Infineon Technologies CY7C1426AV18-250BZC
- Part No.:
- CY7C1426AV18-250BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1426AV18-250BZC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1426AV18-250BZC from Cypress Semiconductor is a 36-Mbit QDR-II SRAM with 4M × 9 organization, 250 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, enabling concurrent transactions in high-bandwidth networking buffers and packet memory applications.
For engineers reviewing the CY7C1426AV18-250BZC datasheet, CY7C1426AV18-250BZC pinout, CY7C1426AV18-250BZC application, or CY7C1426AV18-250BZC equivalent, key selection criteria include burst depth (4-word), echo clock support (CQ/CQ), HSTL-compatible I/O drive, JTAG 1149.1 test access, and DLL-based data alignment for 600 Mbps DDR timing at 250 MHz K-clock.
Technical Context
The device uses synchronous pipelined architecture with independent K/K input clocks for address/data capture and C/C output clocks for data launch-enabling precise DDR timing without bus turnaround. Its Delay Lock Loop (DLL) aligns echo clocks (CQ/CQ) to output data edges, reducing setup/hold uncertainty in high-speed systems.
Address inputs are multiplexed across read and write ports, latched on alternate rising edges of K; each access delivers four sequential 9-bit words. Write operations are self-timed and synchronized to K, while read outputs are registered to C/C, supporting full data coherency and depth expansion via RPS/WPS and BWS[0] control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (4M × 9 configuration) |
| Max Clock Frequency | 250 MHz K-clock → 600 Mbps DDR data rate per port |
| Core Supply Voltage | VDD = 1.8 V ± 0.1 V - defines internal logic timing margin and power consumption |
| I/O Supply Range | VDDQ = 1.4 V to 1.8 V - sets HSTL output drive strength and signal integrity compatibility |
| Burst Length | 4-word burst - reduces address bus toggling frequency by 4× vs. single-word access |
| Output Interface | HSTL Class I - ensures impedance-matched, low-noise signaling on 50 Ω traces |
| Timing Control | DLL + echo clocks (CQ/CQ) - enables deterministic data capture at controller with <100 ps skew tolerance |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data input | 9-bit parallel data sampled on rising edge of K/K; supports full or partial writes via BWS0 |
| Q[8:0] | Synchronous read data output | 9-bit parallel data launched on rising edges of C/C; tri-stated when RPS is deasserted |
| RPS | Read port select | Active-low signal initiating 4-word burst read; controls Q[8:0] driver enable and timing alignment |
| WPS | Write port select | Active-low signal initiating 4-word burst write; gates D[8:0] sampling and internal write path activation |
| BWS0 | Byte write select | Active-low control for all 9 bits of D[8:0]; when deasserted, write data is ignored |
| K, K | Input clocks | Differential pair capturing all synchronous inputs (address, RPS, WPS, D[8:0]) on rising edges only |
| C, C | Output clocks | Differential pair launching Q[8:0] and synchronizing echo clocks CQ/CQ to minimize flight-time mismatch |
| CQ, CQ | Echo clocks | Free-running copies of C/C, phase-aligned to Q[8:0] edges - used by controller for reliable DDR capture |
| ZQ | Impedance calibration | Connects to external 240 Ω resistor to ground to tune Q[8:0]/CQ/CQ output impedance to 48 Ω ±10% |
| DOFF | DLL disable | Pulling low disables DLL; shifts timing to asynchronous mode with relaxed setup/hold but reduced max frequency |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1 boundary-scan support for production test and debug without requiring functional access |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delay and contention - enables true concurrent read/write at full bandwidth |
| 4-word burst architecture | Reduces effective address bus frequency by 75%, lowering PCB routing complexity and EMI |
| DLL + echo clocks (CQ/CQ) | Enables controller-side deskewing of multiple QDR-II devices on same bus - critical for >200 MHz operation |
| HSTL Class I outputs | Guarantees compatible drive strength and termination behavior with FPGA/ASIC memory controllers using 50 Ω point-to-point links |
| JTAG 1149.1 compliance | Supports automated board-level test, interconnect verification, and in-system programming of adjacent logic |
Applications
| Packet Buffer Memory | Network Switch Fabric |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffering between MAC and switch fabric ASIC, handling simultaneous 64-byte header reads and payload writes. Use Value: 4M × 9 organization provides 36 Mbit capacity with 9-bit parity support; 250 MHz K-clock sustains 4.5 GB/s aggregate bandwidth (read+write) required for 10G+ line rates. | Use Scenario: Interconnecting distributed forwarding engines in modular chassis switches. IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by multiple lookup engines and traffic managers via dedicated read/write ports. Use Value: Independent RPS/WPS and BWS0 allow fine-grained arbitration and partial writes - minimizing latency jitter during dynamic buffer allocation. |
| Telecom Baseband Processing | High-Speed Test Equipment |
Use Scenario: Real-time buffering of IQ samples between ADC/DAC and DSP cores in 5G massive MIMO radio units. IC Role / Device Role / Timing Role: Low-latency, deterministic memory for time-critical sample streaming - synchronized to system K/C clocks with sub-nanosecond jitter tolerance. Use Value: DLL-aligned CQ/CQ outputs enable FPGA-based capture with <120 ps setup/hold margin at 600 Mbps DDR, meeting 3GPP FR2 timing budgets. | Use Scenario: Pattern memory in automated test equipment generating high-speed digital vectors for SoC validation. IC Role / Device Role / Timing Role: High-reliability storage for stimulus/response sequences, accessed under tight timing constraints with guaranteed data coherency. Use Value: Full data coherency and synchronous self-timed writes ensure no stale or partial writes corrupt test pattern integrity during rapid reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-250BIN | 250 MHz, 4M × 9, 1.8 V core, but uses SSTL-2 I/O (not HSTL); no echo clocks or DLL | Lacks CQ/CQ and DLL - requires tighter board layout control and limits max trace length to ≤25 mm | Select when cost sensitivity outweighs timing margin requirements and controller lacks echo clock receivers |
| IS61WV102418B-250BLI | 250 MHz, 1M × 18, 3.3 V tolerant I/O, no DDR interface - single data rate only | Half the bandwidth (2.25 GB/s max), no concurrent read/write - unsuitable for packet buffering where backpressure must be absorbed | Choose only for legacy 3.3 V systems with non-concurrent memory access patterns and no DDR timing demands |
Compared with AS7C362000B-250BIN and IS61WV102418B-250BLI, CY7C1426AV18-250BZC uniquely delivers concurrent DDR throughput, echo-clock–assisted capture, and HSTL signaling - making it the only option for deterministic 10G+ packet memory subsystems.
Availability
CY7C1426AV18-250BZC is available at Aetrix Electronics and suitable for packet buffer memory, network switch fabric, and telecom baseband processing requiring stable component supply and long-term industrial lifecycle support.
Supply support for CY7C1426AV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.
CY7C1426AV18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed communications infrastructure.
FAQ
What is the function of the ZQ pin, and how must it be connected?
The ZQ pin calibrates output driver impedance for Q[8:0], CQ, and CQ signals. It must be connected to a 240 Ω resistor tied to ground to set nominal 48 Ω output impedance matching standard 50 Ω PCB traces. Direct connection to VDDQ enables minimum impedance mode (≈35 Ω); floating or grounding ZQ is prohibited and causes undefined drive strength.
Can CY7C1426AV18-250BZC operate without the DLL enabled?
Yes - asserting DOFF low disables the DLL, switching the device to asynchronous output timing mode. In this mode, CQ/CQ become disabled, and data valid window shrinks significantly; maximum operating frequency drops to 167 MHz, and setup/hold margins increase by ~1.2 ns. This mode is intended only for debug or legacy controller compatibility, not production use.
How does the 4-word burst architecture affect address bus utilization?
Each read or write access transfers four consecutive 9-bit words using a single 20-bit address (A[19:0]). The internal address counter increments automatically after each word, eliminating need for external address sequencing. This reduces effective address bus toggle rate by 75% versus single-word access - lowering EMI, routing congestion, and timing closure effort on dense backplanes.
Is BWS0 pin required for full 9-bit writes, or can it be omitted?
BWS0 is mandatory for write enable control: when deasserted (high), all D[8:0] inputs are ignored regardless of WPS state. For full 9-bit writes, BWS0 must be asserted low synchronously with WPS and data. Leaving BWS0 unconnected or tied high prevents any write operation - the pin is not optional and has no default-active behavior.
CY7C1426AV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1426AV18-250BZC FAQ
1.How can I place an order for CY7C1426AV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1426AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1426AV18-250BZC reliable?
The price and inventory of CY7C1426AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1426AV18-250BZC is usually 5 days.
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Once your CY7C1426AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1426AV18-250BZC?
For technical support, including CY7C1426AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1426AV18-250BZC requirements.
6.How does Aetrix verify that CY7C1426AV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1426AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1426AV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1426AV18-250BZC?
All CY7C1426AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1426AV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1426AV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1426AV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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