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Infineon Technologies CY7C1426AV18-250BZC

Part No.:
CY7C1426AV18-250BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1426AV18-250BZC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,931

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Product details

Overview

CY7C1426AV18-250BZC from Cypress Semiconductor is a 36-Mbit QDR-II SRAM with 4M × 9 organization, 250 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, enabling concurrent transactions in high-bandwidth networking buffers and packet memory applications.

For engineers reviewing the CY7C1426AV18-250BZC datasheet, CY7C1426AV18-250BZC pinout, CY7C1426AV18-250BZC application, or CY7C1426AV18-250BZC equivalent, key selection criteria include burst depth (4-word), echo clock support (CQ/CQ), HSTL-compatible I/O drive, JTAG 1149.1 test access, and DLL-based data alignment for 600 Mbps DDR timing at 250 MHz K-clock.

Technical Context

The device uses synchronous pipelined architecture with independent K/K input clocks for address/data capture and C/C output clocks for data launch-enabling precise DDR timing without bus turnaround. Its Delay Lock Loop (DLL) aligns echo clocks (CQ/CQ) to output data edges, reducing setup/hold uncertainty in high-speed systems.

Address inputs are multiplexed across read and write ports, latched on alternate rising edges of K; each access delivers four sequential 9-bit words. Write operations are self-timed and synchronized to K, while read outputs are registered to C/C, supporting full data coherency and depth expansion via RPS/WPS and BWS[0] control.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (4M × 9 configuration)
Max Clock Frequency250 MHz K-clock → 600 Mbps DDR data rate per port
Core Supply VoltageVDD = 1.8 V ± 0.1 V - defines internal logic timing margin and power consumption
I/O Supply RangeVDDQ = 1.4 V to 1.8 V - sets HSTL output drive strength and signal integrity compatibility
Burst Length4-word burst - reduces address bus toggling frequency by 4× vs. single-word access
Output InterfaceHSTL Class I - ensures impedance-matched, low-noise signaling on 50 Ω traces
Timing ControlDLL + echo clocks (CQ/CQ) - enables deterministic data capture at controller with <100 ps skew tolerance

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[8:0]Synchronous write data input9-bit parallel data sampled on rising edge of K/K; supports full or partial writes via BWS0
Q[8:0]Synchronous read data output9-bit parallel data launched on rising edges of C/C; tri-stated when RPS is deasserted
RPSRead port selectActive-low signal initiating 4-word burst read; controls Q[8:0] driver enable and timing alignment
WPSWrite port selectActive-low signal initiating 4-word burst write; gates D[8:0] sampling and internal write path activation
BWS0Byte write selectActive-low control for all 9 bits of D[8:0]; when deasserted, write data is ignored
K, KInput clocksDifferential pair capturing all synchronous inputs (address, RPS, WPS, D[8:0]) on rising edges only
C, COutput clocksDifferential pair launching Q[8:0] and synchronizing echo clocks CQ/CQ to minimize flight-time mismatch
CQ, CQEcho clocksFree-running copies of C/C, phase-aligned to Q[8:0] edges - used by controller for reliable DDR capture
ZQImpedance calibrationConnects to external 240 Ω resistor to ground to tune Q[8:0]/CQ/CQ output impedance to 48 Ω ±10%
DOFFDLL disablePulling low disables DLL; shifts timing to asynchronous mode with relaxed setup/hold but reduced max frequency
TCK/TMS/TDI/TDOJTAG interfaceIEEE 1149.1 boundary-scan support for production test and debug without requiring functional access

Key Features

FeatureDesign Value
Separate read/write portsEliminates data bus turnaround delay and contention - enables true concurrent read/write at full bandwidth
4-word burst architectureReduces effective address bus frequency by 75%, lowering PCB routing complexity and EMI
DLL + echo clocks (CQ/CQ)Enables controller-side deskewing of multiple QDR-II devices on same bus - critical for >200 MHz operation
HSTL Class I outputsGuarantees compatible drive strength and termination behavior with FPGA/ASIC memory controllers using 50 Ω point-to-point links
JTAG 1149.1 complianceSupports automated board-level test, interconnect verification, and in-system programming of adjacent logic

Applications

Packet Buffer MemoryNetwork Switch Fabric

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffering between MAC and switch fabric ASIC, handling simultaneous 64-byte header reads and payload writes.

Use Value: 4M × 9 organization provides 36 Mbit capacity with 9-bit parity support; 250 MHz K-clock sustains 4.5 GB/s aggregate bandwidth (read+write) required for 10G+ line rates.

Use Scenario: Interconnecting distributed forwarding engines in modular chassis switches.

IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by multiple lookup engines and traffic managers via dedicated read/write ports.

Use Value: Independent RPS/WPS and BWS0 allow fine-grained arbitration and partial writes - minimizing latency jitter during dynamic buffer allocation.

Telecom Baseband ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time buffering of IQ samples between ADC/DAC and DSP cores in 5G massive MIMO radio units.

IC Role / Device Role / Timing Role: Low-latency, deterministic memory for time-critical sample streaming - synchronized to system K/C clocks with sub-nanosecond jitter tolerance.

Use Value: DLL-aligned CQ/CQ outputs enable FPGA-based capture with <120 ps setup/hold margin at 600 Mbps DDR, meeting 3GPP FR2 timing budgets.

Use Scenario: Pattern memory in automated test equipment generating high-speed digital vectors for SoC validation.

IC Role / Device Role / Timing Role: High-reliability storage for stimulus/response sequences, accessed under tight timing constraints with guaranteed data coherency.

Use Value: Full data coherency and synchronous self-timed writes ensure no stale or partial writes corrupt test pattern integrity during rapid reconfiguration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C362000B-250BIN250 MHz, 4M × 9, 1.8 V core, but uses SSTL-2 I/O (not HSTL); no echo clocks or DLLLacks CQ/CQ and DLL - requires tighter board layout control and limits max trace length to ≤25 mmSelect when cost sensitivity outweighs timing margin requirements and controller lacks echo clock receivers
IS61WV102418B-250BLI250 MHz, 1M × 18, 3.3 V tolerant I/O, no DDR interface - single data rate onlyHalf the bandwidth (2.25 GB/s max), no concurrent read/write - unsuitable for packet buffering where backpressure must be absorbedChoose only for legacy 3.3 V systems with non-concurrent memory access patterns and no DDR timing demands

Compared with AS7C362000B-250BIN and IS61WV102418B-250BLI, CY7C1426AV18-250BZC uniquely delivers concurrent DDR throughput, echo-clock–assisted capture, and HSTL signaling - making it the only option for deterministic 10G+ packet memory subsystems.

Availability

CY7C1426AV18-250BZC is available at Aetrix Electronics and suitable for packet buffer memory, network switch fabric, and telecom baseband processing requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C1426AV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.

CY7C1426AV18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed communications infrastructure.

FAQ

What is the function of the ZQ pin, and how must it be connected?

The ZQ pin calibrates output driver impedance for Q[8:0], CQ, and CQ signals. It must be connected to a 240 Ω resistor tied to ground to set nominal 48 Ω output impedance matching standard 50 Ω PCB traces. Direct connection to VDDQ enables minimum impedance mode (≈35 Ω); floating or grounding ZQ is prohibited and causes undefined drive strength.

Can CY7C1426AV18-250BZC operate without the DLL enabled?

Yes - asserting DOFF low disables the DLL, switching the device to asynchronous output timing mode. In this mode, CQ/CQ become disabled, and data valid window shrinks significantly; maximum operating frequency drops to 167 MHz, and setup/hold margins increase by ~1.2 ns. This mode is intended only for debug or legacy controller compatibility, not production use.

How does the 4-word burst architecture affect address bus utilization?

Each read or write access transfers four consecutive 9-bit words using a single 20-bit address (A[19:0]). The internal address counter increments automatically after each word, eliminating need for external address sequencing. This reduces effective address bus toggle rate by 75% versus single-word access - lowering EMI, routing congestion, and timing closure effort on dense backplanes.

Is BWS0 pin required for full 9-bit writes, or can it be omitted?

BWS0 is mandatory for write enable control: when deasserted (high), all D[8:0] inputs are ignored regardless of WPS state. For full 9-bit writes, BWS0 must be asserted low synchronously with WPS and data. Leaving BWS0 unconnected or tied high prevents any write operation - the pin is not optional and has no default-active behavior.

CY7C1426AV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
4M x 9
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1426AV18-250BZC FAQ

1.How can I place an order for CY7C1426AV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1426AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1426AV18-250BZC reliable?

The price and inventory of CY7C1426AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1426AV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1426AV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1426AV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1426AV18-250BZC?

CY7C1426AV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1426AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1426AV18-250BZC?

For technical support, including CY7C1426AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1426AV18-250BZC requirements.

6.How does Aetrix verify that CY7C1426AV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1426AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1426AV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1426AV18-250BZC?

All CY7C1426AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1426AV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1426AV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1426AV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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