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Infineon Technologies CY7C1423KV18-250BZXC

Part No.:
CY7C1423KV18-250BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1423KV18-250BZXC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,795

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Product details

Overview

CY7C1423KV18-250BZXC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR II synchronous SRAM with separate I/O architecture, 250 MHz maximum operating frequency, 1.8 V core supply, and HSTL-compatible 18-bit bidirectional data interface. It delivers 900 MB/s peak bandwidth via two-word burst reads/writes and supports configurable 1-cycle (DOFF = LOW) or 1.5-cycle (DOFF = HIGH) read latency for high-speed packet buffering in network line cards.

For engineers reviewing the CY7C1423KV18-250BZXC datasheet, CY7C1423KV18-250BZXC pinout, CY7C1423KV18-250BZXC application, or CY7C1423KV18-250BZXC equivalent, key selection criteria include DDR II SIO timing compliance, echo clock (CQ/CQ) synchronization capability, dual-clock domain support (K/K and C/C), and FBGA-165 package thermal/mechanical constraints for multi-chip memory subsystems.

Technical Context

This SRAM implements a pipelined, synchronous burst architecture with physically separated read and write ports-eliminating bus turnaround delays. It uses rising edges of complementary K/K clocks to latch addresses and write data, and rising edges of C/C clocks to drive read data with echo clocks CQ/CQ aligned to output timing.

The device integrates a PLL for precise data placement, supports programmable output impedance via ZQ calibration, and provides byte-write select (BWS0/BWS1) for partial-word writes without disturbing adjacent bytes. Its 1.5-cycle read latency mode enables tighter system-level timing closure in high-frequency DDR II memory interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
Density 36 Mbit (2M × 18 configuration)
Max Clock Frequency 250 MHz - defines maximum sustained burst throughput of 900 MB/s (2 × 18-bit × 250 MHz)
Read Latency 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts controller pipeline depth and FIFO sizing
Supply Voltage 1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ) - enables interoperability with 1.5 V and 1.8 V HSTL systems
Package 165-ball FBGA (13 × 15 × 1.4 mm) - supports high-density routing and thermal dissipation in telecom PCBs
Interface Standard DDR II SIO (Separate I/O) - eliminates bidirectional bus contention and simplifies signal integrity layout
Output Impedance Control ZQ pin calibrates Q[17:0], CQ, CQ to 0.2 × RQ - ensures matched trace termination across memory channel

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous data input Latched on rising edges of both K and K; supports full 18-bit parallel writes per burst
Q[17:0] Synchronous data output Driven on rising edges of C/C (or K/K in single-clock mode); synchronized to echo clocks CQ/CQ
K / K Complementary input clocks Control all synchronous inputs (address, R/W, LD, BWS); define burst initiation and write capture timing
C / C Complementary output clocks Gate read data output timing; enable flight-time deskewing across multiple SRAMs in parallel channels
CQ / CQ Echo clocks Free-running, phase-aligned copies of C/C; simplify source-synchronous data capture at controller side
DOFF Read latency mode select HIGH → 1.5-cycle latency; LOW → 1-cycle latency; determines controller's read-data sampling window
ZQ Output impedance calibration reference Connect to external resistor to ground to set output driver strength matching PCB trace impedance
R/W Read/write direction control Sampled with LD on K edge; HIGH = read, LOW = write - defines port activation per burst cycle
LD Load strobe Active-LOW; initiates address capture and transaction start on next K edge - defines burst boundary
BWS0 / BWS1 Byte write selects Active-LOW; BWS0 controls D[8:0], BWS1 controls D[17:9] - enables partial-word updates without read-modify-write

Key Features

Feature Design Value
DDR II Separate I/O Architecture Eliminates data bus turnaround delay and allows concurrent read/write arbitration in ping-pong buffer designs
Two-Word Burst Transfer Reduces effective address bus toggling rate by 2× versus single-word access - lowers EMI and routing congestion
Programmable Output Drive Strength ZQ-calibrated HSTL outputs ensure consistent signal rise/fall times and reduce timing skew across 18-bit data bus
Configurable Read Latency 1-cycle (DDR I mode) or 1.5-cycle (DDR II mode) selection via DOFF pin - adapts to controller timing margin constraints
JTAG 1149.1 Test Access Port Enables boundary scan testing and in-system diagnostics without requiring additional test pads or probes

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as dual-port FIFO buffer with independent read/write bursts.

Use Value: 900 MB/s throughput and 1.5-cycle latency mode enable deterministic frame queuing under 10 Gbps line rates.

Use Scenario: Holding protocol headers and payload fragments in optical transport equipment (OTN, SONET).

IC Role / Device Role / Timing Role: DDR II SIO SRAM providing jitter-tolerant, echo-clocked data capture synchronized to line-rate clocks.

Use Value: CQ/CQ echo clocks eliminate setup/hold violations at 250 MHz, reducing controller timing closure effort.

Baseband Processing Buffer Industrial Real-Time Controller Cache

Use Scenario: Temporary storage of IQ samples between ADC/DAC stages and DSP engines in wireless base stations.

IC Role / Device Role / Timing Role: Pipelined burst SRAM interfacing with FPGA-based digital front-end logic using HSTL signaling.

Use Value: Variable-drive HSTL outputs match 50 Ω PCB traces, minimizing reflections and bit-error rate in RF subsystems.

Use Scenario: Fast-access scratchpad memory for motion control algorithms executing on real-time microcontrollers.

IC Role / Device Role / Timing Role: Low-latency SRAM serving as deterministic instruction/data cache with guaranteed 1-cycle read response.

Use Value: DOFF = LOW configures 1-cycle latency mode, enabling tight loop timing for sub-microsecond servo update cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102418BLL-10BLI 1024K × 18, 10 ns async access, no DDR II interface or echo clocks Used in legacy control-plane buffers where burst bandwidth is secondary to simplicity and cost Select when system lacks DDR timing infrastructure but requires same density and voltage compatibility
Micron MT46H32M18LFBF-6 IT 32M × 18 DDR2 SDRAM, 333 MHz, requires refresh, higher latency, different command protocol Deployed in larger memory pools where capacity > bandwidth and controller supports DRAM command sets Select only if existing DDR2 controller IP can be reused and system tolerates refresh overhead and longer access latency

Compared with IS61WV102418BLL-10BLI and MT46H32M18LFBF-6 IT, CY7C1423KV18-250BZXC uniquely delivers true DDR II SIO operation with echo clocks and zero-refresh deterministic latency-critical for time-sensitive packet buffering and real-time control loops.

Availability

CY7C1423KV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and industrial real-time controller cache applications requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1423KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1423KV18 belongs to Cypress's DDR II SIO SRAM product line, engineered specifically for deterministic, high-throughput memory subsystems in networking and telecom infrastructure where bus turnaround elimination and echo-clock synchronization are essential.

FAQ

What is the function of the DOFF pin on CY7C1423KV18-250BZXC?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle DDR II read latency; when LOW, it reverts to 1-cycle DDR I behavior. This setting directly affects the number of clock cycles between address assertion and valid data on Q[17:0], and must be stable before initialization completes.

Can CY7C1423KV18-250BZXC operate with only K and K clocks, without C and C?

Yes - in single-clock mode, the device uses K and K to clock both input and output registers. In this configuration, C and C pins are unused, and read data is driven on rising edges of K/K instead of C/C. Echo clocks CQ/CQ remain functional and track K/K timing in this mode.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external precision resistor (typically 240 Ω) to ground, enabling on-die calibration of output driver impedance for Q[17:0], CQ, and CQ pins. This ensures consistent 50 Ω output impedance matching to PCB traces, reducing reflections, overshoot, and timing jitter across the entire 18-bit data bus.

Is CY7C1423KV18-250BZXC compatible with standard DDR2 SDRAM controllers?

No - it is not compatible. CY7C1423KV18-250BZXC is a synchronous SRAM with DDR II SIO interface and no refresh, command decoding, or bank architecture. It requires a dedicated controller supporting burst load (LD), dual-clock domains (K/K and C/C), and echo-clock capture - unlike DDR2 SDRAM's JEDEC-compliant command protocol.

CY7C1423KV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1423KV18-250BZXC FAQ

1.How can I place an order for CY7C1423KV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1423KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1423KV18-250BZXC reliable?

The price and inventory of CY7C1423KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1423KV18-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1423KV18-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1423KV18-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1423KV18-250BZXC?

CY7C1423KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1423KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1423KV18-250BZXC?

For technical support, including CY7C1423KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1423KV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1423KV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1423KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1423KV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1423KV18-250BZXC?

All CY7C1423KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1423KV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1423KV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1423KV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1423KV18-250BZXC Tags

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