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Infineon Technologies CY7C1425KV18-250BZC

Part No.:
CY7C1425KV18-250BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1425KV18-250BZC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,309

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Product details

Overview

CY7C1425KV18 from Cypress Semiconductor is a 36-Mbit QDR® II SRAM with 4M × 9 organization, 333 MHz clock frequency (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, two-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers and baseband processing.

For engineers reviewing the CY7C1425KV18 datasheet, CY7C1425KV18 pinout, CY7C1425KV18 application, or CY7C1425KV18 equivalent, key selection criteria include concurrent read/write bandwidth, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, HSTL-18-compatible output drive, JTAG 1149.1 testability, and FBGA-165 package compatibility with high-density memory subsystems.

Technical Context

The CY7C1425KV18 implements a synchronous pipelined QDR II architecture with independent read and write ports sharing a multiplexed 21-bit address bus. All accesses are edge-triggered on K/K clocks, and data is latched on rising edges only-no internal phase shifting.

It uses a PLL to align echo clocks (CQ/CQ) with output clocks (C/C), enabling precise timing closure at 666 MHz DDR. Read latency is configurable via DOFF: 1.5 cycles (DOFF = HIGH) for maximum throughput or 1 cycle (DOFF = LOW) for QDR I compatibility.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (4M × 9 configuration)
Max Clock Frequency333 MHz - enables 666 MT/s DDR data rate per port
Read LatencyConfigurable: 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW)
Supply VoltagesVDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.8 V - supports mixed-voltage I/O interfaces
Burst LengthTwo-word burst - delivers two sequential 9-bit words per access
Package165-ball FBGA (13 × 15 × 1.4 mm) - optimized for signal integrity in high-speed routing
Standards ComplianceJTAG IEEE 1149.1 - enables boundary scan testing in production and debug

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[8:0]Synchronous write data inputsLatched on rising edge of K clock; 9-bit parallel input path for write port
Q[8:0]Synchronous read data outputsDriven on rising edges of C/C clocks; tristated when RPS is deasserted
RPS / WPSRead/Write port selectActive-low enables independent port activation; allows depth expansion without bus turnaround
K / KPrimary input clocksRising-edge-triggered for address/data capture; K used for read address, K for write address
C / COutput data clocksDeskew pair for read data; used with CQ/CQ to compensate flight time mismatches
CQ / CQEcho clocksFree-running, phase-aligned copies of C/C - simplify source-synchronous capture at controller
DOFFRead latency mode controlHIGH selects 1.5-cycle latency (QDR II mode); LOW selects 1-cycle latency (QDR I compatibility)
ZQImpedance calibration referenceConnects to external 240 Ω resistor for programmable HSTL output driver termination

Key Features

FeatureDesign Value
Independent read/write portsEliminates bus turnaround overhead - enables true concurrent transactions in packet buffering
Two-word DDR burstDelivers 18 bits per clock cycle per port - doubles effective bandwidth over single-word devices
Configurable read latencyDOFF pin selects between 1-cycle (low-latency control) and 1.5-cycle (max-throughput streaming) modes
HSTL-18 compatible outputsVariable-drive buffers with ZQ calibration - ensures signal integrity at 666 MT/s on FR4 PCBs
Integrated PLL + echo clocksEnables deterministic setup/hold timing at controller - removes need for complex board-level clock tuning

Applications

High-Speed Packet BufferingBaseband Signal Processing

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches and routers.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-in-first-out (FIFO) buffer with simultaneous ingress (write) and egress (read) paths.

Use Value: Concurrent access eliminates serialization delay - sustains line-rate throughput at 10 Gbps+ with sub-10 ns read latency.

Use Scenario: Real-time buffering of I/Q samples between ADC/DAC and DSP in LTE/5G radio units.

IC Role / Device Role / Timing Role: High-bandwidth memory interface for burst-mode sample transfer between RF front-end and baseband processor.

Use Value: Two-word burst + DDR delivers 1.2 Gbps per port - matches OFDM symbol timing without pipeline stalls.

Network Processor OffloadTest Equipment Pattern Memory

Use Scenario: Accelerating deep packet inspection (DPI) and flow classification in network processors.

IC Role / Device Role / Timing Role: Lookup table (LUT) and state memory for pattern matching engines requiring low-latency random access.

Use Value: 1-cycle latency mode (DOFF = LOW) reduces match decision time by 33% versus 1.5-cycle mode - improves per-packet processing rate.

Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor validation.

IC Role / Device Role / Timing Role: Deterministic, jitter-tolerant memory for high-speed digital pattern generation and capture.

Use Value: Echo clocks (CQ/CQ) enable ±50 ps capture window at 666 MT/s - meets ATE timing margin requirements without custom PHY.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10PA36-Mbit QDR II+, 250 MHz max, 1.5 V core, LVDS outputsLower speed grade; requires differential signaling infrastructureSelect if system uses LVDS interconnect and operates ≤250 MHz; not drop-in due to voltage and signaling mismatch
ISSI IS61WV102418BLL-15BLI18-Mbit sync SRAM, 150 MHz, single-port, 3.3 V/2.5 V/1.8 VNo QDR architecture; no concurrent read/write; half density and bandwidthConsider only for cost-sensitive, non-concurrent applications where latency and bandwidth are secondary

Compared with IDT72T3615L10PA and IS61WV102418BLL-15BLI, the CY7C1425KV18 uniquely delivers 333 MHz operation with HSTL-18 outputs in a 165-ball FBGA - making it the only option among the three that supports 666 MT/s DDR in standard PCB layouts without differential routing.

Availability

CY7C1425KV18 is available at Aetrix Electronics and suitable for high-speed packet buffering, baseband signal processing, and network processor offload applications requiring stable component supply across multi-year production cycles.

Supply support for CY7C1425KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.

The QDR II SRAM product line targets bandwidth-critical infrastructure applications - specifically engineered to replace legacy SRAMs in packet buffers, baseband memories, and protocol accelerators where concurrent access and deterministic timing are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1425KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for maximum throughput in streaming applications; when LOW, it reverts to 1-cycle latency for QDR I compatibility and lower-latency control operations. This is a static configuration pin sampled at initialization and does not require dynamic toggling during operation.

Can CY7C1425KV18 operate with only one clock domain (K-only)?

Yes - the device supports single-clock-domain operation using only the K clock for both input capture and output timing. In this mode, C and C are tied to K and K respectively, and CQ/CQ track K/K. However, deskew capability is lost, and timing margins tighten significantly above 200 MHz; dual-clock mode is recommended for 333 MHz operation.

How many address lines does CY7C1425KV18 require?

The CY7C1425KV18 requires 21 address lines (A[20:0]) to access its full 4M × 9 memory space. These are multiplexed for both read and write ports and sampled on alternate rising edges of K (read) and K (write) clocks. No separate address buses are needed - simplifying PCB layout and reducing pin count versus asynchronous SRAMs.

Is ZQ calibration mandatory for reliable operation?

ZQ calibration is required to set output driver impedance for HSTL-18 compliance. The ZQ pin must be connected to a 240 Ω resistor to VSS for accurate 25 Ω or 50 Ω (programmable) output termination. Omitting ZQ results in undefined drive strength, increased signal reflection, and failure to meet setup/hold timing at 666 MT/s - especially on longer traces or multi-drop topologies.

CY7C1425KV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
4M x 9
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1425KV18-250BZC FAQ

1.How can I place an order for CY7C1425KV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1425KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1425KV18-250BZC reliable?

The price and inventory of CY7C1425KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1425KV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1425KV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1425KV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1425KV18-250BZC?

CY7C1425KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1425KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1425KV18-250BZC?

For technical support, including CY7C1425KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1425KV18-250BZC requirements.

6.How does Aetrix verify that CY7C1425KV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1425KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1425KV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1425KV18-250BZC?

All CY7C1425KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1425KV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1425KV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1425KV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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