Infineon Technologies CY7C1426AV18-200BZXC

Overview

CY7C1426AV18-200BZXC from Cypress Semiconductor is a 36-Mbit QDR-II SRAM with 4M × 9 organization, 200 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, enabling concurrent transactions in high-bandwidth networking and packet buffering applications.

For engineers reviewing the CY7C1426AV18-200BZXC datasheet, CY7C1426AV18-200BZXC pinout, CY7C1426AV18-200BZXC application, or CY7C1426AV18-200BZXC equivalent, key selection criteria include burst depth (4-word), echo clock support (CQ/CQ), HSTL-compatible I/O drive, DLL-based data alignment, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

The device uses synchronous pipelined architecture with independent K/K input clocks for address/data capture and C/C output clocks for data launch-enabling precise DDR timing without bus turnaround. Its dual-port design ensures full data coherency: write data becomes immediately available for subsequent reads after pipeline latency.

Each access delivers four sequential 9-bit words per port in two clock cycles, leveraging echo clocks (CQ/CQ) to deskew flight time mismatches across memory channels. The integrated Delay Lock Loop (DLL) aligns output data edges to C/C clocks within ±50 ps jitter, critical for 600 Mbps DDR signaling at 200 MHz.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant, Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IS61QW25618A-200TQLI and MT47H64M16HR-25E, CY7C1426AV18-200BZXC offers guaranteed 4M × 9 depth, true dual-port concurrency, and HSTL-native interface-making it uniquely suited for deterministic, low-latency, full-duplex buffering where DDR2 or smaller QDR-II variants fall short.

Availability

CY7C1426AV18-200BZXC is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom baseband processing, and avionics data recorder buffer applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1426AV18-200BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, headquartered in San Jose, CA.

This device belongs to the QDR-II SRAM product line, engineered specifically for deterministic, high-bandwidth, dual-port buffering in networking infrastructure and real-time signal processing systems.

FAQ

What is the function of the ZQ pin on CY7C1426AV18-200BZXC?

The ZQ pin calibrates output driver impedance for Q[8:0], CQ, and CQ signals. When connected to a 240 Ω resistor to ground, it tunes output resistance to 48 Ω ±10%, matching typical PCB trace impedances. Direct connection to VDDQ enables minimum impedance mode; floating or grounding ZQ is prohibited and causes undefined output behavior.

Can CY7C1426AV18-200BZXC operate with only one clock (K) instead of K/K and C/C pairs?

Yes - the device supports single-clock mode where K serves as both input and output clock, and Q[8:0] is driven on K's rising edge. However, this disables echo clock functionality (CQ/CQ) and eliminates flight-time deskewing capability, reducing timing margin in multi-device systems and limiting maximum reliable data rate to ≤167 MHz per published specs.

How does the 4-word burst architecture affect address bus utilization?

The 4-word burst reduces required address transitions by 75%: a single address initiates four consecutive 9-bit word reads/writes. For example, accessing 16 words requires only four address changes instead of sixteen, lowering address bus toggle rate, EMI, and controller logic complexity while maintaining full 36-Mbit capacity utilization.

Is the DOFF pin required to be tied high in normal operation?

Yes - DOFF must be pulled high (to VDDQ) to enable the internal Delay Lock Loop. Leaving DOFF floating or grounded disables the DLL, reverting output timing to fixed-delay mode with significantly degraded setup/hold margins at 200 MHz. Cypress specifies DLL-enabled operation for all rated speed grades including -200.