Infineon Technologies CY7C1425KV18-250BZC
- Part No.:
- CY7C1425KV18-250BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1425KV18-250BZC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1425KV18 from Cypress Semiconductor is a 36-Mbit QDR® II SRAM with 4M × 9 organization, 333 MHz clock frequency (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, two-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers and baseband processing.
For engineers reviewing the CY7C1425KV18 datasheet, CY7C1425KV18 pinout, CY7C1425KV18 application, or CY7C1425KV18 equivalent, key selection criteria include concurrent read/write bandwidth, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, HSTL-18-compatible output drive, JTAG 1149.1 testability, and FBGA-165 package compatibility with high-density memory subsystems.
Technical Context
The CY7C1425KV18 implements a synchronous pipelined QDR II architecture with independent read and write ports sharing a multiplexed 21-bit address bus. All accesses are edge-triggered on K/K clocks, and data is latched on rising edges only-no internal phase shifting.
It uses a PLL to align echo clocks (CQ/CQ) with output clocks (C/C), enabling precise timing closure at 666 MHz DDR. Read latency is configurable via DOFF: 1.5 cycles (DOFF = HIGH) for maximum throughput or 1 cycle (DOFF = LOW) for QDR I compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (4M × 9 configuration) |
| Max Clock Frequency | 333 MHz - enables 666 MT/s DDR data rate per port |
| Read Latency | Configurable: 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) |
| Supply Voltages | VDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.8 V - supports mixed-voltage I/O interfaces |
| Burst Length | Two-word burst - delivers two sequential 9-bit words per access |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - optimized for signal integrity in high-speed routing |
| Standards Compliance | JTAG IEEE 1149.1 - enables boundary scan testing in production and debug |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data inputs | Latched on rising edge of K clock; 9-bit parallel input path for write port |
| Q[8:0] | Synchronous read data outputs | Driven on rising edges of C/C clocks; tristated when RPS is deasserted |
| RPS / WPS | Read/Write port select | Active-low enables independent port activation; allows depth expansion without bus turnaround |
| K / K | Primary input clocks | Rising-edge-triggered for address/data capture; K used for read address, K for write address |
| C / C | Output data clocks | Deskew pair for read data; used with CQ/CQ to compensate flight time mismatches |
| CQ / CQ | Echo clocks | Free-running, phase-aligned copies of C/C - simplify source-synchronous capture at controller |
| DOFF | Read latency mode control | HIGH selects 1.5-cycle latency (QDR II mode); LOW selects 1-cycle latency (QDR I compatibility) |
| ZQ | Impedance calibration reference | Connects to external 240 Ω resistor for programmable HSTL output driver termination |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Eliminates bus turnaround overhead - enables true concurrent transactions in packet buffering |
| Two-word DDR burst | Delivers 18 bits per clock cycle per port - doubles effective bandwidth over single-word devices |
| Configurable read latency | DOFF pin selects between 1-cycle (low-latency control) and 1.5-cycle (max-throughput streaming) modes |
| HSTL-18 compatible outputs | Variable-drive buffers with ZQ calibration - ensures signal integrity at 666 MT/s on FR4 PCBs |
| Integrated PLL + echo clocks | Enables deterministic setup/hold timing at controller - removes need for complex board-level clock tuning |
Applications
| High-Speed Packet Buffering | Baseband Signal Processing |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches and routers. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-in-first-out (FIFO) buffer with simultaneous ingress (write) and egress (read) paths. Use Value: Concurrent access eliminates serialization delay - sustains line-rate throughput at 10 Gbps+ with sub-10 ns read latency. | Use Scenario: Real-time buffering of I/Q samples between ADC/DAC and DSP in LTE/5G radio units. IC Role / Device Role / Timing Role: High-bandwidth memory interface for burst-mode sample transfer between RF front-end and baseband processor. Use Value: Two-word burst + DDR delivers 1.2 Gbps per port - matches OFDM symbol timing without pipeline stalls. |
| Network Processor Offload | Test Equipment Pattern Memory |
Use Scenario: Accelerating deep packet inspection (DPI) and flow classification in network processors. IC Role / Device Role / Timing Role: Lookup table (LUT) and state memory for pattern matching engines requiring low-latency random access. Use Value: 1-cycle latency mode (DOFF = LOW) reduces match decision time by 33% versus 1.5-cycle mode - improves per-packet processing rate. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor validation. IC Role / Device Role / Timing Role: Deterministic, jitter-tolerant memory for high-speed digital pattern generation and capture. Use Value: Echo clocks (CQ/CQ) enable ±50 ps capture window at 666 MT/s - meets ATE timing margin requirements without custom PHY. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PA | 36-Mbit QDR II+, 250 MHz max, 1.5 V core, LVDS outputs | Lower speed grade; requires differential signaling infrastructure | Select if system uses LVDS interconnect and operates ≤250 MHz; not drop-in due to voltage and signaling mismatch |
| ISSI IS61WV102418BLL-15BLI | 18-Mbit sync SRAM, 150 MHz, single-port, 3.3 V/2.5 V/1.8 V | No QDR architecture; no concurrent read/write; half density and bandwidth | Consider only for cost-sensitive, non-concurrent applications where latency and bandwidth are secondary |
Compared with IDT72T3615L10PA and IS61WV102418BLL-15BLI, the CY7C1425KV18 uniquely delivers 333 MHz operation with HSTL-18 outputs in a 165-ball FBGA - making it the only option among the three that supports 666 MT/s DDR in standard PCB layouts without differential routing.
Availability
CY7C1425KV18 is available at Aetrix Electronics and suitable for high-speed packet buffering, baseband signal processing, and network processor offload applications requiring stable component supply across multi-year production cycles.
Supply support for CY7C1425KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.
The QDR II SRAM product line targets bandwidth-critical infrastructure applications - specifically engineered to replace legacy SRAMs in packet buffers, baseband memories, and protocol accelerators where concurrent access and deterministic timing are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1425KV18?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for maximum throughput in streaming applications; when LOW, it reverts to 1-cycle latency for QDR I compatibility and lower-latency control operations. This is a static configuration pin sampled at initialization and does not require dynamic toggling during operation.
Can CY7C1425KV18 operate with only one clock domain (K-only)?
Yes - the device supports single-clock-domain operation using only the K clock for both input capture and output timing. In this mode, C and C are tied to K and K respectively, and CQ/CQ track K/K. However, deskew capability is lost, and timing margins tighten significantly above 200 MHz; dual-clock mode is recommended for 333 MHz operation.
How many address lines does CY7C1425KV18 require?
The CY7C1425KV18 requires 21 address lines (A[20:0]) to access its full 4M × 9 memory space. These are multiplexed for both read and write ports and sampled on alternate rising edges of K (read) and K (write) clocks. No separate address buses are needed - simplifying PCB layout and reducing pin count versus asynchronous SRAMs.
Is ZQ calibration mandatory for reliable operation?
ZQ calibration is required to set output driver impedance for HSTL-18 compliance. The ZQ pin must be connected to a 240 Ω resistor to VSS for accurate 25 Ω or 50 Ω (programmable) output termination. Omitting ZQ results in undefined drive strength, increased signal reflection, and failure to meet setup/hold timing at 666 MT/s - especially on longer traces or multi-drop topologies.
CY7C1425KV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1425KV18-250BZC FAQ
1.How can I place an order for CY7C1425KV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1425KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1425KV18-250BZC reliable?
The price and inventory of CY7C1425KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1425KV18-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1425KV18-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1425KV18-250BZC transactions.
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4.How is shipping managed for CY7C1425KV18-250BZC?
CY7C1425KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1425KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1425KV18-250BZC?
For technical support, including CY7C1425KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1425KV18-250BZC requirements.
6.How does Aetrix verify that CY7C1425KV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1425KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1425KV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1425KV18-250BZC?
All CY7C1425KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1425KV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1425KV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1425KV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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