Infineon Technologies CY7C1425KV18-333BZXC

Overview

CY7C1425KV18-333BZXC from Cypress Semiconductor is a 4M × 9 (36-Mbit), 1.8 V QDR® II SRAM with independent read/write ports, 333 MHz clock frequency, DDR interfaces on both ports (666 MHz data rate), and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers concurrent burst reads/writes for high-bandwidth networking buffers in packet forwarding engines.

For engineers reviewing the CY7C1425KV18-333BZXC datasheet, CY7C1425KV18-333BZXC pinout, CY7C1425KV18-333BZXC application, or CY7C1425KV18-333BZXC equivalent, key selection criteria include dual-clock DDR timing, echo clock support (CQ/CQ), DOFF-configurable 1-cycle vs. 1.5-cycle read latency, HSTL-compatible 1.4–1.8 V I/O, and JTAG 1149.1 test access.

Technical Context

This QDR II SRAM implements separate synchronous read and write pipelines with independent address latching on rising edges of K/K clocks and output registration on C/C clocks. Its two-word burst architecture ensures deterministic 2×9-bit data transfers per access without bus turnaround.

The device integrates a PLL for precise data placement, supports programmable impedance via ZQ pin, and uses echo clocks (CQ/CQ) referenced to C/C to simplify high-speed data capture. DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency modes.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant Pb-free finish (BZXC suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T36120L10BG and IS61WV102418BLL-150BLI, CY7C1425KV18-333BZXC uniquely supports 666 MT/s DDR concurrency, echo-clock–assisted timing closure, and configurable read latency - making it the only viable option for new 5G baseband and 10G+ packet processing designs.

Availability

CY7C1425KV18-333BZXC is available at Aetrix Electronics and suitable for network packet buffering, high-speed test instrumentation, and 5G baseband signal processing requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1425KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems.

The QDR II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking, test equipment, and wireless infrastructure - emphasizing deterministic timing, concurrent access, and signal integrity at multi-GHz data rates.

FAQ

What is the function of the DOFF pin on CY7C1425KV18-333BZXC?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-skew layouts; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting directly affects the number of C/C clock cycles between address assertion and valid Q[8:0] output.

How does the CQ/CQ echo clock improve system timing?

CQ and CQ are free-running output clocks synchronized to C and C, respectively. They provide a receiver-side timing reference that tracks board trace skew and jitter, allowing FPGA or ASIC receivers to latch Q[8:0] using source-synchronous timing - reducing setup/hold uncertainty by up to 150 ps compared to system-clock–based capture.

Can CY7C1425KV18-333BZXC operate with only one clock domain?

Yes - the device supports single-clock mode where K and C are tied together (and K and C tied together). In this configuration, all inputs are sampled and outputs driven on K/K edges, eliminating need for separate read/write clock generation but reducing maximum achievable bandwidth by ~15% due to shared clock path constraints.

What is the purpose of the ZQ pin and how must it be connected?

ZQ is the impedance calibration reference terminal. It must be connected to a precision 240 Ω resistor to ground to enable internal calibration of HSTL output drivers. Without this connection, output impedance varies significantly with voltage/temperature, risking signal integrity failure above 400 MT/s.