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Infineon Technologies CY7C1441AV33-133BZXI

Part No.:
CY7C1441AV33-133BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1441AV33-133BZXI.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,597

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Product details

Overview

CY7C1441AV33-133BZXI from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous flow-through SRAM with 133-MHz bus operation, 6.5 ns clock-to-output delay, 3.3 V core supply, and dual-voltage I/O support (2.5 V or 3.3 V). It implements a 2-bit on-chip burst counter, supports Intel Pentium™-compatible interleaved or linear burst sequences via MODE pin selection, and is used in high-speed secondary cache subsystems for microprocessor-based embedded and computing systems.

For engineers reviewing the CY7C1441AV33-133BZXI datasheet, CY7C1441AV33-133BZXI pinout, CY7C1441AV33-133BZXI application, or CY7C1441AV33-133BZXI equivalent, key selection criteria include synchronous burst timing compliance, JEDEC-standard TQFP/FBGA package compatibility, ZZ sleep mode behavior, JTAG boundary-scan support, and byte-write versus global-write control logic.

Technical Context

The device operates synchronously with all address, data, and control inputs registered on the rising edge of CLK, while OE and ZZ remain asynchronous. Its flow-through architecture eliminates pipeline latency between consecutive burst reads, enabling 2-1-1-1 access rates - two-cycle initial access followed by single-cycle subsequent accesses.

Burst addressing is managed by a 2-bit wraparound counter initialized from A[1:0], advanced by ADV, and selected between interleaved (MODE = HIGH) or linear (MODE = LOW) sequences. Write operations are self-timed and support both byte-level (via BWA–BWD + BWE) and global (via GW) write modes, with CE1/CE2/CE3 enabling depth-expansion and bank selection.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (1M × 36 organization), enabling full-word cache line storage without external width expansion.
Max Clock Frequency133 MHz - defines maximum sustained burst throughput of up to 4.8 GB/s (36-bit × 133 MHz).
Access Time (tCDV)6.5 ns - guaranteed clock-to-data valid delay at 133 MHz, critical for meeting tight CPU/cache timing budgets.
Core Supply Voltage3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation.
I/O Supply Voltage2.5 V or 3.3 V - allows direct interface to either 2.5 V or 3.3 V system buses without level shifters.
Burst Mode ControlStatic MODE pin - selects interleaved (Pentium-compatible) or linear burst order; must be stable during operation.
Sleep ModeAsynchronous ZZ input - reduces standby current to ≤120 mA while preserving data integrity; no timing constraints on entry/exit.

Pinout & Package

CY7C1441AV33-133BZXI is packaged in a JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) with exposed thermal pad. Pin functions are fully defined per Cypress Document No. 38-05357 Rev. *N.

Pin/TerminalCircuit RoleDesign Meaning
CLKSynchronous clock inputRising-edge-triggered master timing reference for all registered inputs and burst counter advancement.
ADSP / ADSCAddress strobe inputsADSP initiates processor-originated bursts; ADSC enables controller-initiated bursts; ADSP takes priority when both asserted.
ADVBurst address advanceAsserted on CLK rise to increment internal burst counter; controls sequential address generation within burst window.
MODEBurst sequence selectorStatic strap pin: HIGH → interleaved (Pentium), LOW → linear; must be fixed before operation begins.
ZZAsynchronous sleep enableActive-HIGH signal placing device in low-power retention mode; no clock required; data preserved.
OEAsynchronous output enableControls I/O direction: LOW → outputs enabled; HIGH → tri-state; masked during first read cycle after deselect.
BWA–BWD, BWE, GWWrite control inputsByte-write select + enable (BWA–BWD/BWE) or global write override (GW); all sampled synchronously on CLK rise.

Key Features

FeatureDesign Value
Flow-through synchronous architectureEliminates pipeline stalls between burst reads - delivers true 2-1-1-1 access pattern for predictable cache latency.
User-selectable burst orderHardware-mode pin (MODE) configures interleaved or linear addressing without firmware overhead or configuration registers.
Synchronous self-timed writesOn-chip write timing control removes external write-pulse generation requirements and simplifies timing closure.
IEEE 1149.1 JTAG boundary scanEnables board-level testability and interconnect verification without requiring functional access to memory contents.
Dual-voltage I/O supportIndependent VDDQ pins allow simultaneous connection to 2.5 V or 3.3 V buses - avoids level-shifter components in mixed-voltage designs.

Applications

Secondary Cache for x86 ProcessorsHigh-Speed Network Packet Buffer

Use Scenario: Used as L2 cache in embedded x86 systems (e.g., Intel Pentium-class CPUs) requiring burst-aligned memory access with minimal glue logic.

IC Role / Device Role / Timing Role: Flow-through SRAM provides deterministic 6.5 ns tCDV and 2-1-1-1 burst timing to meet CPU cache controller timing windows.

Use Value: Eliminates need for external pipelining logic and supports native Pentium interleaved burst protocol via MODE pin configuration.

Use Scenario: Stores incoming/outgoing Ethernet or PCIe packet headers and metadata in real-time switching fabric ASICs.

IC Role / Device Role / Timing Role: Acts as low-latency, burst-capable buffer interfacing directly with 36-bit wide packet processing datapaths.

Use Value: 133-MHz operation and synchronous self-timed writes ensure deterministic packet buffering with zero-cycle write setup overhead.

Industrial Motion Controller MemoryAvionics Data Acquisition Buffer

Use Scenario: Holds real-time servo position tables and motion profile segments in CNC or robotics controllers operating under strict jitter constraints.

IC Role / Device Role / Timing Role: Provides glitch-free, deterministic read/write access with ZZ sleep mode for power-gated idle periods.

Use Value: Asynchronous ZZ control enables rapid entry/exit from low-power state without clock gating or software intervention.

Use Scenario: Captures time-stamped sensor samples (e.g., inertial measurement units) in DO-254-compliant flight control systems.

IC Role / Device Role / Timing Role: Serves as radiation-tolerant (indirectly, via packaging and design) burst-access buffer with JTAG testability for certification traceability.

Use Value: IEEE 1149.1 boundary scan supports structural test coverage required for airborne hardware qualification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102436BLL-133TQLI133-MHz 36-Mbit sync SRAM; identical 1M × 36 organization and TQFP-100 package; lacks JTAG and ZZ sleep mode.No built-in sleep mode limits low-power use cases; absence of boundary scan reduces test coverage in safety-critical designs.Select when JTAG and ZZ are not required, and cost sensitivity outweighs testability/power features.
MT48LC32M36A2-133:G133-MHz 1.2-Gbit SDRAM (32M × 36), not pin-compatible; requires refresh, command decoding, and initialization.SDRAM architecture introduces variable latency and refresh overhead unsuitable for deterministic cache timing.Only consider if capacity >36 Mbit is mandatory and system can accommodate SDRAM controller complexity and timing non-determinism.

Compared with IS61WV102436BLL-133TQLI and MT48LC32M36A2-133:G, CY7C1441AV33-133BZXI uniquely combines deterministic flow-through timing, hardware-configurable burst order, JTAG testability, and asynchronous sleep - making it irreplaceable in certified, low-jitter, or legacy x86-compatible cache designs.

Availability

CY7C1441AV33-133BZXI is available at Aetrix Electronics and suitable for secondary cache subsystems, high-speed packet buffering, industrial motion control, and avionics data acquisition requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1441AV33-133BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.

CY7C1441AV33 belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-oriented cache and buffer applications in x86-compatible and real-time deterministic systems.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin statically selects burst address order: HIGH enables interleaved (Intel Pentium-compatible), LOW enables linear. It is a strap pin with internal pull-up, so tying to GND selects linear mode. It must remain static during operation - changing MODE mid-burst causes undefined behavior and violates timing specifications per datasheet Section 7.

Does CY7C1441AV33-133BZXI require an external clock divider or PLL to operate at 133 MHz?

No. The device accepts a clean 133-MHz single-ended CMOS clock directly on the CLK pin. All internal timing-including burst counter advancement, address registration, and output enable synchronization-is derived from this clock. No external frequency synthesis or division is needed, as confirmed by AC switching characteristics table (tSKO, tCH, tCL) in datasheet Rev. *N, Page 22.

Can CE2 be left unconnected, and what is its default logic state?

CE2 is an active-HIGH synchronous chip enable sampled on CLK rise. It has no internal pull-up or pull-down; leaving it floating risks metastability and undefined selection behavior. Per datasheet Section 6.2, CE2 must be actively driven HIGH or LOW - recommended practice is to tie to VDD for enabled operation or to GND for disabled operation, depending on system architecture.

Is the ZZ sleep mode compatible with asynchronous wake-up, and does it affect data retention time?

Yes, ZZ is fully asynchronous: asserting HIGH places the device in sleep mode immediately, regardless of CLK state, and deasserting LOW restores full operation within one clock cycle. Data retention is guaranteed indefinitely under ZZ mode at rated temperature (–40°C to +85°C), as specified in DC Electrical Characteristics (ISB ≤ 120 mA, VDD = 3.3 V) and confirmed in Sleep Mode section (Page 8) of datasheet Rev. *N.

CY7C1441AV33-133BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1441AV33-133BZXI FAQ

1.How can I place an order for CY7C1441AV33-133BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1441AV33-133BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1441AV33-133BZXI reliable?

The price and inventory of CY7C1441AV33-133BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441AV33-133BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1441AV33-133BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1441AV33-133BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1441AV33-133BZXI?

CY7C1441AV33-133BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1441AV33-133BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1441AV33-133BZXI?

For technical support, including CY7C1441AV33-133BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441AV33-133BZXI requirements.

6.How does Aetrix verify that CY7C1441AV33-133BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1441AV33-133BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441AV33-133BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1441AV33-133BZXI?

All CY7C1441AV33-133BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441AV33-133BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1441AV33-133BZXI part is unused and in its original packaging.

Return procedure for CY7C1441AV33-133BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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