Infineon Technologies CY7C1441AV33-133AXIT

Overview

CY7C1441AV33-133AXIT from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous flow-through SRAM with 133-MHz bus operation, 6.5 ns clock-to-output delay, 3.3 V core supply, and dual-voltage I/O support (2.5 V or 3.3 V). It features user-selectable interleaved/linear burst sequences via MODE pin, synchronous self-timed write, and IEEE 1149.1 JTAG boundary scan - designed for high-speed secondary cache in Pentium-class microprocessor systems.

For engineers reviewing the CY7C1441AV33-133AXIT datasheet, CY7C1441AV33-133AXIT pinout, CY7C1441AV33-133AXIT application, or CY7C1441AV33-133AXIT equivalent, key selection criteria include burst sequence flexibility (interleaved vs. linear), ZZ sleep mode support, JEDEC-compliant TQFP/FBGA packaging, and synchronous address strobe handling (ADSP/ADSC) for cache coherency in embedded computing platforms.

Technical Context

The device implements a 2-bit on-chip wraparound burst counter that captures A[1:0] at ADSP/ADSC assertion and auto-increments addresses during burst reads/writes. All synchronous inputs - including A[1:0], CE1–CE3, ADSP, ADSC, ADV, BWx, BWE, GW, and CLK - are registered on the rising edge of CLK, ensuring deterministic timing alignment.

Asynchronous controls OE and ZZ operate independently of CLK: OE enables tri-state output control during read cycles, while ZZ places the device in low-power sleep with data retention. I/O voltage flexibility (2.5 V or 3.3 V) and JESD8-5-compatible signaling allow interoperability with mixed-voltage processor buses.

Key Specifications

Pinout & Package

CY7C1441AV33-133AXIT is available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm) packages. Pin functions are identical across both packages; TQFP pinout is used for reference below.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with IS61WV102432BLL-133TQLI and AS7C31026B-133JCIN, CY7C1441AV33-133AXIT uniquely combines 36-bit parity I/O, configurable burst sequencing, IEEE 1149.1 testability, and asynchronous sleep - making it the only option for standards-compliant, power-aware Pentium-class cache implementations.

Availability

CY7C1441AV33-133AXIT is available at Aetrix Electronics and suitable for secondary cache memory, Pentium-class CPU interface, embedded RISC processor cache, and industrial control data buffer applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1441AV33-133AXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

CY7C1441AV33 belongs to Cypress's synchronous SRAM product line, engineered specifically for low-latency, burst-mode cache subsystems in x86 and RISC-based computing platforms requiring deterministic timing and JEDEC-compliant packaging.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin is a static strap input that selects burst sequence order: HIGH (or VDD-connected/floating) enables interleaved burst for Pentium/i486 compatibility, while LOW (GND-connected) selects linear burst for RISC or custom processors. It is sampled only at power-up or reset and must remain static during operation due to internal pull-up (interleaved default).

Can CY7C1441AV33-133AXIT operate with mixed voltage supplies?

Yes - it uses a 3.3 V core supply (VDD) for memory array and logic, while I/O pins (DQ/DQP) support either 2.5 V or 3.3 V VDDQ. This allows direct interfacing with 2.5 V processors without level shifters, provided VDDQ is externally regulated to the selected voltage and meets JESD8-5 compliance.

How does the ZZ sleep mode affect data retention and wake-up timing?

When ZZ is driven HIGH, the device enters a non-time-critical sleep state with full data retention and reduced standby current (≤120 mA). Wake-up occurs synchronously on the next active CLK edge after ZZ returns LOW; no additional stabilization delay is required, and burst operations resume immediately.

Is JTAG boundary scan enabled by default, and how is it disabled?

JTAG is enabled by default via the TAP controller. To disable it, the TAP instruction register must be loaded with the BYPASS instruction using TMS/TCK sequences per IEEE 1149.1 - no hardware modification is needed. Disabling JTAG reduces pin count overhead but forfeits board-level interconnect test capability.