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Infineon Technologies CY7C1426KV18-250BZCT

Part No.:
CY7C1426KV18-250BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1426KV18-250BZCT.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,779

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Product details

Overview

CY7C1426KV18-250BZCT from Cypress Semiconductor is a 36-Mbit QDR® II SRAM with 4 M × 9 organization, 250 MHz maximum operating frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements separate read/write ports with DDR interfaces, four-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.

For engineers reviewing the CY7C1426KV18-250BZCT datasheet, CY7C1426KV18-250BZCT pinout, CY7C1426KV18-250BZCT application, or CY7C1426KV18-250BZCT equivalent, key selection criteria include concurrent read/write bandwidth, DOFF-configurable read latency (1-cycle or 1.5-cycle), HSTL-compatible output drive, JTAG 1149.1 test support, and 165-ball FBGA package compatibility with high-density PCB layouts.

Technical Context

This QDR II SRAM uses dual independent clock domains: K/K for address/data input timing and C/C for output timing, enabling precise DDR edge alignment without bus turnaround. Its internal self-timed write circuitry eliminates external write pulse control, while the PLL ensures accurate data placement relative to echo clocks.

The device supports depth expansion via RPS/WPS port selects and byte-level write masking via BWS0 (active-low), allowing selective 9-bit word updates without disturbing adjacent memory locations. DOFF pin configures read latency between 1 cycle (LOW) and 1.5 cycles (HIGH), directly affecting system timing closure in pipeline-constrained designs.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (4 M × 9 organization)
Max Clock Frequency 250 MHz - determines peak throughput of 1.8 Gbps per port (DDR at 500 MT/s)
Core Supply Voltage 1.8 V ±0.1 V - defines power delivery requirements and thermal budget for 165-ball FBGA
I/O Supply Range 1.4 V to 1.8 V - enables interoperability with 1.5 V or 1.8 V logic families using HSTL outputs
Read Latency Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - impacts pipeline stage count in ASIC/FPGA interfaces
Burst Length Four-word - reduces address bus toggling frequency by 4× versus single-word access
Package 165-ball FBGA (13 × 15 × 1.4 mm) - supports fine-pitch routing and thermal dissipation in high-speed backplanes

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[8:0] Synchronous data input 9-bit write data latched on rising edge of K/K; ignored when WPS deasserted
Q[8:0] Synchronous data output 9-bit read data driven on rising edge of C/C; tristated when RPS deasserted
WPS Write port select Active-low signal enabling write operations; sampled on K rising edge
RPS Read port select Active-low signal enabling read operations; sampled on K rising edge
BWS0 Byte write select Active-low mask for all 9 bits; when deasserted, entire D[8:0] is ignored during write
DOFF Read latency control HIGH → 1.5-cycle latency; LOW → 1-cycle latency; sets internal pipeline staging
CQ / CQ Echo clocks Output-synchronized copies of C/C used by controller for reliable DDR data capture
K / K Input clocks Differential pair driving address, control, and write data; only rising edges used
C / C Output clocks Differential pair governing Q[8:0] timing; matched to CQ/CQ for skew cancellation
VDDQ I/O supply 1.4–1.8 V supply for HSTL output buffers; decoupling critical for signal integrity
VDD Core supply 1.8 V ±0.1 V supply for memory array and logic; requires low-noise regulation
VREF Reference voltage Midpoint reference for HSTL input receivers; must be stable at 0.7 V ±1% for valid sampling
ZQ Impedance calibration Connects to 240 Ω resistor to ground for on-die output driver impedance tuning

Key Features

Feature Design Value
Separate read/write ports Enables true concurrent access-no bus turnaround required, eliminating 1-cycle dead time between read/write bursts
Four-word burst architecture Reduces effective address bus frequency by 4×, easing timing closure on FPGA/ASIC address paths
Echo clocks (CQ/CQ) Provide source-synchronous timing references for controller's data capture, relaxing PCB trace length matching
JTAG 1149.1 boundary scan Supports IEEE-compliant testing of interconnects in dense BGA layouts without physical probe access
Programmable output drive HSTL Class I/II configurable drive strength allows optimization for signal integrity vs. power trade-offs

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and payloads in 10/25/40 GbE line cards with real-time classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port buffer providing simultaneous write (ingress stream) and read (egress scheduler) at 500 MT/s DDR rate.

Use Value: Eliminates arbitration delay between traffic flows, enabling deterministic sub-100 ns latency for time-sensitive packet processing.

Use Scenario: Capturing high-fidelity waveform samples from multi-GHz ADCs in automated test systems with pattern generation replay.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory interfacing directly to FPGA fabric for real-time sample buffering and analysis.

Use Value: Four-word burst reduces address bus loading, allowing sustained 1.8 Gbps throughput without external multiplexing logic.

Telecom Baseband Processing FPGA-Based Protocol Acceleration

Use Scenario: Supporting parallel FFT/IFFT engines in LTE/5G baseband units requiring low-latency access to coefficient and sample buffers.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as shared memory between multiple DSP cores with independent read/write scheduling.

Use Value: Configurable DOFF latency allows tuning to match algorithm pipeline depth-1-cycle mode for tight loops, 1.5-cycle for wider datapaths.

Use Scenario: Accelerating TCP/IP or encryption offload in smart NICs where host CPU delegates packet inspection and transformation tasks.

IC Role / Device Role / Timing Role: On-board memory for protocol state tables and packet reassembly buffers accessed concurrently by host interface and accelerator engine.

Use Value: Byte-write capability (BWS0) enables efficient partial updates of metadata structures without full-word overwrites or read-modify-write cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1426KV18-300BZCT Higher max frequency (300 MHz) → 2.16 Gbps bandwidth; higher operating current (520 mA @ ×9) Requires tighter PCB layout control and enhanced power delivery for stable 300 MHz operation Select when system clock domain exceeds 250 MHz and timing margin permits higher VDDQ noise sensitivity
AS7C336818A-250BIN Lower density (18-Mbit), same 250 MHz rating, but uses standard QDR (not QDR II) architecture with no echo clocks or DOFF latency control Lacks concurrent read/write independence and echo-clock simplification - requires external timing management Choose only if legacy QDR compatibility is mandatory and echo clock removal does not compromise system jitter tolerance

Compared with CY7C1426KV18-300BZCT, the -250BZCT offers lower power and relaxed timing margins; compared with AS7C336818A-250BIN, it delivers superior concurrency, deterministic latency control, and simplified high-speed capture via CQ/CQ - making it preferable for new designs targeting >200 MHz sustained throughput.

Availability

CY7C1426KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom baseband processing, and FPGA-based protocol acceleration requiring stable component supply across long production lifecycles.

Supply support for CY7C1426KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1426KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed networking and signal processing infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1426KV18-250BZCT?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in systems with longer clock-to-data flight times; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting directly affects the number of clock cycles between address assertion and valid Q[8:0] output, and must be fixed at power-up based on system-level timing analysis.

Can CY7C1426KV18-250BZCT operate with only a single clock domain?

Yes - the device supports single-clock mode where K/K and C/C are tied together, simplifying clock tree design. In this configuration, all synchronous inputs and outputs are referenced to the same clock pair, and echo clocks (CQ/CQ) still function as delayed copies for capture timing. However, dual-clock mode provides superior skew management and is recommended for >200 MHz operation.

How does byte write select (BWS0) work for the 9-bit data width?

BWS0 is an active-low signal that gates the entire 9-bit D[8:0] bus during write operations. When BWS0 is HIGH, no data is written regardless of WPS state; when LOW, all 9 bits are written to the addressed location. Unlike nibble-select variants, CY7C1426KV18 uses BWS0 for full-word masking - it does not support partial-byte writes within the 9-bit word.

Is the 165-ball FBGA package of CY7C1426KV18-250BZCT compatible with standard reflow profiles?

Yes - the Pb-free 165-ball FBGA package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C. Thermal resistance (θJA) is 25.5 °C/W, requiring standard 4-layer PCB with thermal vias under the package and adequate copper pour for heatsinking in continuous 250 MHz operation.

CY7C1426KV18-250BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
4M x 9
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1426KV18-250BZCT FAQ

1.How can I place an order for CY7C1426KV18-250BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1426KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1426KV18-250BZCT reliable?

The price and inventory of CY7C1426KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1426KV18-250BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1426KV18-250BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1426KV18-250BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1426KV18-250BZCT?

CY7C1426KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1426KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1426KV18-250BZCT?

For technical support, including CY7C1426KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1426KV18-250BZCT requirements.

6.How does Aetrix verify that CY7C1426KV18-250BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1426KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1426KV18-250BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1426KV18-250BZCT?

All CY7C1426KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1426KV18-250BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1426KV18-250BZCT part is unused and in its original packaging.

Return procedure for CY7C1426KV18-250BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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