My Inquiry
My Account
Infineon Technologies CY7C1440AV33-250AXC
- Part No.:
- CY7C1440AV33-250AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1440AV33-250AXC.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,553
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1440AV33-250AXC from Cypress Semiconductor is a 36-Mbit (1M × 36) pipelined synchronous SRAM with registered inputs/outputs, 250 MHz bus operation support, 2.6 ns clock-to-output delay, 3.3 V core supply, and 2.5 V/3.3 V I/O compatibility - deployed in high-speed CPU cache subsystems requiring deterministic burst access timing.
For engineers reviewing the CY7C1440AV33-250AXC datasheet, CY7C1440AV33-250AXC pinout, CY7C1440AV33-250AXC application, or CY7C1440AV33-250AXC equivalent, key selection criteria include synchronous burst address generation, byte-selectable vs. global write control, JTAG boundary-scan testability, and dual-voltage I/O interface design for legacy Pentium-class processor interfacing.
Technical Context
The device implements a two-bit synchronous wraparound burst counter controlled by ADV, ADSP, and ADSC signals, enabling Intel Pentium–compatible interleaved or linear burst sequences selected via the MODE pin. All address, data, and control inputs are registered on the rising edge of CLK.
It supports self-timed synchronous writes with byte-level granularity (BWA–BWD + BWE) or full-word writes (GW active), while OE provides asynchronous output enable and ZZ enables non-time-critical sleep mode. I/O buffers operate at 2.5 V or 3.3 V, decoupled from the 3.3 V core supply (VDD) and I/O ground (VSSQ).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 36 Mbit (1M × 36 organization) - supports full-word parallel data paths for L2 cache line storage. |
| Max clock frequency | 250 MHz - enables 4 ns clock period for tightly timed pipeline stages in high-end microprocessor interfaces. |
| Access time (tCO) | 2.6 ns - defines minimum clock-to-output latency for read data valid window in pipelined systems. |
| Core supply voltage | 3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation. |
| I/O supply voltage | 2.5 V or 3.3 V - allows direct interfacing to either GTL+ or SSTL_2 I/O standards without level shifters. |
| Burst modes | Intel Pentium–interleaved or linear - selectable via MODE pin; determines address increment pattern during burst reads/writes. |
| JTAG compliance | IEEE 1149.1 - enables boundary-scan testing of PCB interconnects without physical probe access. |
Pinout & Package
Available in Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm) packages. Pin functions validated per Cypress Document No. 38-05383 Rev. *N.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock for all registered inputs/outputs and burst counter advancement. |
| ADSP / ADSC | Address strobe (processor/controller) | Qualifies address capture into register; ADSP takes precedence when both asserted - enables dual-bus topology support. |
| ADV | Burst address advance | Active-low signal that increments internal two-bit counter to generate next burst address on rising CLK edge. |
| BWA–BWD, BWE, GW | Byte write controls | Enable selective 8-bit writes (BWX + BWE) or full 36-bit writes (GW low); critical for partial-cache-line updates. |
| OE | Asynchronous output enable | Tri-states DQ/DQP pins immediately when HIGH; overrides synchronous timing for bus sharing and contention avoidance. |
| ZZ | Asynchronous sleep mode | High-level assertion places SRAM in low-power retention state (data preserved) without clock gating or reset sequence. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined synchronous interface | Input/output registers eliminate setup/hold timing violations across PCB traces at 250 MHz bus speeds. |
| User-selectable burst mode | MODE pin selects Pentium-interleaved (A0/A1 = 00/01) or linear (A0/A1 = 10/11) addressing - matches host CPU protocol. |
| Self-timed write cycle | On-chip write timing logic eliminates external write pulse generation - reduces controller firmware complexity. |
| Dual-voltage I/O support | VDDQ configurable for 2.5 V or 3.3 V - enables drop-in replacement in mixed-voltage system designs without redesign. |
| JTAG boundary scan | Full IEEE 1149.1 implementation - supports automated PCB test coverage for high-density memory routing. |
Applications
| Processor Cache Interface | Network Packet Buffer |
|---|---|
|
Use Scenario: Secondary cache for Intel Pentium-class CPUs operating at 250 MHz bus frequency. IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing deterministic 2.6 ns tCO read response and burst-addressed write coherency. Use Value: Eliminates wait states in cache refill cycles by matching Pentium's interleaved burst address sequence and 4-word line size. |
Use Scenario: High-throughput packet buffering in enterprise switch ASICs with multi-gigabit backplane interfaces. IC Role / Device Role / Timing Role: Low-latency, burst-capable memory for temporary frame storage before classification and forwarding. Use Value: Sustains 250 MHz sustained read/write throughput with byte-selectable writes - minimizes buffer fragmentation overhead. |
| Industrial Motion Controller | Test Equipment Pattern Memory |
|
Use Scenario: Real-time trajectory buffer in CNC motion controllers requiring jitter-free position update streams. IC Role / Device Role / Timing Role: Deterministic-access SRAM storing precomputed motor step tables synchronized to servo clock. Use Value: Registered I/O and 2.6 ns tCO ensure sub-nanosecond timing margin for closed-loop control loop deadlines. |
Use Scenario: Vector pattern storage in automated test equipment (ATE) for high-speed digital IC validation. IC Role / Device Role / Timing Role: High-reliability, JTAG-testable memory holding stimulus/response bitstreams at 250 MHz. Use Value: IEEE 1149.1 boundary scan enables in-system verification of memory-to-ASIC interconnect integrity pre-burn-in. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102436B | 1M × 36, 250 MHz, but lacks JTAG boundary scan and uses single 3.3 V I/O supply (no 2.5 V option). | Not suitable for mixed-voltage or JTAG-mandated test environments; requires level-shifting for 2.5 V processors. | Select when JTAG is unnecessary and I/O voltage is fixed at 3.3 V - lower cost, same timing performance. |
| ON Semiconductor MC10E143 | ECL-based 36-bit latch (not SRAM); no memory array, no burst counter, no CE/OE logic - functionally distinct. | Used only for high-speed data latching, not storage; cannot replace CY7C1440AV33 in cache or buffer roles. | Avoid as functional substitute; only consider for discrete register staging where memory persistence is irrelevant. |
Compared with IS61WV102436B and MC10E143, the CY7C1440AV33-250AXC uniquely combines JTAG testability, dual-voltage I/O, and programmable burst sequencing - making it irreplaceable in certified industrial and test-system designs requiring traceable memory interface validation.
Availability
CY7C1440AV33-250AXC is available at Aetrix Electronics and suitable for CPU cache subsystems, network packet buffers, industrial motion controllers, and ATE pattern memory applications requiring stable component supply and long-lifecycle support.
Supply support for CY7C1440AV33-250AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and computing markets.
The CY7C1440AV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-mode CPU and ASIC cache interfaces demanding deterministic timing and JTAG testability.
FAQ
Is CY7C1440AV33-250AXC still in production?
No - Cypress declared this part obsolete as of November 2016 (Document 38-05383 Rev. *N). It has no designated replacement. Aetrix Electronics maintains legacy inventory with full traceability and offers engineering support for obsolescence mitigation, including pin-compatible alternatives and migration path analysis.
What is the function of the MODE pin?
The MODE pin selects burst address sequence: when sampled at CLK rise with A1:A0 = 00 or 01, it configures Intel Pentium–interleaved mode; with A1:A0 = 10 or 11, it enables linear burst mode. This setting persists until next power-on or reset, and directly controls the internal two-bit counter's increment behavior.
Can CY7C1440AV33-250AXC operate with 2.5 V I/O and 3.3 V core simultaneously?
Yes - VDDQ (I/O supply) accepts 2.5 V ± 0.2 V while VDD (core supply) requires 3.3 V ± 0.3 V. The device guarantees full AC/DC specifications under this dual-rail condition, and all I/O pins (DQ/DQP, BWX, OE, etc.) are JEDEC JESD8-5 compliant at 2.5 V.
Does ZZ sleep mode retain data without external refresh?
Yes - asserting ZZ HIGH places the device in a non-time-critical sleep state where core logic is gated but memory cell contents remain fully retained without external intervention or refresh cycles. Data integrity is guaranteed over the full industrial temperature range (–40°C to +85°C) during ZZ assertion.
CY7C1440AV33-250AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 2.6 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1440AV33-250AXC FAQ
1.How can I place an order for CY7C1440AV33-250AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1440AV33-250AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1440AV33-250AXC reliable?
The price and inventory of CY7C1440AV33-250AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1440AV33-250AXC is usually 5 days.
3.What payment methods are accepted for CY7C1440AV33-250AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1440AV33-250AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1440AV33-250AXC?
CY7C1440AV33-250AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1440AV33-250AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1440AV33-250AXC?
For technical support, including CY7C1440AV33-250AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1440AV33-250AXC requirements.
6.How does Aetrix verify that CY7C1440AV33-250AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1440AV33-250AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1440AV33-250AXC meets industry standards.
7.What is the process for return or replacement of CY7C1440AV33-250AXC?
All CY7C1440AV33-250AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1440AV33-250AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1440AV33-250AXC part is unused and in its original packaging.
Return procedure for CY7C1440AV33-250AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1440AV33-250AXC Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
