSTL Class I - ensures impedance-matched, noise-immune signaling at 600 Mbps
Package165-ball FBGA (15 × 17 × 1.4 mm) - provides fine-pitch, thermally efficient mounting for dense PCB layouts
JTAG SupportIEEE 1149.1 compliant - enables boundary-scan testing without external test fixtures

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant, Pb-free option available.

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Synchronous write data inputLatched on rising edges of K/K; supports full 18-bit parallel writes per burst
Q[17:0]Synchronous read data outputDriven on rising edges of C/C (or K/K in single-clock mode); tri-stated when read port inactive
K, KInput clock pairUsed for address and write-data capture; differential timing enables precise DDR edge alignment
C, COutput clock pairDrives read data; minimizes skew between data and clock paths for reliable capture
CQ, CQEcho clock outputsReplicate C/C timing at receiver; simplify system-level data capture without board-level routing compensation
BWS[1:0]Byte write selectActive-low controls which 9-bit byte (D[8:0] or D[17:9]) is written; preserves unselected bytes
R/WRead/write direction controlSampled with LD to define transaction type; HIGH = read, LOW = write
LDLoad strobeActive-low initiates bus cycle; defines address and R/W state for subsequent burst operation

Key Features

FeatureDesign Value
2-word burst architectureReduces required address bus frequency by 50% versus single-word addressing - lowers controller complexity and PCB routing density
Separate I/O DDR interfaceEliminates data bus turn-around delay entirely - enables continuous back-to-back read/write operations without dead cycles
Delay Lock Loop (DLL)Aligns output data edges to CQ/CQ within ±50 ps - removes need for manual PCB trace length matching in high-speed designs
Variable-drive HSTL outputsAdjustable drive strength compensates for varying load capacitance - maintains signal integrity across diverse board stackups
Programmable ZQ calibrationOn-die impedance tuning via external 240 Ω resistor - ensures consistent HSTL termination across voltage/temperature variation

Applications

Telecom Packet BufferingHigh-Speed Test Equipment Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards with strict latency budgets.

IC Role / Device Role / Timing Role: Dedicated 2M×18 DDR-II SRAM serving as zero-wait-state packet buffer with deterministic 300 MHz access timing.

Use Value: 2-word burst + separate I/O enables concurrent ingress/egress packet handling without arbitration delay - improves switch fabric throughput by ≥15% vs. common-I/O SRAM.

Use Scenario: Capturing high-resolution waveform samples at >500 MS/s in automated test systems.

IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to ADC/DAC controllers using echo-clocked DDR reads/writes.

Use Value: CQ/CQ echo clocks eliminate interconnect skew - allows reliable 600 MT/s data capture without custom FPGA timing closure effort.

Industrial Motion Controller FIFOAvionics Data Acquisition Buffer

Use Scenario: Real-time buffering of multi-axis position commands and sensor feedback in CNC and robotics drives.

IC Role / Device Role / Timing Role: Deterministic-latency FIFO between motion processor and servo interface ASIC, operating at 300 MHz with self-timed writes.

Use Value: Synchronous self-timed writes guarantee write completion within fixed 2-cycle window - enables jitter-free command scheduling critical for sub-micron positioning.

Use Scenario: Temporary storage of high-fidelity sensor telemetry (IMU, pressure, temp) prior to ARINC-429 or AFDX transmission.

IC Role / Device Role / Timing Role: Radiation-tolerant-capable buffer (via package and process) with JTAG boundary scan for in-system verification.

Use Value: IEEE 1149.1 support enables post-deployment fault isolation without physical probe access - reduces avionics maintenance downtime by ~40%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C33618A-20BIN20 ns async access time; no DDR, no echo clocks; 3.3 V core; 165-BGALower bandwidth (≤200 MHz effective), no burst or DLL - suitable only for non-pipelined, latency-insensitive bufferingSelect only if system lacks DDR clock infrastructure and requires simpler timing model.
IS61WV102418BLL-10BLI10 ns async access; 1.8 V core; no DDR, no burst; 119-BGANo pipelining or clocked interface - limits max sustained throughput to ~100 MB/s vs. 1.08 GB/s for CY7C1423AV18Choose only for cost-sensitive, low-throughput applications where DDR complexity is unjustified.

Compared with AS7C33618A-20BIN and IS61WV102418BLL-10BLI, the CY7C1423AV18-267BZC delivers 10× higher effective bandwidth and deterministic DDR timing - essential for real-time packet processing and high-speed test instrumentation where latency predictability outweighs BOM cost savings.

Availability

CY7C1423AV18-267BZC is available at Aetrix Electronics and suitable for telecom packet buffering, high-speed test equipment memory, industrial motion controller FIFO, and avionics data acquisition buffer applications requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1423AV18-267BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The CY7C142xAV18 family was designed specifically for high-throughput, low-latency buffering in DDR-controlled systems - targeting network switches, protocol analyzers, and real-time control where burst efficiency and clock-aligned data capture are mandatory.

FAQ

What is the meaning of "267" in CY7C1423AV18-267BZC?

The "267" suffix denotes the maximum guaranteed access speed grade: 267 MHz clock frequency (3.75 ns period), corresponding to the -267 speed bin defined in the datasheet. This rating ensures all AC timing parameters - including tKQ (clock-to-output delay) and tKHK (clock hold time) - meet specification at 267 MHz under worst-case voltage and temperature conditions.

Does CY7C1423AV18-267BZC require external termination resistors?

Yes - HSTL Class I outputs require 25 Ω series source termination at the driver (SRAM side) and 50 Ω parallel termination to VTT (1.5 V) at the receiver. The ZQ pin enables on-die calibration of output driver impedance against an external 240 Ω reference resistor, but board-level termination remains mandatory for signal integrity at 600 MT/s.

Can CY7C1423AV18-267BZC operate in single-clock mode?

Yes - when C and C are not used, the device defaults to single-clock mode using K and K for both address/data capture and output timing. In this mode, read data is driven on rising edges of K/K, and echo clocks CQ/CQ are disabled. Setup/hold margins tighten, limiting max usable frequency to ~200 MHz instead of 267 MHz.

Is JTAG boundary scan functional during normal SRAM operation?

Yes - the IEEE 1149.1 TAP controller operates independently of memory function. Boundary scan can be executed at any time without disrupting active read/write operations, provided TMS, TCK, TDI, and TDO pins are not otherwise asserted by the host system. Scan testing does not affect stored data or timing behavior.

CY7C1423AV18-267BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
267 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1423AV18-267BZC FAQ

1.How can I place an order for CY7C1423AV18-267BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1423AV18-267BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1423AV18-267BZC reliable?

The price and inventory of CY7C1423AV18-267BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1423AV18-267BZC is usually 5 days.

3.What payment methods are accepted for CY7C1423AV18-267BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1423AV18-267BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1423AV18-267BZC?

CY7C1423AV18-267BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1423AV18-267BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1423AV18-267BZC?

For technical support, including CY7C1423AV18-267BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1423AV18-267BZC requirements.

6.How does Aetrix verify that CY7C1423AV18-267BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1423AV18-267BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1423AV18-267BZC meets industry standards.

7.What is the process for return or replacement of CY7C1423AV18-267BZC?

All CY7C1423AV18-267BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1423AV18-267BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1423AV18-267BZC part is unused and in its original packaging.

Return procedure for CY7C1423AV18-267BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1423AV18-267BZC Tags

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