Infineon Technologies CY7C1426KV18-250BZCT
- Part No.:
- CY7C1426KV18-250BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1426KV18-250BZCT.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1426KV18-250BZCT from Cypress Semiconductor is a 36-Mbit QDR® II SRAM with 4 M × 9 organization, 250 MHz maximum operating frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements separate read/write ports with DDR interfaces, four-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.
For engineers reviewing the CY7C1426KV18-250BZCT datasheet, CY7C1426KV18-250BZCT pinout, CY7C1426KV18-250BZCT application, or CY7C1426KV18-250BZCT equivalent, key selection criteria include concurrent read/write bandwidth, DOFF-configurable read latency (1-cycle or 1.5-cycle), HSTL-compatible output drive, JTAG 1149.1 test support, and 165-ball FBGA package compatibility with high-density PCB layouts.
Technical Context
This QDR II SRAM uses dual independent clock domains: K/K for address/data input timing and C/C for output timing, enabling precise DDR edge alignment without bus turnaround. Its internal self-timed write circuitry eliminates external write pulse control, while the PLL ensures accurate data placement relative to echo clocks.
The device supports depth expansion via RPS/WPS port selects and byte-level write masking via BWS0 (active-low), allowing selective 9-bit word updates without disturbing adjacent memory locations. DOFF pin configures read latency between 1 cycle (LOW) and 1.5 cycles (HIGH), directly affecting system timing closure in pipeline-constrained designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (4 M × 9 organization) |
| Max Clock Frequency | 250 MHz - determines peak throughput of 1.8 Gbps per port (DDR at 500 MT/s) |
| Core Supply Voltage | 1.8 V ±0.1 V - defines power delivery requirements and thermal budget for 165-ball FBGA |
| I/O Supply Range | 1.4 V to 1.8 V - enables interoperability with 1.5 V or 1.8 V logic families using HSTL outputs |
| Read Latency | Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - impacts pipeline stage count in ASIC/FPGA interfaces |
| Burst Length | Four-word - reduces address bus toggling frequency by 4× versus single-word access |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - supports fine-pitch routing and thermal dissipation in high-speed backplanes |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous data input | 9-bit write data latched on rising edge of K/K; ignored when WPS deasserted |
| Q[8:0] | Synchronous data output | 9-bit read data driven on rising edge of C/C; tristated when RPS deasserted |
| WPS | Write port select | Active-low signal enabling write operations; sampled on K rising edge |
| RPS | Read port select | Active-low signal enabling read operations; sampled on K rising edge |
| BWS0 | Byte write select | Active-low mask for all 9 bits; when deasserted, entire D[8:0] is ignored during write |
| DOFF | Read latency control | HIGH → 1.5-cycle latency; LOW → 1-cycle latency; sets internal pipeline staging |
| CQ / CQ | Echo clocks | Output-synchronized copies of C/C used by controller for reliable DDR data capture |
| K / K | Input clocks | Differential pair driving address, control, and write data; only rising edges used |
| C / C | Output clocks | Differential pair governing Q[8:0] timing; matched to CQ/CQ for skew cancellation |
| VDDQ | I/O supply | 1.4–1.8 V supply for HSTL output buffers; decoupling critical for signal integrity |
| VDD | Core supply | 1.8 V ±0.1 V supply for memory array and logic; requires low-noise regulation |
| VREF | Reference voltage | Midpoint reference for HSTL input receivers; must be stable at 0.7 V ±1% for valid sampling |
| ZQ | Impedance calibration | Connects to 240 Ω resistor to ground for on-die output driver impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent access-no bus turnaround required, eliminating 1-cycle dead time between read/write bursts |
| Four-word burst architecture | Reduces effective address bus frequency by 4×, easing timing closure on FPGA/ASIC address paths |
| Echo clocks (CQ/CQ) | Provide source-synchronous timing references for controller's data capture, relaxing PCB trace length matching |
| JTAG 1149.1 boundary scan | Supports IEEE-compliant testing of interconnects in dense BGA layouts without physical probe access |
| Programmable output drive | HSTL Class I/II configurable drive strength allows optimization for signal integrity vs. power trade-offs |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10/25/40 GbE line cards with real-time classification and forwarding. IC Role / Device Role / Timing Role: Dual-port buffer providing simultaneous write (ingress stream) and read (egress scheduler) at 500 MT/s DDR rate. Use Value: Eliminates arbitration delay between traffic flows, enabling deterministic sub-100 ns latency for time-sensitive packet processing. |
Use Scenario: Capturing high-fidelity waveform samples from multi-GHz ADCs in automated test systems with pattern generation replay. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory interfacing directly to FPGA fabric for real-time sample buffering and analysis. Use Value: Four-word burst reduces address bus loading, allowing sustained 1.8 Gbps throughput without external multiplexing logic. |
| Telecom Baseband Processing | FPGA-Based Protocol Acceleration |
|
Use Scenario: Supporting parallel FFT/IFFT engines in LTE/5G baseband units requiring low-latency access to coefficient and sample buffers. IC Role / Device Role / Timing Role: Pipelined SRAM acting as shared memory between multiple DSP cores with independent read/write scheduling. Use Value: Configurable DOFF latency allows tuning to match algorithm pipeline depth-1-cycle mode for tight loops, 1.5-cycle for wider datapaths. |
Use Scenario: Accelerating TCP/IP or encryption offload in smart NICs where host CPU delegates packet inspection and transformation tasks. IC Role / Device Role / Timing Role: On-board memory for protocol state tables and packet reassembly buffers accessed concurrently by host interface and accelerator engine. Use Value: Byte-write capability (BWS0) enables efficient partial updates of metadata structures without full-word overwrites or read-modify-write cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1426KV18-300BZCT | Higher max frequency (300 MHz) → 2.16 Gbps bandwidth; higher operating current (520 mA @ ×9) | Requires tighter PCB layout control and enhanced power delivery for stable 300 MHz operation | Select when system clock domain exceeds 250 MHz and timing margin permits higher VDDQ noise sensitivity |
| AS7C336818A-250BIN | Lower density (18-Mbit), same 250 MHz rating, but uses standard QDR (not QDR II) architecture with no echo clocks or DOFF latency control | Lacks concurrent read/write independence and echo-clock simplification - requires external timing management | Choose only if legacy QDR compatibility is mandatory and echo clock removal does not compromise system jitter tolerance |
Compared with CY7C1426KV18-300BZCT, the -250BZCT offers lower power and relaxed timing margins; compared with AS7C336818A-250BIN, it delivers superior concurrency, deterministic latency control, and simplified high-speed capture via CQ/CQ - making it preferable for new designs targeting >200 MHz sustained throughput.
Availability
CY7C1426KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom baseband processing, and FPGA-based protocol acceleration requiring stable component supply across long production lifecycles.
Supply support for CY7C1426KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1426KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed networking and signal processing infrastructure.
FAQ
What is the function of the DOFF pin on CY7C1426KV18-250BZCT?
The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in systems with longer clock-to-data flight times; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting directly affects the number of clock cycles between address assertion and valid Q[8:0] output, and must be fixed at power-up based on system-level timing analysis.
Can CY7C1426KV18-250BZCT operate with only a single clock domain?
Yes - the device supports single-clock mode where K/K and C/C are tied together, simplifying clock tree design. In this configuration, all synchronous inputs and outputs are referenced to the same clock pair, and echo clocks (CQ/CQ) still function as delayed copies for capture timing. However, dual-clock mode provides superior skew management and is recommended for >200 MHz operation.
How does byte write select (BWS0) work for the 9-bit data width?
BWS0 is an active-low signal that gates the entire 9-bit D[8:0] bus during write operations. When BWS0 is HIGH, no data is written regardless of WPS state; when LOW, all 9 bits are written to the addressed location. Unlike nibble-select variants, CY7C1426KV18 uses BWS0 for full-word masking - it does not support partial-byte writes within the 9-bit word.
Is the 165-ball FBGA package of CY7C1426KV18-250BZCT compatible with standard reflow profiles?
Yes - the Pb-free 165-ball FBGA package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C. Thermal resistance (θJA) is 25.5 °C/W, requiring standard 4-layer PCB with thermal vias under the package and adequate copper pour for heatsinking in continuous 250 MHz operation.
CY7C1426KV18-250BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1426KV18-250BZCT FAQ
1.How can I place an order for CY7C1426KV18-250BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1426KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1426KV18-250BZCT reliable?
The price and inventory of CY7C1426KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1426KV18-250BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1426KV18-250BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1426KV18-250BZCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1426KV18-250BZCT?
CY7C1426KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1426KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1426KV18-250BZCT?
For technical support, including CY7C1426KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1426KV18-250BZCT requirements.
6.How does Aetrix verify that CY7C1426KV18-250BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1426KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1426KV18-250BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1426KV18-250BZCT?
All CY7C1426KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1426KV18-250BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1426KV18-250BZCT part is unused and in its original packaging.
Return procedure for CY7C1426KV18-250BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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