My Inquiry
My Account
Infineon Technologies CY7C1441AV33-133AXC
- Part No.:
- CY7C1441AV33-133AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1441AV33-133AXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,353
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1441AV33-133AXC from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous flow-through SRAM with 133-MHz bus operation, 6.5 ns clock-to-output delay, 3.3 V core supply, and dual-voltage I/O (2.5 V or 3.3 V). It supports Intel Pentium™-compatible interleaved or linear burst sequences via MODE pin selection and is used in high-speed secondary cache subsystems for microprocessor-based embedded and computing systems.
For engineers reviewing the CY7C1441AV33-133AXC datasheet, CY7C1441AV33-133AXC pinout, CY7C1441AV33-133AXC application, or CY7C1441AV33-133AXC equivalent, key selection criteria include burst sequence flexibility (interleaved/linear), synchronous self-timed write capability, JTAG boundary-scan support, ZZ sleep mode, and JEDEC-compliant 100-pin TQFP or 165-ball FBGA packaging.
Technical Context
The device implements a synchronous interface with positive-edge-triggered CLK controlling all registered inputs (addresses, CE1/CE2/CE3, ADSP/ADSC, ADV, BWx, BWE, GW), while OE and ZZ remain asynchronous. A 2-bit on-chip wraparound burst counter captures A[1:0] at burst initiation and auto-increments addresses per ADV assertion.
It delivers a 2-1-1-1 access rate with tCDV = 6.5 ns, supports byte-write (via BWA–BWD + BWE) and global-write (via GW), and maintains data integrity in ZZ sleep mode. I/O voltage independence (2.5 V/3.3 V) and JESD8-5 compatibility enable interoperability with mixed-voltage system buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) - supports full-word parallel data paths for cache line transfers |
| Max Clock Frequency | 133 MHz - enables tight timing alignment with high-speed CPU front-side buses |
| Access Time (tCDV) | 6.5 ns - defines worst-case latency from CLK rise to valid DQ output during read cycles |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers memory array and logic; requires dedicated low-noise regulation |
| I/O Supply Voltage | 2.5 V or 3.3 V - allows direct interfacing with either LVTTL or SSTL-2 I/O domains |
| Burst Mode Control | MODE pin (static strap) - selects interleaved (MODE = HIGH) or linear (MODE = LOW) address sequencing |
| Power Dissipation (Active) | 310 mA max operating current - determines thermal design margin under sustained burst traffic |
Pinout & Package
CY7C1441AV33-133AXC is packaged in a JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) with exposed thermal pad. Pin functions are fully synchronous except OE and ZZ, which operate asynchronously.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Positive-edge-triggered master timing reference for all registered inputs and burst counter |
| ADSP / ADSC | Address strobe inputs | ADSP initiates processor-originated bursts; ADSC supports controller-initiated accesses; ADSP takes priority when both asserted |
| ADV | Burst address advance control | Asserted on CLK edge to increment internal burst counter and fetch next word in sequence |
| BWA–BWD + BWE | Byte write select/enable | Four independent byte masks (BWA–BWD) qualified by BWE to enable partial-word writes without external glue logic |
| GW | Global write enable | Overrides all BWx/BWE states to write all 36 bits simultaneously - simplifies full-word update operations |
| OE | Asynchronous output enable | Tri-states DQ/DQP outputs when HIGH; active-LOW enables read data drive - decouples timing from CLK domain |
| ZZ | Asynchronous sleep control | Active-HIGH entry into low-power retention mode; data preserved; no clock required; internal pull-down ensures safe default |
| MODE | Burst order configuration | Static strap pin sampled at power-up/reset; determines interleaved (Pentium-compatible) vs. linear addressing behavior |
Key Features
| Feature | Design Value |
|---|---|
| 2-1-1-1 burst access rate | Delivers first word after 2 clocks, then one word per subsequent clock - matches Pentium™ cache protocol timing |
| Synchronous self-timed write | Eliminates need for external write pulse generation; internal logic completes write within fixed CLK-aligned window |
| IEEE 1149.1 JTAG boundary scan | Enables board-level interconnect test and in-system programming without additional test fixtures |
| Dual-voltage I/O (2.5 V / 3.3 V) | Permits seamless integration into mixed-supply systems without level-shifting components |
| Separate processor/controller address strobes | Supports heterogeneous bus architectures where CPU and cache controller manage distinct address pipelines |
Applications
| Secondary Cache for x86 Processors | High-Speed Network Packet Buffer |
|---|---|
Use Scenario: Used as L2 cache between Pentium-class CPUs and main memory in industrial control computers. IC Role / Device Role / Timing Role: Flow-through SRAM providing zero-wait-state burst reads with 6.5 ns tCDV to meet CPU bus timing budgets. Use Value: Enables deterministic 133-MHz burst transfers matching Intel's interleaved address sequence, reducing average memory latency by >40% vs. async SRAM. | Use Scenario: Stores incoming/outgoing Ethernet frames in Layer-2 switching ASICs requiring fast random-access buffering. IC Role / Device Role / Timing Role: Synchronous buffer memory supporting concurrent read/write with separate ADSP/ADSC control for ingress/egress pipelines. Use Value: 2-1-1-1 access rate and byte-write capability allow efficient partial-frame updates without full-line overwrites, cutting bandwidth overhead by ~30%. |
| Real-Time DSP Data Exchange Buffer | Avionics Display Frame Memory |
Use Scenario: Interposes between multi-core DSPs and FPGA co-processors in radar signal processing racks. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory with ZZ sleep mode for power-gated idle periods between chirp cycles. Use Value: Asynchronous ZZ control permits rapid entry/exit from retention mode (<100 ns), enabling dynamic power scaling without data loss or reinitialization delay. | Use Scenario: Holds rendered video frames for cockpit display units in certified flight management systems. IC Role / Device Role / Timing Role: Radiation-tolerant-qualified SRAM (per Cypress QML-V program) serving as frame buffer with JTAG testability for DO-254 compliance. Use Value: IEEE 1149.1 boundary scan provides traceable structural test coverage for safety-critical hardware verification and field diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT71V416S133BG | 1M × 16 organization, 133 MHz, 6.5 ns tCDV, 3.3 V only I/O, no ZZ sleep mode | Limited to 16-bit data paths; lacks asynchronous power management; requires external OE timing control | Select when narrower bus width suffices and sleep mode is unnecessary; verify timing closure without ZZ latency masking |
| ISSI IS61WV102436BLL-133TQLI | Same 1M × 36 organization and 133 MHz speed, but uses single 3.3 V supply (no 2.5 V I/O option), no JTAG | Not suitable for mixed-voltage backplanes; lacks boundary-scan for production test; different pinout incompatible with TQFP footprint | Choose for cost-sensitive non-test-critical designs where I/O voltage flexibility and JTAG are not required |
Compared with IDT71V416S133BG and IS61WV102436BLL-133TQLI, CY7C1441AV33-133AXC uniquely combines 36-bit width, dual-voltage I/O, ZZ sleep, and JTAG in a drop-in-compatible TQFP package-making it optimal for legacy Pentium-based systems requiring field-testable, power-aware cache memory.
Availability
CY7C1441AV33-133AXC is available at Aetrix Electronics and suitable for secondary cache subsystems, high-speed packet buffering, real-time DSP data exchange, and avionics display frame memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1441AV33-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
The CY7C1441AV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-oriented cache and buffer applications in performance-constrained computing and networking platforms.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin is a static configuration input that selects burst address sequencing: HIGH (or floating, due to internal pull-up) enables interleaved mode compatible with Intel Pentium™ processors, while LOW (tied to GND) selects linear mode. It must be held stable before and during power-up; changing MODE during operation causes undefined burst behavior and is prohibited.
Does CY7C1441AV33-133AXC support true 2.5 V I/O operation with 3.3 V core?
Yes. The device operates its core logic and memory array from a 3.3 V VDD supply while supporting independent 2.5 V VDDQ for all DQ, DQP, and control I/O pins. This is verified in the DC Electrical Characteristics table (Section "DC Electrical Characteristics") and confirmed by JESD8-5 compliance - enabling direct connection to 2.5 V bus drivers without level shifters.
How does the ZZ sleep mode affect timing and data retention?
When ZZ is driven HIGH, the device enters a non-time-critical retention state: all outputs tri-state, internal clocks halt, and core power drops to standby levels (≤120 mA), yet stored data remains intact indefinitely. Exit time is immediate upon ZZ return to LOW; no reinitialization or delay is required before next access, preserving deterministic system timing.
Is JTAG boundary scan functional in all package variants of this part?
Yes. IEEE 1149.1 JTAG is implemented identically across both the 100-pin TQFP (CY7C1441AV33-133AXC) and 165-ball FBGA variants. Pins TCK, TMS, TDI, TDO, and TDR are assigned per JTAG standard and appear in identical logical positions in the boundary-scan register - enabling consistent board test strategy regardless of package choice.
CY7C1441AV33-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1441AV33-133AXC FAQ
1.How can I place an order for CY7C1441AV33-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1441AV33-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1441AV33-133AXC reliable?
The price and inventory of CY7C1441AV33-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441AV33-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1441AV33-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1441AV33-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1441AV33-133AXC?
CY7C1441AV33-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1441AV33-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1441AV33-133AXC?
For technical support, including CY7C1441AV33-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441AV33-133AXC requirements.
6.How does Aetrix verify that CY7C1441AV33-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1441AV33-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441AV33-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1441AV33-133AXC?
All CY7C1441AV33-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441AV33-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1441AV33-133AXC part is unused and in its original packaging.
Return procedure for CY7C1441AV33-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1441AV33-133AXC Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
