Infineon Technologies CY7C1423AV18-267BZC
- Part No.:
- CY7C1423AV18-267BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1423AV18-267BZC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,310
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Product details
Overview
CY7C1423AV18-267BZC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR-II Synchronous Pipelined SRAM with 300 MHz clock operation, 600 MHz effective data rate, and dual-port DDR-II SIO architecture supporting independent read/write data paths. It features echo clocks (CQ/CQ), DLL-based data alignment, and 1.8 V core with HSTL I/O for high-speed networking and packet buffering applications.
For engineers reviewing the CY7C1423AV18-267BZC datasheet, CY7C1423AV18-267BZC pinout, CY7C1423AV18-267BZC application, or CY7C1423AV18-267BZC equivalent, key selection criteria include burst depth (2-word), synchronous self-timed writes, variable-drive HSTL outputs, and 165-ball FBGA (15 × 17 × 1.4 mm) mechanical compatibility.
Technical Context
This SRAM implements a true separate I/O DDR architecture: read and write ports share the address bus but use independent data paths (D[17:0] inputs, Q[17:0] outputs), eliminating bus turnaround delay. Address latching occurs on alternate rising edges of K/K, enabling 2-word burst access per clock cycle.
Internal timing relies on a Delay Lock Loop (DLL) to align output data with echo clocks CQ/CQ, while synchronous writes are controlled by on-chip self-timed circuitry. All I/O uses HSTL-compatible signaling with programmable drive strength and expanded output voltage range (1.4 V to VDD).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 36 Mbit / 2M × 18 configuration - supports 36-bit-wide data transfers in two 18-bit words per burst |
| Max Clock Frequency | 300 MHz - enables 600 MT/s effective throughput via double-data-rate transfers |
| I/O Interface | DDR-II Separate I/O - eliminates bidirectional bus contention and turn-around latency |
| Core Voltage | 1.8 V ± 0.1 V - defines low-power, high-speed operation compatible with advanced logic families |
| Output Standard | HSTL Class I - ensures impedance-matched, noise-immune signaling at 600 Mbps |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - provides fine-pitch, thermally efficient mounting for dense PCB layouts |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testing without external test fixtures |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant, Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; supports full 18-bit parallel writes per burst |
| Q[17:0] | Synchronous read data output | Driven on rising edges of C/C (or K/K in single-clock mode); tri-stated when read port inactive |
| K, K | Input clock pair | Used for address and write-data capture; differential timing enables precise DDR edge alignment |
| C, C | Output clock pair | Drives read data; minimizes skew between data and clock paths for reliable capture |
| CQ, CQ | Echo clock outputs | Replicate C/C timing at receiver; simplify system-level data capture without board-level routing compensation |
| BWS[1:0] | Byte write select | Active-low controls which 9-bit byte (D[8:0] or D[17:9]) is written; preserves unselected bytes |
| R/W | Read/write direction control | Sampled with LD to define transaction type; HIGH = read, LOW = write |
| LD | Load strobe | Active-low initiates bus cycle; defines address and R/W state for subsequent burst operation |
Key Features
| Feature | Design Value |
|---|---|
| 2-word burst architecture | Reduces required address bus frequency by 50% versus single-word addressing - lowers controller complexity and PCB routing density |
| Separate I/O DDR interface | Eliminates data bus turn-around delay entirely - enables continuous back-to-back read/write operations without dead cycles |
| Delay Lock Loop (DLL) | Aligns output data edges to CQ/CQ within ±50 ps - removes need for manual PCB trace length matching in high-speed designs |
| Variable-drive HSTL outputs | Adjustable drive strength compensates for varying load capacitance - maintains signal integrity across diverse board stackups |
| Programmable ZQ calibration | On-die impedance tuning via external 240 Ω resistor - ensures consistent HSTL termination across voltage/temperature variation |
Applications
| Telecom Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dedicated 2M×18 DDR-II SRAM serving as zero-wait-state packet buffer with deterministic 300 MHz access timing. Use Value: 2-word burst + separate I/O enables concurrent ingress/egress packet handling without arbitration delay - improves switch fabric throughput by ≥15% vs. common-I/O SRAM. | Use Scenario: Capturing high-resolution waveform samples at >500 MS/s in automated test systems. IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to ADC/DAC controllers using echo-clocked DDR reads/writes. Use Value: CQ/CQ echo clocks eliminate interconnect skew - allows reliable 600 MT/s data capture without custom FPGA timing closure effort. |
| Industrial Motion Controller FIFO | Avionics Data Acquisition Buffer |
Use Scenario: Real-time buffering of multi-axis position commands and sensor feedback in CNC and robotics drives. IC Role / Device Role / Timing Role: Deterministic-latency FIFO between motion processor and servo interface ASIC, operating at 300 MHz with self-timed writes. Use Value: Synchronous self-timed writes guarantee write completion within fixed 2-cycle window - enables jitter-free command scheduling critical for sub-micron positioning. | Use Scenario: Temporary storage of high-fidelity sensor telemetry (IMU, pressure, temp) prior to ARINC-429 or AFDX transmission. IC Role / Device Role / Timing Role: Radiation-tolerant-capable buffer (via package and process) with JTAG boundary scan for in-system verification. Use Value: IEEE 1149.1 support enables post-deployment fault isolation without physical probe access - reduces avionics maintenance downtime by ~40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33618A-20BIN | 20 ns async access time; no DDR, no echo clocks; 3.3 V core; 165-BGA | Lower bandwidth (≤200 MHz effective), no burst or DLL - suitable only for non-pipelined, latency-insensitive buffering | Select only if system lacks DDR clock infrastructure and requires simpler timing model. |
| IS61WV102418BLL-10BLI | 10 ns async access; 1.8 V core; no DDR, no burst; 119-BGA | No pipelining or clocked interface - limits max sustained throughput to ~100 MB/s vs. 1.08 GB/s for CY7C1423AV18 | Choose only for cost-sensitive, low-throughput applications where DDR complexity is unjustified. |
Compared with AS7C33618A-20BIN and IS61WV102418BLL-10BLI, the CY7C1423AV18-267BZC delivers 10× higher effective bandwidth and deterministic DDR timing - essential for real-time packet processing and high-speed test instrumentation where latency predictability outweighs BOM cost savings.
Availability
CY7C1423AV18-267BZC is available at Aetrix Electronics and suitable for telecom packet buffering, high-speed test equipment memory, industrial motion controller FIFO, and avionics data acquisition buffer applications requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1423AV18-267BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C142xAV18 family was designed specifically for high-throughput, low-latency buffering in DDR-controlled systems - targeting network switches, protocol analyzers, and real-time control where burst efficiency and clock-aligned data capture are mandatory.
FAQ
What is the meaning of "267" in CY7C1423AV18-267BZC?
The "267" suffix denotes the maximum guaranteed access speed grade: 267 MHz clock frequency (3.75 ns period), corresponding to the -267 speed bin defined in the datasheet. This rating ensures all AC timing parameters - including tKQ (clock-to-output delay) and tKHK (clock hold time) - meet specification at 267 MHz under worst-case voltage and temperature conditions.
Does CY7C1423AV18-267BZC require external termination resistors?
Yes - HSTL Class I outputs require 25 Ω series source termination at the driver (SRAM side) and 50 Ω parallel termination to VTT (1.5 V) at the receiver. The ZQ pin enables on-die calibration of output driver impedance against an external 240 Ω reference resistor, but board-level termination remains mandatory for signal integrity at 600 MT/s.
Can CY7C1423AV18-267BZC operate in single-clock mode?
Yes - when C and C are not used, the device defaults to single-clock mode using K and K for both address/data capture and output timing. In this mode, read data is driven on rising edges of K/K, and echo clocks CQ/CQ are disabled. Setup/hold margins tighten, limiting max usable frequency to ~200 MHz instead of 267 MHz.
Is JTAG boundary scan functional during normal SRAM operation?
Yes - the IEEE 1149.1 TAP controller operates independently of memory function. Boundary scan can be executed at any time without disrupting active read/write operations, provided TMS, TCK, TDI, and TDO pins are not otherwise asserted by the host system. Scan testing does not affect stored data or timing behavior.
CY7C1423AV18-267BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 267 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1423AV18-267BZC FAQ
1.How can I place an order for CY7C1423AV18-267BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1423AV18-267BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1423AV18-267BZC reliable?
The price and inventory of CY7C1423AV18-267BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1423AV18-267BZC is usually 5 days.
3.What payment methods are accepted for CY7C1423AV18-267BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1423AV18-267BZC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1423AV18-267BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1423AV18-267BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1423AV18-267BZC?
For technical support, including CY7C1423AV18-267BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1423AV18-267BZC requirements.
6.How does Aetrix verify that CY7C1423AV18-267BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1423AV18-267BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1423AV18-267BZC meets industry standards.
7.What is the process for return or replacement of CY7C1423AV18-267BZC?
All CY7C1423AV18-267BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1423AV18-267BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1423AV18-267BZC part is unused and in its original packaging.
Return procedure for CY7C1423AV18-267BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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