Infineon Technologies CY7C1426AV18-250BZXC

Overview

CY7C1426AV18-250BZXC from Cypress Semiconductor is a 36-Mbit QDR-II SRAM with 4M × 9 organization, 250 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, 4-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers and switch fabric memory.

For engineers reviewing the CY7C1426AV18-250BZXC datasheet, CY7C1426AV18-250BZXC pinout, CY7C1426AV18-250BZXC application, or CY7C1426AV18-250BZXC equivalent, key selection criteria include synchronous self-timed write timing, HSTL-compatible 165-ball FBGA package, dual-clock domain support (K/K and C/C), DLL-enabled data alignment, and depth expansion via port selects (WPS/RPS) and byte write enables (BWS0).

Technical Context

This device uses QDR-II architecture with fully independent read and write ports sharing a single multiplexed address bus. Address latching occurs on alternate rising edges of K clock, enabling concurrent access without bus turnaround. Each port operates synchronously with dedicated input registers (K/K-controlled) and output registers (C/C-controlled).

The internal Delay Lock Loop (DLL) aligns echo clocks (CQ/CQ) to output data edges, minimizing skew across high-speed PCB traces. Write operations are internally self-timed and synchronized to K clock, while read bursts deliver four sequential 9-bit words per access, achieving 600 MT/s effective data rate at 250 MHz clock.

Key Specifications

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXC suffix). Package supports thermal dissipation up to 1.0 W under typical burst operation and meets JEDEC MO-276AB mechanical standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with AS7C362000B-250BIN and IS61WV102418B-250BLI, CY7C1426AV18-250BZXC uniquely delivers true concurrent dual-port operation at 4.5 Gb/s with source-synchronous echo clocks - essential for deterministic latency in packet processing pipelines.

Availability

CY7C1426AV18-250BZXC is available at Aetrix Electronics and suitable for packet buffer memory, switch fabric interface, telecom line card buffer, and high-speed test equipment requiring stable component supply and long-term industrial availability.

Supply support for CY7C1426AV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

The QDR-II SRAM product line targets high-bandwidth, low-latency memory subsystems in switch fabric, packet processing, and baseband infrastructure - optimized for deterministic timing and concurrent access.

FAQ

What is the function of the ZQ pin on CY7C1426AV18-250BZXC?

The ZQ pin calibrates the output driver impedance of Q[8:0] and echo clocks CQ/CQ to match the system data bus. It must be connected to a 240 Ω resistor to ground to set output impedance to 48 Ω (0.2 × RQ); connecting directly to VDDQ enables minimum impedance mode. Leaving ZQ unconnected or tied to GND violates specification and causes undefined drive strength.

Can CY7C1426AV18-250BZXC operate in single-clock mode?

Yes - it supports single-clock mode using only K and C inputs (K and C are unused). In this mode, K serves as both address/data capture clock and output timing reference, while C clocks read data. CQ is generated relative to K instead of C. All timing parameters shift accordingly, and DLL remains active unless disabled via DOFF.

What does "BZXC" in the part number signify?

The "BZXC" suffix denotes a 165-ball FBGA package (15 × 17 mm), lead-free (Pb-free) finish, commercial temperature range (0 °C to +70 °C), and tape-and-reel packaging. The "B" indicates FBGA, "ZX" specifies Pb-free compliance per JEDEC J-STD-609, and "C" designates commercial grade - distinct from industrial (I) or extended (E) variants.

How many address bits are required for CY7C1426AV18-250BZXC?

CY7C1426AV18-250BZXC requires 20 address bits (A[19:0]) to access its full 4M × 9 memory space. Internally organized as four 1M × 9 arrays, the device multiplexes address inputs for both read and write ports, reducing pin count versus discrete address buses. Address latching occurs on rising edges of K clock during active RPS/WPS cycles.