Infineon Technologies CY7C1426KV18-300BZCT
- Part No.:
- CY7C1426KV18-300BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1426KV18-300BZCT.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1426KV18-300BZCT from Cypress Semiconductor is a 4 M × 9 (36-Mbit) QDR® II SRAM with four-word burst architecture, 300 MHz clock operation, 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports (600 Mbps effective data rate), echo clocks (CQ/CQ), and PLL-based timing control for high-speed networking buffers and packet memory applications.
For engineers reviewing the CY7C1426KV18-300BZCT datasheet, CY7C1426KV18-300BZCT pinout, CY7C1426KV18-300BZCT application, or CY7C1426KV18-300BZCT equivalent, key selection criteria include 300 MHz synchronous operation, 9-bit × 4-word burst width, 165-ball FBGA package compatibility, DOFF-controlled read latency (1 or 1.5 cycles), and HSTL-15/18 I/O drive compliance.
Technical Context
This QDR II SRAM implements independent read and write pipelines with dual DDR interfaces-data transferred on both rising edges of K/K (write) and C/C (read) clocks-enabling true concurrent access without bus turnaround. Its 4 M × 9 organization maps to 20 address bits, latched on alternating K-clock edges, and supports depth expansion via WPS/RPS port selects.
The device uses an internal PLL to align output data with echo clocks (CQ/CQ), minimizing skew in high-speed systems. Read latency is configurable via DOFF: 1 cycle when LOW (QDR I mode), 1.5 cycles when HIGH (QDR II mode), ensuring deterministic timing for switch fabric and buffer memory designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (4 M × 9 configuration) |
| Max Clock Frequency | 300 MHz - defines maximum sustained transaction rate of 600 MT/s per port |
| Data Bus Width | 9-bit bidirectional data path - supports byte-aligned packet payload storage |
| Read Latency | 1 or 1.5 cycles - selectable via DOFF pin for timing-critical vs. bandwidth-optimized modes |
| Core Supply Voltage | 1.8 V ±0.1 V - requires low-noise 1.8 V regulator with tight tolerance |
| I/O Supply Range | 1.4 V to 1.8 V - enables interoperability with 1.5 V or 1.8 V HSTL logic families |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density PCB routing |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Write data input | 9-bit synchronous data sampled on rising edge of K clock during active WPS |
| Q[8:0] | Read data output | 9-bit DDR output driven on rising edges of C/C clocks; valid after configured latency |
| WPS | Write port select | Active-low signal enabling write operations; deassertion blocks D[8:0] sampling |
| RPS | Read port select | Active-low signal enabling read operations; deassertion forces Q[8:0] to high-impedance |
| BWS0 | Byte write select | Active-low control for entire 9-bit word; required for full-word writes in CY7C1426KV18 |
| K, K | Write clock inputs | Dual-phase clocks for DDR write timing; only rising edges used for register sampling |
| C, C | Read clock inputs | Dual-phase clocks for DDR read timing; synchronize Q[8:0] output and CQ echo clock |
| CQ, CQ | Echo clocks | Output copies of C/C with matched flight time; simplify source-synchronous capture at controller |
| DOFF | Read latency mode | HIGH = 1.5-cycle latency (QDR II); LOW = 1-cycle latency (QDR I backward compatibility) |
| VDD, VDDQ, VSS | Power/ground | Separate 1.8 V core (VDD) and 1.4–1.8 V I/O (VDDQ) supplies; multiple VSS balls ensure low-impedance return paths |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables simultaneous packet ingress (write) and egress (read) in network switches without arbitration delay |
| Four-word burst architecture | Reduces address bus toggling by 75% versus single-word access-critical for high-throughput buffer memory |
| HSTL-compatible I/O with variable drive | Supports impedance-matched signaling up to 600 Mbps; drive strength configurable for trace length and loading |
| JTAG 1149.1 boundary scan | Enables production test and interconnect verification without external test fixtures |
| Programmable impedance (ZQ) | On-die termination calibration using external ZQ resistor (240 Ω) eliminates discrete termination components |
Applications
| Telecom Line Cards | High-Speed Switch Fabric |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames in modular line cards with multi-gigabit backplane interfaces. IC Role / Device Role / Timing Role: Dual-port buffer memory managing concurrent frame buffering and header lookup with sub-ns timing alignment. Use Value: 300 MHz DDR interface delivers 5.4 GB/s aggregate bandwidth across 9-bit ports, meeting OC-192/STM-64 packet processing requirements. | Use Scenario: Implementing distributed queuing in non-blocking crossbar switches handling 10/25/40 GbE traffic. IC Role / Device Role / Timing Role: Shared memory resource for ingress/egress arbitration with deterministic 1-cycle or 1.5-cycle read latency. Use Value: Echo clocks (CQ/CQ) eliminate setup/hold violations at 600 Mbps, enabling reliable capture by FPGA-based scheduler logic. |
| Network Processor Buffers | Test Equipment Memory Subsystem |
Use Scenario: Deep packet inspection engines requiring real-time access to flow state tables and payload buffers. IC Role / Device Role / Timing Role: Low-latency scratchpad memory interfaced directly to NPU datapath units via dedicated read/write buses. Use Value: Separate RPS/WPS controls allow independent activation of read/write paths-eliminating bus turnaround overhead in burst-intensive inspection workloads. | Use Scenario: High-speed digital pattern generators capturing multi-channel waveform data at >500 MS/s. IC Role / Device Role / Timing Role: Synchronous FIFO replacement with guaranteed timing closure via PLL-aligned CQ outputs. Use Value: 165-ball FBGA footprint supports dense layout with controlled-impedance routing; ZQ calibration ensures signal integrity across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit QDR II+, 100 MHz max frequency, 1.5 V core, LVDS outputs | Limited to lower bandwidth; lacks echo clocks and ZQ calibration | Select when system clock < 166 MHz and LVDS signaling is preferred over HSTL |
| ISSI IS61WV102418BLL-150BLI | 18-Mbit QDR II, 150 MHz, 1.8 V core, no PLL or echo clocks | Half density, lower speed, simplified timing but no CQ support or DOFF latency control | Choose for cost-sensitive designs where 300 MHz and echo clock precision are not required |
Compared with IDT72T3615L10BG and IS61WV102418BLL-150BLI, CY7C1426KV18-300BZCT delivers 2× higher bandwidth, integrated echo clock timing, and programmable read latency-making it optimal for 10G+ switch fabric and telecom buffer applications demanding precise DDR synchronization.
Availability
CY7C1426KV18-300BZCT is available at Aetrix Electronics and suitable for telecom line cards, high-speed switch fabric, network processor buffers, and test equipment memory subsystems requiring stable component supply, long-lifecycle support, and verified QDR II timing compliance.
Supply support for CY7C1426KV18-300BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for communications, industrial, and automotive markets.
CY7C1426KV18 belongs to Cypress's QDR II SRAM product line, designed specifically for ultra-low-latency, high-bandwidth packet buffering in networking infrastructure where deterministic DDR timing and concurrent read/write throughput are critical.
FAQ
What is the function of the DOFF pin on CY7C1426KV18-300BZCT?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency (QDR II mode) for optimized bandwidth; when LOW, it selects 1-cycle latency (QDR I compatibility mode). This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.
How does the BWS0 pin operate in CY7C1426KV18-300BZCT?
In CY7C1426KV18-300BZCT, BWS0 is the sole byte write select and operates as an active-low signal controlling the entire 9-bit D[8:0] word. When deasserted (HIGH), write data is ignored; when asserted (LOW), the full 9-bit word is written. Unlike narrower variants, this device does not support partial-byte writes-BWS0 enables or disables the whole word.
Can CY7C1426KV18-300BZCT operate with a single clock domain?
Yes-CY7C1426KV18-300BZCT supports single-clock mode where K and C are tied together (and K and C likewise), simplifying board design. In this mode, all registers use the same clock edges, and echo clocks (CQ/CQ) remain functional for source-synchronous capture, though timing margins tighten compared to dual-clock operation.
What is the purpose of the ZQ pin on CY7C1426KV18-300BZCT?
The ZQ pin connects to a 240 Ω external resistor to ground, enabling on-die impedance calibration for HSTL I/O drivers. This process adjusts output driver strength and ODT (on-die termination) values to match PCB trace impedance, reducing signal reflections and improving signal integrity without discrete termination resistors.
CY7C1426KV18-300BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1426KV18-300BZCT FAQ
1.How can I place an order for CY7C1426KV18-300BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1426KV18-300BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1426KV18-300BZCT reliable?
The price and inventory of CY7C1426KV18-300BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1426KV18-300BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1426KV18-300BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1426KV18-300BZCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1426KV18-300BZCT?
CY7C1426KV18-300BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1426KV18-300BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1426KV18-300BZCT?
For technical support, including CY7C1426KV18-300BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1426KV18-300BZCT requirements.
6.How does Aetrix verify that CY7C1426KV18-300BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1426KV18-300BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1426KV18-300BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1426KV18-300BZCT?
All CY7C1426KV18-300BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1426KV18-300BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1426KV18-300BZCT part is unused and in its original packaging.
Return procedure for CY7C1426KV18-300BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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