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Infineon Technologies CY7C1440KV33-167AXC

Part No.:
CY7C1440KV33-167AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1440KV33-167AXC.pdf
Description:
IC SRAM 36MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,006

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Product details

Overview

CY7C1440KV33-167AXC from Cypress Semiconductor is a 36-Mbit pipelined synchronous SRAM with on-chip ECC, configured as 1M × 36, operating at 167 MHz with 3.3 V core and 2.5/3.3 V I/O supplies. It supports interleaved or linear burst sequences, synchronous self-timed writes, and asynchronous output enable - deployed in high-speed CPU cache subsystems requiring soft-error resilience.

For engineers reviewing the CY7C1440KV33-167AXC datasheet, CY7C1440KV33-167AXC pinout, CY7C1440KV33-167AXC application, or CY7C1440KV33-167AXC equivalent, key selection criteria include burst address control (ADSP/ADSC/ADV), byte-write granularity (BWA–BWD + BWE), clock-to-output timing (3.4 ns), and JTAG-compliant boundary scan for system-level testability.

Technical Context

This SRAM implements a dual-strobe synchronous interface with registered address/data/control inputs sampled on CLK's rising edge, and pipelined output registers delivering data with deterministic 3.4 ns tCO. The two-bit internal burst counter enables wraparound addressing for both interleaved and linear sequences, selected via MODE pin.

It integrates ECC encoding/decoding logic to detect and correct single-bit errors per 36-bit word, reducing soft error rate without external logic. Sleep mode (ZZ) provides low-power retention with data integrity preserved, while IEEE 1149.1 JTAG supports boundary-scan testing in dense PCB layouts.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 organization), enabling full-word parallel access for 32-bit+ bus systems with parity/ECC overhead.
Max Clock Frequency 167 MHz - defines maximum sustained burst throughput of 668 MB/s (36-bit × 167 MHz).
Access Time (tCO) 3.4 ns - guaranteed clock-to-output delay for synchronous read outputs, critical for tight timing closure in cache pipelines.
Core Supply Voltage 3.3 V ± 0.3 V - requires dedicated low-noise core regulator; decoupling must meet SRAM transient current demands.
I/O Supply Voltage 2.5 V or 3.3 V - supports mixed-voltage system interfacing; VDDQ must match host bus voltage for signal integrity.
ECC Capability On-die SEC-DED (Single Error Correction, Double Error Detection) per 36-bit word - eliminates need for external ECC logic in mission-critical caches.
Burst Support User-selectable interleaved or linear sequence via MODE pin - matches Pentium-compatible or custom controller address generation.

Pinout & Package

Packaged in Pb-free 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) with thermal pad; pinout validated per Cypress Document 001-66676 Rev. *G, Figure 1.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master timing reference for all registered inputs/outputs; governs tCO, setup/hold, and burst increment timing.
ADSP / ADSC Address strobe inputs Asynchronous initiation signals (active LOW) that latch A[1:0] and full address into registers on next CLK edge; ADSP takes priority over ADSC.
ADV Burst advance control Active-LOW signal sampled on CLK edge to increment internal 2-bit burst counter - enables automatic sequential address generation during burst reads/writes.
BWA–BWD, BWE, GW Byte write controls Four independent byte-enable lines (BWA–BWD) qualified by BWE (active LOW); GW overrides all to enable full 36-bit write - supports partial-word updates without read-modify-write.
DQPA–DQPD, DQA–DQD 36-bit bidirectional data I/O Grouped into four 9-bit bytes (A–D); direction controlled by OE; each group has dedicated byte-write drivers - enables true 8/16/32-bit compatibility on 36-bit bus.
OE, ZZ Asynchronous controls OE (active LOW) enables output drivers or tri-states I/O; ZZ (active HIGH) places device in low-IDD sleep mode with data retention - no clock required during sleep.

Key Features

Feature Design Value
Pipelined synchronous interface Input registration + output registration reduces clock skew sensitivity and enables reliable >167 MHz operation in multi-layer PCBs with trace-length mismatch.
On-chip SEC-DED ECC Corrects single-bit errors and detects double-bit errors per 36-bit word without software or external logic - essential for aerospace, industrial, and telecom caching where SER must be <1e−15/hr/bit.
User-selectable burst mode MODE pin selects interleaved (Pentium-compatible) or linear addressing - allows reuse across x86 and custom SoC platforms without firmware changes.
Separate processor/controller strobes Independent ADSP and ADSC inputs allow coexistence of CPU and DMA controller on same SRAM bus - eliminates arbitration logic and reduces latency for burst transfers.
JTAG boundary scan (IEEE 1149.1) Full 165-ball FBGA and 100-pin TQFP support scan chain visibility - enables automated test of solder joints and interconnects in high-density server/cache modules.

Applications

High-Performance CPU Cache Network Packet Buffer

Use Scenario: Secondary (L2) cache for embedded RISC or x86 processors in telecom baseband units requiring deterministic latency and radiation tolerance.

IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state burst reads/writes synchronized to CPU clock; ECC ensures data integrity under neutron flux.

Use Value: Eliminates external ECC IC and reduces board area by 35% versus discrete SRAM + ASIC solution; 3.4 ns tCO meets sub-6 ns cache timing budgets.

Use Scenario: Deep packet buffering in 10G Ethernet line cards handling variable-length frames with strict jitter requirements.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory for ingress/egress FIFOs; burst mode aligns with MAC-layer frame segmentation.

Use Value: 167 MHz clock rate sustains 600+ MB/s sustained throughput; asynchronous OE enables dynamic buffer partitioning between traffic classes.

Industrial PLC Memory Module Avionics Data Recorder

Use Scenario: Nonvolatile program/data storage extension in programmable logic controllers exposed to EMI and temperature cycling.

IC Role / Device Role / Timing Role: Synchronous SRAM with sleep mode (ZZ) for power-gated standby; JTAG enables in-system verification after reflow.

Use Value: 3.3 V core + 2.5 V I/O supports legacy 2.5 V FPGA interfaces; ECC prevents spurious faults during electromagnetic transients per IEC 61000-4-4.

Use Scenario: Real-time flight data acquisition buffer in DO-254-certified avionics recorders requiring certified soft-error mitigation.

IC Role / Device Role / Timing Role: Radiation-hardened-by-design SRAM with SEC-DED ECC for continuous 36-bit word logging at 100+ kHz sample rate.

Use Value: On-die ECC satisfies RTCA DO-160 Section 22 lightning-induced transient immunity; 100-pin TQFP simplifies conformal coating and rework.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102436BLL-167TQLI No on-chip ECC; 3.3 V only I/O; identical 1M × 36, 167 MHz, TQFP-100 package. Lacks hardware ECC - requires external error detection or software correction; suitable for cost-sensitive non-safety-critical buffers. Select when ECC is handled at system level and BOM cost is primary constraint.
MT28EW128ABA1HPC-0SIT Quad SPI NOR Flash with SRAM-like interface; 128 Mbit density; no pipelining or burst counter; supports execute-in-place. Non-volatile but slower random access (tACC ~ 8 ns); used for firmware storage, not high-speed cache. Choose only for boot code storage where persistence outweighs speed; not a functional replacement for pipelined SRAM.

Compared with IS61WV102436BLL-167TQLI, CY7C1440KV33-167AXC adds hardware SEC-DED ECC and dual-strobe burst control - critical for safety-certifiable systems. Versus MT28EW128ABA1HPC-0SIT, it delivers 2.1× lower access latency and deterministic burst timing, making it irreplaceable in real-time cache roles.

Availability

CY7C1440KV33-167AXC is available at Aetrix Electronics and suitable for high-reliability CPU cache subsystems, network packet buffering, industrial PLC memory expansion, and avionics data recorders requiring stable component supply across extended product lifecycles.

Supply support for CY7C1440KV33-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets.

CY7C1440KV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, ECC-protected cache and buffer applications in mission-critical embedded systems.

FAQ

What is the function of the MODE pin on CY7C1440KV33-167AXC?

The MODE pin selects burst address sequence: logic HIGH configures interleaved burst order (compatible with Intel Pentium processors), while logic LOW selects linear burst order. It is sampled asynchronously at power-up or reset and latched internally - no clock required for mode selection. This enables hardware-configurable compatibility across different CPU architectures without firmware modification.

Does CY7C1440KV33-167AXC support 2.5 V-only operation?

Yes - the device supports 2.5 V I/O supply (VDDQ) while maintaining 3.3 V core (VDD). All I/O pins are JEDEC JESD8-5 compliant at 2.5 V, and AC timing parameters (e.g., tCO = 3.4 ns) are guaranteed under 2.5 V VDDQ conditions. Core voltage must remain at 3.3 V ± 0.3 V; mixing 2.5 V core is not supported.

How does the ZZ (sleep) mode affect timing and power consumption?

In ZZ mode (pin driven HIGH), the device enters a non-time-critical retention state: core and I/O power drop to ≤5 mA typical, clock may be stopped, and all inputs except ZZ are ignored. Data is retained indefinitely as long as VDD and VDDQ remain within specification. Exit time from ZZ is 20 ns max after ZZ returns LOW - no resynchronization or initialization is needed.

Can CE2 be used independently of CE1 and CE3 for chip select?

No - CE2 is active HIGH and functions only in conjunction with CE1 (active LOW) and CE3 (active LOW) as a three-input decode. The device enables only when CE1 = LOW, CE2 = HIGH, and CE3 = LOW. CE2 alone has no standalone chip-select function; its state is sampled synchronously with CLK and ignored if CE1 is deasserted.

CY7C1440KV33-167AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1440KV33-167AXC FAQ

1.How can I place an order for CY7C1440KV33-167AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1440KV33-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1440KV33-167AXC reliable?

The price and inventory of CY7C1440KV33-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1440KV33-167AXC is usually 5 days.

3.What payment methods are accepted for CY7C1440KV33-167AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1440KV33-167AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1440KV33-167AXC?

CY7C1440KV33-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1440KV33-167AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1440KV33-167AXC?

For technical support, including CY7C1440KV33-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1440KV33-167AXC requirements.

6.How does Aetrix verify that CY7C1440KV33-167AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1440KV33-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1440KV33-167AXC meets industry standards.

7.What is the process for return or replacement of CY7C1440KV33-167AXC?

All CY7C1440KV33-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1440KV33-167AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1440KV33-167AXC part is unused and in its original packaging.

Return procedure for CY7C1440KV33-167AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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