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Infineon Technologies CY7C1425AV18-167BZXC

Part No.:
CY7C1425AV18-167BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1425AV18-167BZXC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,425

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Product details

Overview

CY7C1425AV18-167BZXC from Cypress Semiconductor is a 4M × 9 (36-Mbit) QDR-II™ SRAM with independent read/write ports, 167 MHz maximum clock frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent 2-word burst transfers at 334 MT/s per port using DDR interfaces on both K/K and C/C clock domains, targeting high-bandwidth packet buffering in network line cards.

For engineers reviewing the CY7C1425AV18-167BZXC datasheet, CY7C1425AV18-167BZXC pinout, CY7C1425AV18-167BZXC application, or CY7C1425AV18-167BZXC equivalent, key selection criteria include its 9-bit data width, 165-ball FBGA package, HSTL-compatible I/Os, DLL-controlled timing accuracy, and support for depth expansion via WPS/RPS and BWS0 control.

Technical Context

The device implements a synchronous pipelined QDR-II architecture with physically separate read and write data paths, eliminating bus turnaround delays. Address latching occurs on rising edges of dedicated K (read) and K (write) clocks, while output data is synchronized to C/C echo clocks to minimize skew across high-speed PCB traces.

Internally, it uses a dual 2M × 9 memory array with on-chip self-timed write circuitry and a Delay Lock Loop (DLL) for precise 500 Mbps DDR edge placement. All synchronous inputs pass through registers clocked by K/K, and all outputs are registered to C/C, ensuring deterministic setup/hold timing at 167 MHz operation.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4M × 9 = 36 Mbit; supports 2-word burst reads/writes per access cycle
Max Clock Frequency167 MHz; enables 334 million transfers per second (MT/s) on each port
Core Supply VoltageVDD = 1.8 V ± 0.1 V; defines minimum power delivery requirement for internal logic
I/O Supply RangeVDDQ = 1.4 V to 1.8 V; sets HSTL Class I output drive strength and input threshold
Package165-ball FBGA (15 × 17 × 1.4 mm); provides 0.8 mm ball pitch for high-density routing
Data InterfaceDouble Data Rate (DDR) on both read and write ports; transfers data on both rising edges of K/K and C/C
Timing ControlIntegrated DLL; locks output data phase to C/C clocks for sub-nanosecond jitter tolerance

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant lead-free finish (BZXC suffix).

Pin/TerminalCircuit RoleDesign Meaning
D[8:0]Synchronous write data input9-bit parallel data sampled on rising edge of K clock; supports byte-level write masking via BWS0
Q[8:0]Synchronous read data output9-bit parallel data driven on rising edges of C and C clocks; tri-stated when RPS is deasserted
RPSRead port selectActive-low signal latched on rising edge of K; initiates 2-word burst read if asserted
WPSWrite port selectActive-low signal latched on rising edge of K; enables write to D[8:0] and BWS0 when asserted
BWS0Byte write selectActive-low mask controlling all 9 bits of D[8:0]; ignored if WPS is deasserted
K, KInput clocksDifferential pair for address/control/data capture; rising edges define all synchronous input timing references
C, COutput clocksDifferential pair for read data strobing; used with CQ/CQ to deskew flight time mismatches
CQ, CQEcho clocksFree-running outputs synchronized to C/C; simplify source-synchronous capture at controller side
ZQImpedance calibrationConnects to external 240 Ω resistor to GND; tunes HSTL driver output impedance to match 50 Ω trace
VREFReference voltageStatic 0.9 V reference for HSTL input receivers and AC measurement points

Key Features

FeatureDesign Value
Independent read/write portsEliminates bus turnaround delay; enables full-duplex memory access without arbitration overhead
2-word burst architectureDelivers two consecutive 9-bit words per access cycle, doubling effective bandwidth over single-word devices
HSTL Class I I/O buffersSupports 1.4–1.8 V VDDQ operation with programmable drive strength and matched impedance via ZQ
JTAG 1149.1 test accessEnables boundary-scan testing of interconnects in dense FPGA/SOC-based systems without physical probe access
Delay Lock Loop (DLL)Compensates for process/voltage/temperature variation to maintain < ±50 ps data-to-clock skew at 167 MHz

Applications

High-Speed Packet BufferingNetwork Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/40G Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as first-level buffer between SERDES PHY and traffic manager ASIC.

Use Value: Concurrent read/write eliminates arbitration latency; 334 MT/s throughput sustains full line-rate packet processing at OC-192.

Use Scenario: Holding forwarding table entries and queue state in modular chassis-based switches.

IC Role / Device Role / Timing Role: Shared memory resource accessed simultaneously by multiple ingress and egress pipeline stages.

Use Value: Independent ports allow simultaneous lookup and update operations; DLL ensures timing closure across multi-inch backplane traces.

Baseband Processing MemoryFPGA Co-Processor Cache

Use Scenario: Temporary storage of FFT coefficients and channel estimation results in LTE/LTE-A baseband units.

IC Role / Device Role / Timing Role: Burst-access memory interfaced directly to DSP cores via high-speed parallel bus.

Use Value: 2-word burst reduces address bus toggling; 1.8 V core lowers dynamic power vs. 3.3 V QDR-I alternatives.

Use Scenario: Off-chip cache for soft-core processors (e.g., MicroBlaze) implementing real-time control algorithms.

IC Role / Device Role / Timing Role: Low-latency memory extension synchronized to FPGA fabric clock domain.

Use Value: C/C echo clocks enable reliable source-synchronous capture in FPGA I/O banks; 165-ball FBGA fits standard FPGA carrier layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1425AV18-200BZXC200 MHz max clock (vs. 167 MHz); higher current draw (870 mA vs. 740 mA)Requires tighter timing margins and enhanced power delivery; suitable only where system clock exceeds 167 MHzSelect only if design requires >167 MHz sustained bandwidth and can accommodate increased thermal load
AS7C336818A-167BINSame 4M × 9 density and 167 MHz rating but uses SSTL-18 I/O (not HSTL); no DLL or echo clocksLacks CQ/CQ deskew capability and DLL-based timing compensation; limited to shorter trace lengthsChoose only for cost-sensitive designs where board layout allows direct routing without flight-time matching

Compared with CY7C1425AV18-200BZXC, this part trades peak bandwidth for lower power and relaxed timing; compared with AS7C336818A-167BIN, it provides superior signal integrity via HSTL I/O, DLL, and echo clocks-critical for >10 cm trace lengths in telecom infrastructure.

Availability

CY7C1425AV18-167BZXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, baseband processing memory, and FPGA co-processor cache applications requiring stable component supply across extended production lifecycles.

Supply support for CY7C1425AV18-167BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with headquarters in San Jose, CA.

This device belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switched infrastructure equipment operating at OC-192 and beyond.

FAQ

What is the function of the ZQ pin on CY7C1425AV18-167BZXC?

The ZQ pin is an output impedance calibration input that connects to a 240 Ω resistor to ground. It adjusts the HSTL driver output impedance to match 50 Ω transmission lines, ensuring signal integrity across high-speed PCB traces. Leaving ZQ unconnected or tying it to GND violates the specification and causes undefined drive strength.

Can CY7C1425AV18-167BZXC operate with only a single clock domain?

Yes-it supports single-clock mode where K and C are tied together, and K and C are tied together. In this configuration, data is clocked out on K/K edges instead of C/C, simplifying clock tree design at the cost of reduced flight-time deskew capability. The DLL remains active and aligns output timing to the combined clock.

How does the BWS0 signal differ from NWS signals in other QDR-II parts?

BWS0 is a single active-low byte write select controlling all 9 bits of D[8:0]. Unlike NWS0/NWS1 in x8 devices (which mask nibbles), BWS0 provides coarse-grained 9-bit write enable-no partial-byte masking is supported. It is sampled synchronously with D[8:0] on the rising edge of K during write operations.

Is the DOFF pin required to be connected in normal operation?

No-DOFF is an optional DLL disable input. When left unconnected or pulled HIGH, the DLL operates normally. Only connect DOFF to GND if system-level timing analysis confirms DLL-free operation meets setup/hold requirements; doing so invalidates all DLL-dependent AC timing parameters in the datasheet.

CY7C1425AV18-167BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
4M x 9
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1425AV18-167BZXC FAQ

1.How can I place an order for CY7C1425AV18-167BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1425AV18-167BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1425AV18-167BZXC reliable?

The price and inventory of CY7C1425AV18-167BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1425AV18-167BZXC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1425AV18-167BZXC transactions.

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CY7C1425AV18-167BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1425AV18-167BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1425AV18-167BZXC?

For technical support, including CY7C1425AV18-167BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1425AV18-167BZXC requirements.

6.How does Aetrix verify that CY7C1425AV18-167BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1425AV18-167BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1425AV18-167BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1425AV18-167BZXC?

All CY7C1425AV18-167BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1425AV18-167BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1425AV18-167BZXC part is unused and in its original packaging.

Return procedure for CY7C1425AV18-167BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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