Infineon Technologies CY7C1426JV18-300BZC

Overview

CY7C1426JV18-300BZC from Cypress Semiconductor is a 4M × 9 (36-Mbit) QDR-II SRAM with separate read/write ports, 300 MHz clock operation, DDR interfaces on both ports (600 MT/s effective data rate), and 1.8 V core / 1.4 V I/O supply. It delivers concurrent read-write capability for high-throughput packet buffering in network line cards and telecom switching fabric.

For engineers reviewing the CY7C1426JV18-300BZC datasheet, CY7C1426JV18-300BZC pinout, CY7C1426JV18-300BZC application, or CY7C1426JV18-300BZC equivalent, key selection criteria include QDR-II burst timing, DLL-enabled 1.5-cycle read latency, HSTL-18 I/O compatibility, and 165-ball FBGA (15 × 17 mm) mechanical fit in space-constrained routing layouts.

Technical Context

The device implements true dual-port synchronous pipelined architecture: independent K/K clocks latch write addresses and data, while C/C clocks control read data output timing. Echo clocks CQ/CQ are phase-aligned to C/C to enable source-synchronous capture at the controller.

It supports two operational modes: DLL-enabled mode (1.5-cycle read latency, 300 MHz max) and DLL-disabled mode (1-cycle latency, ≤167 MHz, QDR-I timing). Write operations are internally self-timed, and depth expansion uses dedicated port selects (RPS/WPS) and byte write enables (BWS0).

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Compared with AS7C362000B-300BIN and IS45S32800J-300BLI, CY7C1426JV18-300BZC provides native 9-bit I/O alignment, HSTL-18 compatibility, and echo clocks - critical for legacy telecom and networking platforms requiring proven timing closure at 300 MHz.

Availability

CY7C1426JV18-300BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric, baseband processing memory, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for CY7C1426JV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.

This device belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed packet infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1426JV18-300BZC?

The DOFF pin disables the internal Delay Lock Loop when pulled low. In this state, the device operates in QDR-I mode with 1-cycle read latency and a maximum frequency of 167 MHz. For full 300 MHz operation and 1.5-cycle latency, DOFF must be tied high via a ≤10 kΩ pull-up resistor to VDDQ.

Can CY7C1426JV18-300BZC interface directly with Xilinx Virtex-5 FPGAs?

Yes - its HSTL-18-compatible I/O (VDDQ = 1.4 V) matches Virtex-5 HP bank voltage requirements. The device's C/C and CQ/CQ timing aligns with Xilinx's source-synchronous capture methodology, and JTAG pins comply with IEEE 1149.1 for boundary scan integration.

How does the 4-word burst architecture reduce system-level complexity?

By transferring four consecutive 9-bit words per address cycle, the burst cuts required address transitions by 75%. This lowers address bus toggle rate, reduces PCB trace count, eases timing closure on long interconnects, and eliminates need for external burst counters or address sequencers in the memory controller.

Is the ZQ pin mandatory for reliable operation?

Yes - ZQ must be connected to a 240 Ω resistor to ground to calibrate output driver impedance for Q[8:0], CQ, and CQ signals. Leaving ZQ unconnected or tying it to GND violates JEDEC HSTL specifications and causes signal integrity failures at 600 MT/s due to mismatched termination.