Infineon Technologies CY7C1441KV25-133BZXIT
- Part No.:
- CY7C1441KV25-133BZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1441KV25-133BZXIT.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1441KV25-133BZXIT from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous flow-through SRAM with 133-MHz bus operation, 2.5-V core/I/O supply, 6.5 ns clock-to-output delay, and JTAG boundary scan support in a 165-ball FBGA package. It serves as high-speed secondary cache memory for Pentium-class microprocessors requiring burst-mode data access with interleaved or linear addressing.
For engineers reviewing the CY7C1441KV25-133BZXIT datasheet, CY7C1441KV25-133BZXIT pinout, CY7C1441KV25-133BZXIT application, or CY7C1441KV25-133BZXIT equivalent, key selection criteria include synchronous burst timing, byte-write granularity via BWx/BWE, dual address strobe support (ADSP/ADSC), ZZ sleep mode, and JEDEC JESD8-5 I/O compatibility.
Technical Context
The device implements a 2-bit on-chip wraparound burst counter that captures A[1:0] at ADSP/ADSC assertion and auto-increments addresses during burst cycles. All synchronous inputs-including address, CE1/CE2/CE3, ADSP/ADSC/ADV, BWx, BWE, GW, and CLK-are registered on the rising edge of CLK.
Asynchronous controls OE and ZZ operate independently of CLK: OE enables tri-state output control with masking during deselected-state read startup, while ZZ places the device in low-power sleep with data retention. MODE pin statically selects interleaved (HIGH) or linear (LOW) burst order, supporting Pentium-compatible cache protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 common I/O configuration) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns cycle time for high-bandwidth cache interfaces |
| Access Time (tCDV) | 6.5 ns - maximum clock-to-output delay under 133-MHz operation |
| Power Supply | 2.5 V core (VDD) and 2.5 V I/O (VDDQ) - single-supply simplifies board power design |
| Burst Mode | User-selectable interleaved or linear via MODE pin - matches Pentium or custom controller requirements |
| Write Control | Synchronous self-timed write with global (GW) and byte-level (BWx + BWE) enable - eliminates external write timing logic |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - supports high-density routing and thermal performance |
Pinout & Package
The CY7C1441KV25-133BZXIT is housed in a Pb-free 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 15 mm × 17 mm × 1.4 mm, optimized for high-speed signal integrity and thermal dissipation in cache subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock for all synchronous registers and burst counter increment |
| ADSP / ADSC | Address strobe inputs | Processor- or controller-initiated address capture; ADSP takes priority when both asserted |
| ADV | Burst address advance | Drives internal counter to generate next burst address on rising CLK edge |
| BWA–BWD, BWE | Byte write control | Four independent byte masks + shared enable - enables partial-word writes without read-modify-write |
| GW | Global write enable | Overrides BWx/BWE to write all 36 bits simultaneously - simplifies full-word update sequences |
| OE | Asynchronous output enable | Tri-states DQ/DQP outputs asynchronously; masked during first read after deselect |
| ZZ | Asynchronous sleep input | Places device in low-power state with data retention; internal pull-down allows floating for active mode |
| MODE | Burst sequence selector | Static strap pin: HIGH = interleaved (Pentium), LOW = linear - must remain stable during operation |
| TCK/TMS/TDI/TDO | JTAG boundary scan interface | IEEE 1149.1-compliant test access port - enables in-system verification and interconnect testing |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Eliminates pipeline stalls by delivering data on same clock cycle as address latch - critical for zero-wait-state cache |
| 2-1-1-1 access rate | Supports four consecutive 36-bit reads per five clocks - sustains 133-MHz throughput with minimal latency overhead |
| Synchronous self-timed write | Internal write timing control removes need for external write pulse generation or delay matching |
| Dual address strobe support | Independent ADSP (processor) and ADSC (controller) inputs enable flexible cache coherency management |
| JTAG boundary scan (IEEE 1149.1) | Enables automated PCB test coverage for 165-ball FBGA interconnects without physical probe access |
Applications
| Secondary Cache for x86 Processors | High-Speed Network Buffer Memory |
|---|---|
Use Scenario: Used as L2 cache between Pentium-class CPUs and main memory in embedded computing modules. IC Role / Device Role / Timing Role: Flow-through SRAM providing zero-wait-state burst reads with interleaved addressing aligned to CPU cache line fetch patterns. Use Value: 6.5 ns tCDV and 2-1-1-1 access rate sustain >1 Gbps sustained bandwidth, reducing CPU stall cycles. | Use Scenario: Stores packet headers and metadata in 10/25 GbE switch fabric ASICs requiring deterministic latency. IC Role / Device Role / Timing Role: Synchronous burst buffer interfacing directly with SerDes MAC controllers via ADSP/ADV handshake protocol. Use Value: Byte-write select (BWx/BWE) enables header-only updates without disturbing payload data in adjacent bytes. |
| Industrial Motion Controller FIFO | Avionics Data Acquisition Buffer |
Use Scenario: Buffers real-time position/velocity commands between FPGA motion sequencers and servo drive ICs. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via ADSP/ADSC separation - one port for command load, one for execution fetch. Use Value: ZZ sleep mode reduces standby current to <100 µA while preserving command queue integrity during idle intervals. | Use Scenario: Captures synchronized sensor samples from multiple ADCs in flight control systems with strict DO-254 timing compliance. IC Role / Device Role / Timing Role: JTAG boundary scan validates all 165-ball solder joints pre-flight, meeting avionics traceability requirements. Use Value: 2.5-V core/I/O and -40°C to +85°C industrial temp range ensure reliable operation in sealed, conduction-cooled enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C361024B-133BIN | 36-Mbit (1M × 36), 2.5-V, 133-MHz, but uses 165-ball FBGA with different pinout and no JTAG | Lacks IEEE 1149.1 boundary scan; requires external test strategy for high-density routing validation | Select if JTAG is unnecessary and pin compatibility with legacy AS7C layout is required |
| IS61WV102436B-133TQLI | 36-Mbit (1M × 36), 2.5-V, 133-MHz, 165-ball FBGA, but supports only linear burst (no MODE pin) | No interleaved burst support - incompatible with Pentium-derived cache controllers | Select for new designs using custom linear-burst controllers where interleaved mode is unused |
Compared with AS7C361024B-133BIN and IS61WV102436B-133TQLI, the CY7C1441KV25-133BZXIT uniquely combines JTAG testability, dual-burst-mode flexibility, and guaranteed 6.5 ns tCDV across temperature - making it optimal for safety-critical or high-mix production environments requiring full traceability and cache protocol agility.
Availability
CY7C1441KV25-133BZXIT is available at Aetrix Electronics and suitable for secondary cache subsystems, high-speed network packet buffers, industrial motion controller FIFOs, and avionics data acquisition systems requiring stable component supply and long-term manufacturability.
Supply support for CY7C1441KV25-133BZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable system-on-chip, and USB-C/USB-PD solutions.
The CY7C1441KV25 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency cache and buffering applications in x86-compatible and custom high-end embedded systems.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst address sequence: HIGH (or floating) enables interleaved burst (Pentium-compatible), LOW enables linear burst. It is a static strap pin with internal pull-up; must be set before operation and held stable during all accesses. Incorrect or dynamic toggling causes undefined burst address generation and data corruption.
How does the ZZ sleep mode affect power consumption and data retention?
When ZZ is driven HIGH, the device enters non-time-critical sleep mode with core clocks gated and I/O drivers disabled, reducing ICC to ≤100 µA while preserving all stored data. Data remains valid for ≥24 hours at +85°C. ZZ has an internal pull-down, so leaving it unconnected defaults to active operation.
Can ADSP and ADSC be used simultaneously, and what happens if both are asserted?
No - ADSP and ADSC are mutually exclusive. When both are asserted LOW, the device recognizes only ADSP and ignores ADSC. This priority ensures deterministic address capture in mixed-processor/controller systems. CE1 must be active for either strobe to take effect; otherwise, both are masked.
What is the role of the ADV signal during burst operations?
ADV controls automatic address advancement: when asserted LOW on a rising CLK edge, it increments the internal 2-bit burst counter to generate the next sequential or interleaved address. It is sampled synchronously and must be timed to align with burst clock edges - not used during single-access cycles.
CY7C1441KV25-133BZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1441KV25-133BZXIT FAQ
1.How can I place an order for CY7C1441KV25-133BZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1441KV25-133BZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1441KV25-133BZXIT reliable?
The price and inventory of CY7C1441KV25-133BZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441KV25-133BZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1441KV25-133BZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1441KV25-133BZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1441KV25-133BZXIT?
CY7C1441KV25-133BZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1441KV25-133BZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1441KV25-133BZXIT?
For technical support, including CY7C1441KV25-133BZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441KV25-133BZXIT requirements.
6.How does Aetrix verify that CY7C1441KV25-133BZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1441KV25-133BZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441KV25-133BZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1441KV25-133BZXIT?
All CY7C1441KV25-133BZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441KV25-133BZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1441KV25-133BZXIT part is unused and in its original packaging.
Return procedure for CY7C1441KV25-133BZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1441KV25-133BZXIT Tags

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