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Infineon Technologies CY7C1441KV25-133BZXI
- Part No.:
- CY7C1441KV25-133BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1441KV25-133BZXI.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,400
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Product details
Overview
CY7C1441KV25-133BZXI from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous flow-through SRAM with 133-MHz bus operation, 2.5-V core/I/O supply, 6.5 ns clock-to-output delay, and JTAG boundary scan support in a 165-ball FBGA package. It serves as high-speed secondary cache memory for microprocessor systems requiring burst-mode data access with interleaved or linear addressing.
For engineers reviewing the CY7C1441KV25-133BZXI datasheet, CY7C1441KV25-133BZXI pinout, CY7C1441KV25-133BZXI application, or CY7C1441KV25-133BZXI equivalent, key selection criteria include synchronous burst timing, byte-write granularity via BWx/BWE, dual address strobe support (ADSP/ADSC), ZZ sleep mode, and JEDEC JESD8-5 I/O compatibility.
Technical Context
The device implements a 2-bit on-chip wraparound burst counter that captures A[1:0] at ADSP/ADSC assertion and auto-increments addresses during burst sequences. All synchronous inputs-including address, data, CE1/CE2/CE3, ADSP/ADSC/ADV, BWx, BWE, and GW-are registered on the rising edge of CLK.
Asynchronous controls include OE (tri-state output enable) and ZZ (sleep mode), both active-low except ZZ (active-high). MODE pin selects interleaved (HIGH) or linear (LOW) burst order statically; burst advancement is controlled solely by ADV, independent of clock phase after initial capture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 common I/O configuration) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns clock period for synchronous burst timing |
| Access Time (tCDV) | 6.5 ns - maximum clock-to-output delay defines real-time data availability window |
| Core/I/O Voltage | 2.5 V - single-supply operation simplifies power delivery vs. split-rail designs |
| Burst Support | Interleaved or linear - MODE-pin selectable to match Pentium or generic controller requirements |
| Write Architecture | Synchronous self-timed write - eliminates external write pulse timing constraints |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - supports high-density PCB layout with JTAG test access |
Pinout & Package
The CY7C1441KV25-133BZXI is housed in a Pb-free 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 15 mm × 17 mm × 1.4 mm, optimized for thermal dissipation and signal integrity in high-speed cache applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Rising-edge-triggered master timing reference for all synchronous registers and burst counter |
| ADSP / ADSC | Address Strobe Inputs | Processor- or controller-initiated address capture; ADSP takes priority when both asserted |
| ADV | Address Advance | Controls automatic address increment during burst cycles; sampled synchronously on CLK rise |
| BWA–BWD, BWE | Byte Write Controls | Enable selective 8-bit writes per DQ group; BWE qualifies all BWx signals |
| GW | Global Write Enable | Overrides byte-write select logic to write all 36 bits simultaneously on one clock edge |
| OE | Output Enable | Asynchronous tri-state control of DQ/DQP I/Os; masked during first read cycle after deselection |
| ZZ | Sleep Mode Input | Active-HIGH entry into low-power state with data retention; internal pull-down ensures safe default |
| MODE | Burst Order Select | Static strap pin: HIGH = interleaved (Pentium-compatible), LOW = linear; internal pull-up |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; TCK must be tied to VSS if unused |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Eliminates pipeline bubbles between consecutive burst reads-enables continuous 2-1-1-1 access rate |
| Dual address strobe support | ADSP and ADSC allow coexistence of processor and cache controller without arbitration logic |
| Synchronous self-timed write | Removes need for external write-strobe timing control; write completion is internally managed per clock edge |
| Configurable burst order | MODE pin selection enables hardware-matched burst sequencing for legacy (Pentium) or custom controllers |
| JTAG boundary scan | 165-ball FBGA testability without bed-of-nails fixtures; supports IEEE 1149.1 compliance verification |
Applications
| Secondary Cache Memory | High-Speed Data Buffering |
|---|---|
|
Use Scenario: L2 cache for x86-compatible microprocessors operating at ≥100 MHz bus speeds. IC Role / Device Role / Timing Role: Flow-through SRAM providing zero-wait-state burst reads with 6.5 ns tCDV to meet tight CPU fetch deadlines. Use Value: Enables 133-MHz bus synchronization without glue logic, reducing latency versus asynchronous SRAM alternatives. |
Use Scenario: Real-time packet buffering in network interface controllers handling Gigabit Ethernet traffic. IC Role / Device Role / Timing Role: Synchronous 36-bit-wide data staging buffer supporting burst-aligned DMA transfers. Use Value: 2-1-1-1 access pattern matches typical Ethernet frame payload alignment, minimizing bus turnaround overhead. |
| Industrial Motion Control | Avionics Data Acquisition |
|
Use Scenario: Position lookup table storage in servo drive firmware executing deterministic 10 kHz control loops. IC Role / Device Role / Timing Role: Deterministic-access memory holding encoder interpolation coefficients accessed via linear burst. Use Value: MODE-strapped linear burst ensures predictable address progression critical for time-critical motion profiles. |
Use Scenario: Sensor data aggregation in flight data recorders capturing multi-channel analog-to-digital samples. IC Role / Device Role / Timing Role: High-reliability SRAM with ZZ sleep mode preserving data during power transitions. Use Value: 2.5-V operation and JTAG testability meet DO-254 design assurance requirements for airborne systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-133TQLI | 133-MHz 36-Mbit sync SRAM; 2.5-V core/I/O; no JTAG; 165-ball FBGA; tCDV = 6.5 ns | Lacks ZZ sleep mode and MODE-selectable burst order; requires external burst control logic | Preferred where JTAG testability and flexible burst sequencing are not required; lower unit cost |
| MT48LC32M32B2-75:G | SDR SDRAM (128-Mbit); 3.3-V I/O; asynchronous refresh; 75-MHz max clock; different timing model | Requires refresh management and command decoding; not pin-compatible or functionally drop-in | Only viable for bandwidth-constrained systems accepting higher latency and software overhead |
Compared with IS61WV102436BLL-133TQLI and MT48LC32M32B2-75:G, the CY7C1441KV25-133BZXI uniquely integrates JTAG testability, programmable burst order, and ZZ sleep-critical for aerospace and industrial designs requiring traceable validation and power-aware operation.
Availability
CY7C1441KV25-133BZXI is available at Aetrix Electronics and suitable for secondary cache memory, high-speed data buffering, industrial motion control, and avionics data acquisition requiring stable component supply across extended product lifecycles.
Supply support for CY7C1441KV25-133BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and computing markets.
The CY7C1441KV25 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for microprocessor cache interfaces demanding deterministic burst timing, low-latency flow-through access, and JEDEC-compliant I/O signaling.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin statically selects burst address sequence: HIGH (or floating, due to internal pull-up) enables interleaved burst order compatible with Pentium processors; LOW (tied to GND) selects linear burst. It must remain static during operation and cannot be toggled mid-burst. Incorrect strapping causes invalid address generation and data corruption.
How does the ZZ sleep mode affect power consumption and data retention?
When ZZ is driven HIGH, the device enters a non-time-critical sleep state drawing ≤10 µA (typical) while preserving all stored data. Core and I/O supplies remain powered; no refresh or reinitialization is needed upon wake. Leaving ZZ floating defaults to LOW via internal pull-down, ensuring normal operation.
Can ADSP and ADSC be used simultaneously, and what happens if both are asserted?
No-ADSP and ADSC are mutually exclusive. When both are asserted LOW, only ADSP is recognized and processed; ADSC is ignored. This prioritization prevents address register contention and ensures deterministic behavior in mixed-processor/controller environments.
Is the CY7C1441KV25-133BZXI compatible with 3.3-V I/O systems?
No. The device requires 2.5-V I/O supply (VDDQ) and is JEDEC JESD8-5 compliant-not JESD8-11. Connecting to 3.3-V buses risks overvoltage damage to input buffers and violates AC timing specifications. Level-shifting circuitry is mandatory for interfacing with 3.3-V controllers.
CY7C1441KV25-133BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1441KV25-133BZXI FAQ
1.How can I place an order for CY7C1441KV25-133BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1441KV25-133BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1441KV25-133BZXI reliable?
The price and inventory of CY7C1441KV25-133BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441KV25-133BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1441KV25-133BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1441KV25-133BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1441KV25-133BZXI?
CY7C1441KV25-133BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1441KV25-133BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1441KV25-133BZXI?
For technical support, including CY7C1441KV25-133BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441KV25-133BZXI requirements.
6.How does Aetrix verify that CY7C1441KV25-133BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1441KV25-133BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441KV25-133BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1441KV25-133BZXI?
All CY7C1441KV25-133BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441KV25-133BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1441KV25-133BZXI part is unused and in its original packaging.
Return procedure for CY7C1441KV25-133BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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