Infineon Technologies CY7C1440KV25-250BZXIT

Overview

CY7C1440KV25-250BZXIT from Cypress Semiconductor is a 36-Mbit (1M × 36) pipelined synchronous SRAM with 2.5-V core/I/O supplies, 250 MHz bus operation support, 2.5 ns clock-to-output delay, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed cache subsystems for embedded processors requiring deterministic burst access.

For engineers reviewing the CY7C1440KV25-250BZXIT datasheet, CY7C1440KV25-250BZXIT pinout, CY7C1440KV25-250BZXIT application, or CY7C1440KV25-250BZXIT equivalent, key selection criteria include synchronous burst timing control (ADSP/ADSC/ADV), byte-write granularity (BWA–BWD + BWE), ZZ sleep mode behavior, and 165-ball FBGA mechanical compatibility.

Technical Context

The device implements a two-bit synchronous wraparound burst counter controlled by ADV, with burst order (interleaved or linear) selected statically via MODE pin. All address, data, and control inputs-except OE and ZZ-are registered on the rising edge of CLK, enabling precise pipelined timing at 250 MHz.

Write operations are self-timed and synchronous: GW enables full-word writes, while BWE and BWA–BWD enable selective byte writes. Output drivers are tristated automatically during writes regardless of OE state, and OE remains asynchronous to support flexible bus handshaking.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IS61WV102436B, CY7C1440KV25-250BZXIT adds JTAG testability and ZZ sleep for aerospace/industrial use cases; SST26VF064B is architecturally incompatible due to serial interface and flash volatility - neither serves as drop-in replacement.

Availability

CY7C1440KV25-250BZXIT is available at Aetrix Electronics and suitable for processor cache memory, network packet buffering, industrial motion control, and avionics data recording requiring stable component supply across extended product lifecycles.

Supply support for CY7C1440KV25-250BZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with focus on reliability, timing precision, and system-level integration.

The CY7C1440KV25 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic burst-access applications in CPU caches, telecom infrastructure, and real-time control systems.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst addressing order: tied to GND for linear burst, or to VDD/floating for interleaved burst (Pentium-compatible). It is a static strap pin - must remain unchanged during operation. Internal pull-up ensures safe default to interleaved mode if left unconnected.

Does CY7C1440KV25-250BZXIT support true dual-port operation?

No. It is a single-port synchronous SRAM with common I/O pins. While it supports concurrent read and write operations in pipelined mode, it does not provide simultaneous independent access via separate read/write ports - unlike true dual-port SRAMs used in FIFO or buffer applications.

How does the ZZ sleep mode interact with data retention and wake-up timing?

When ZZ is driven HIGH, the device enters non-time-critical sleep with full data retention and reduced current draw. Wake-up is immediate upon ZZ returning LOW; no recovery delay or reinitialization is required. The internal pull-down ensures safe default LOW state during power-up.

Can CE2 and CE3 be omitted in a simple single-SRAM system?

CE2 is active-HIGH and CE3 is active-LOW; both are sampled synchronously on CLK rise. In a single-device system, CE2 must be held HIGH and CE3 held LOW (or NC per package note) to satisfy chip select logic. Leaving them unconnected risks metastability - they must be actively biased per datasheet recommendations.