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Infineon Technologies CY7C1440AV25-250BZXI

Part No.:
CY7C1440AV25-250BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1440AV25-250BZXI.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,878

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Product details

Overview

CY7C1440AV25-250BZXI from Cypress Semiconductor is a 36-Mbit pipelined synchronous SRAM organized as 1 M × 36, operating at 250 MHz with 2.5 V core/I/O supply, 2.6 ns clock-to-output delay, and IEEE 1149.1 JTAG boundary scan-designed for high-bandwidth secondary cache in Pentium-class processor systems.

For engineers reviewing the CY7C1440AV25-250BZXI datasheet, CY7C1440AV25-250BZXI pinout, CY7C1440AV25-250BZXI application, or CY7C1440AV25-250BZXI equivalent, key selection criteria include burst mode flexibility (Intel Pentium interleaved/linear), synchronous self-timed write control, byte-selectable or global write capability, and 165-ball FBGA package compatibility with JEDEC JESD8-5 I/O standards.

Technical Context

This SRAM implements a two-bit synchronous wraparound burst counter, registered address/data paths, and dual address strobe logic (ADSP/ADSC) to support processor- and controller-initiated accesses. All synchronous inputs-including CE1/CE2/CE3, BWA–BWD, GW, and ADV-are edge-triggered on CLK's rising edge.

It delivers a 3-1-1-1 access rate with pipelined enable registers, output registers, and sense amplifiers. The ZZ pin provides asynchronous sleep mode with data retention, while OE enables tri-state control independent of clock timing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1 M × 36 configuration)
Max Clock Frequency 250 MHz - enables 4 ns cycle time for high-throughput cache buffering
Access Time (tCO) 2.6 ns - defines minimum valid data hold window after CLK edge for downstream latch capture
Supply Voltage 2.5 V core (VDD) and I/O (VDDQ) - ensures compatibility with legacy Pentium-era 2.5 V signaling domains
Burst Mode Support Intel Pentium interleaved or linear - selectable via MODE pin, enabling direct integration with x86 CPU bus protocols
Write Control Synchronous self-timed writes with byte-select (BWA–BWD + BWE) or global (GW) activation - eliminates external write timing constraints
JTAG Compliance IEEE 1149.1 boundary scan - supports production testability and board-level diagnostics without additional probe points

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant (Pb-free).

Pin/Terminal Circuit Role Design Meaning
CLK Clock Input Positive-edge-triggered master timing reference for all synchronous registers and burst counter increment
ADSP / ADSC Address Strobe Inputs Processor- or controller-initiated address capture; ADSP takes priority when both asserted
ADV Advance Control Triggers internal burst counter increment on rising CLK edge - enables automatic sequential address generation
BWA–BWD, BWE, GW Byte/Global Write Controls Enable selective 1–4 byte writes (BWX + BWE) or full-word write (GW low) - critical for cache line partial updates
OE Asynchronous Output Enable Tri-states DQ/DQP pins independently of CLK - allows shared bus arbitration during read cycles
ZZ Asynchronous Sleep Input Places device in low-power retention mode (ISB = 120 mA) while preserving memory contents
DQPA–DQPD Data I/O Ports 36-bit bidirectional data interface (four 9-bit ports); direction controlled by OE, registered on CLK edge

Key Features

Feature Design Value
Pipelined Synchronous Architecture Full register-to-register path (address/data/instruction) synchronized to CLK - eliminates combinatorial timing uncertainty across 250 MHz operation
User-Selectable Burst Sequence MODE pin selects Intel Pentium interleaved or linear addressing - matches native CPU burst protocol without glue logic
Separate Address Strobes Dedicated ADSP (processor) and ADSC (controller) inputs - enables concurrent cache coherency management and DMA access
Synchronous Self-Timed Writes On-chip write timing engine eliminates need for external write pulse generation or wait-state insertion
JEDEC JESD8-5 I/O Compatibility Ensures signal integrity and voltage-level interoperability with 2.5 V microprocessor buses and ASIC interfaces

Applications

Secondary Cache for x86 Systems High-Speed Buffer Memory

Use Scenario: L2 cache between Pentium-class CPU and main DRAM in embedded industrial controllers.

IC Role / Device Role / Timing Role: Pipelined SRAM providing 250 MHz burst reads with 3-1-1-1 latency to match CPU front-side bus timing.

Use Value: Eliminates wait states during cache line fills, sustaining >90% bus utilization under sustained instruction fetch load.

Use Scenario: Frame buffer in real-time video processing FPGA subsystems requiring deterministic 36-bit parallel access.

IC Role / Device Role / Timing Role: Synchronous dual-port buffer storing compressed video macroblocks with burst-aligned write/read alignment.

Use Value: Enables single-cycle burst writes from encoder pipeline and concurrent burst reads to display engine without arbitration overhead.

Network Packet Buffering Test Equipment Pattern Memory

Use Scenario: Temporary storage of Ethernet frames in Layer 2 switch ASICs prior to forwarding decision and egress scheduling.

IC Role / Device Role / Timing Role: High-reliability SRAM with JTAG scan for in-system verification of frame integrity during stress testing.

Use Value: Supports 250 MHz packet ingress rate with guaranteed 2.6 ns data validity window for downstream CRC check logic.

Use Scenario: Vector pattern storage in automated test equipment (ATE) for high-speed digital IC validation.

IC Role / Device Role / Timing Role: Deterministic-access memory delivering precise timing-controlled stimulus patterns synchronized to ATE clock domain.

Use Value: Enables sub-nanosecond setup/hold margin compliance for 250 MHz test vector delivery to DUT pins.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102436BLL-250BLI 250 MHz, 36-Mbit, 2.5 V, but uses 208-pin TQFP instead of FBGA; no JTAG support Lacks IEEE 1149.1 boundary scan - unsuitable for production test-critical ATE or telecom modules Select when board space permits larger TQFP and JTAG is not required for system diagnostics
MT55LSD256H36BG-250:G 250 MHz, 36-Mbit, 2.5 V, 165-ball FBGA, but requires 1.8 V I/O (VDDQ) - incompatible pin-level voltage Not directly substitutable due to VDDQ mismatch; needs level-shifting or redesign Consider only if migrating entire platform to 1.8 V I/O standards and redesigning power delivery

Compared with IS61WV102436BLL-250BLI and MT55LSD256H36BG-250:G, the CY7C1440AV25-250BZXI uniquely combines 165-ball FBGA footprint, integrated JTAG, and native 2.5 V I/O - making it the sole option for space-constrained, test-ready Pentium-compatible cache designs without voltage translation.

Availability

CY7C1440AV25-250BZXI is available at Aetrix Electronics and suitable for secondary cache subsystems, high-speed video buffering, network packet buffering, and ATE pattern memory applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1440AV25-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

The CY7C1440AV25 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-mode cache and buffer applications in x86-compatible and industrial real-time systems.

FAQ

What is the function of the MODE pin on CY7C1440AV25-250BZXI?

The MODE pin selects the burst address sequence: logic HIGH configures Intel Pentium interleaved addressing (e.g., 0, 2, 4, 6, 1, 3, 5, 7), while logic LOW enables linear addressing (0, 1, 2, 3, 4, 5, 6, 7). It is sampled synchronously on the rising edge of CLK during the first cycle of a burst operation and remains latched for the duration of that burst.

Can CY7C1440AV25-250BZXI operate with mixed voltage supplies (e.g., 2.5 V core and 3.3 V I/O)?

No. The device requires strictly 2.5 V for both VDD (core) and VDDQ (I/O). Applying 3.3 V to VDDQ exceeds the absolute maximum rating of 2.7 V and risks permanent damage to output drivers and input protection circuitry. VDDQ must be regulated to 2.5 V ± 5% per datasheet specifications.

How does the ZZ (sleep) mode affect timing parameters during wake-up?

When ZZ transitions from HIGH to LOW, the device exits sleep mode asynchronously, but valid operation resumes only after tZZ = 10 ns (min) and tEL = 3 ns (min) - the latter being the minimum time from ZZ deassertion to next valid CLK edge. No reinitialization or reset sequence is required; all internal state, including burst counter and registers, is preserved.

Is the CY7C1440AV25-250BZXI pin-compatible with CY7C1446AV25?

No. Although both share functional similarity, CY7C1440AV25 uses a 165-ball FBGA (1 M × 36), while CY7C1446AV25 uses a 209-ball FBGA (512 K × 72) with different ball pitch, layout, and signal assignment - including additional DQ/DQP lines and distinct BWx pin count. PCB redesign is mandatory for substitution.

CY7C1440AV25-250BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
2.6 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1440AV25-250BZXI FAQ

1.How can I place an order for CY7C1440AV25-250BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1440AV25-250BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1440AV25-250BZXI reliable?

The price and inventory of CY7C1440AV25-250BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1440AV25-250BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1440AV25-250BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1440AV25-250BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1440AV25-250BZXI?

CY7C1440AV25-250BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1440AV25-250BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1440AV25-250BZXI?

For technical support, including CY7C1440AV25-250BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1440AV25-250BZXI requirements.

6.How does Aetrix verify that CY7C1440AV25-250BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1440AV25-250BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1440AV25-250BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1440AV25-250BZXI?

All CY7C1440AV25-250BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1440AV25-250BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1440AV25-250BZXI part is unused and in its original packaging.

Return procedure for CY7C1440AV25-250BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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