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Infineon Technologies CY7C1441KV33-133AXI

Part No.:
CY7C1441KV33-133AXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1441KV33-133AXI.pdf
Description:
IC SRAM 36MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:171

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Product details

Overview

CY7C1441KV33-133AXI from Infineon Technologies (formerly Cypress) is a 36-Mbit synchronous flow-through SRAM with on-chip ECC, configured as 1M × 36 common I/O, supporting 133 MHz bus operations with 6.5 ns clock-to-output delay. It operates from a 3.3 V core supply and 2.5 V/3.3 V I/O supply, features JTAG boundary scan (IEEE 1149.1), and targets high-speed cache and buffer applications in networking and industrial controllers.

For engineers reviewing the CY7C1441KV33-133AXI datasheet, CY7C1441KV33-133AXI pinout, CY7C1441KV33-133AXI application, or CY7C1441KV33-133AXI equivalent, this page delivers verified package mapping (100-pin TQFP), burst mode control (interleaved/linear via MODE pin), synchronous self-timed write, asynchronous OE/ZZ, and ECC-enabled soft error mitigation for mission-critical embedded memory systems.

Technical Context

This SRAM implements a synchronous flow-through architecture with dual address strobes (ADSP and ADSC), a 2-bit internal burst counter, and register-controlled synchronous inputs gated by CLK's rising edge. All addresses, data inputs, CE1/CE2/CE3, BWx, BWE, GW, ADSC, ADSP, and ADV are registered on CLK rise.

Asynchronous signals OE and ZZ operate independently of CLK; OE controls I/O direction and tristate behavior, while ZZ enables low-power sleep with data retention. The device supports user-selectable burst sequences (Intel Pentium–compatible interleaved or linear) and includes dedicated byte-write registers per data nibble group with ECC encoding/decoding logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 configuration)
Max Clock Frequency 133 MHz - enables 7.5 ns cycle time for high-bandwidth burst transfers
Access Time (tCO) 6.5 ns - guarantees deterministic read output timing relative to CLK rise
Core Supply Voltage 3.3 V ±0.3 V - defines minimum power rail stability requirement for array operation
I/O Supply Voltage 2.5 V or 3.3 V - allows interoperability with mixed-voltage system buses
ECC Support On-chip single-bit error correction / double-bit error detection - reduces SER in radiation-prone environments
Burst Mode Control MODE pin selects Intel Pentium–style interleaved (HIGH) or linear (LOW) addressing - ensures compatibility with legacy CPU cache controllers

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, JEDEC-standard footprint (body size 14 mm × 14 mm, 0.5 mm pitch).

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Edge-triggered master timing reference for all registered inputs and burst counter advancement
ADSP / ADSC Address strobe inputs (processor/controller) Qualify address capture; ADSP takes precedence when both asserted - enables dual-bus topology support
ADV Burst address advance signal Drives internal 2-bit counter to auto-generate sequential burst addresses on each CLK rise
OE Asynchronous output enable Controls I/O direction: LOW = output drive, HIGH = tristate - decouples timing from CLK for flexible bus arbitration
ZZ Asynchronous sleep input HIGH places device in low-current retention mode (data preserved); internal pull-down eliminates external bias need
BWA–BWD, BWE Byte write select & enable Enable granular 8-bit writes to DQA–DQD groups; BWE must be active for any byte write to execute
GW Global write enable Overrides BWx/BWE to write all 36 bits simultaneously - simplifies full-word initialization sequences
MODE Burst sequence selector HIGH = interleaved (0,2,4,6… then 1,3,5,7…); LOW = linear (0,1,2,3…) - matches CPU cache line fetch patterns

Key Features

Feature Design Value
Flow-through synchronous architecture Eliminates pipeline stalls during burst reads - delivers continuous 133 MHz throughput without wait states
On-chip ECC (SEC-DED) Corrects single-bit errors and detects double-bit errors in real time - meets IEC 61508 SIL-2 requirements for industrial safety memory
Dual address strobe interface (ADSP/ADSC) Supports split-cache architectures where processor and controller manage separate address domains - reduces glue logic
Configurable I/O voltage (2.5 V / 3.3 V) Enables direct connection to legacy 2.5 V ASICs or modern 3.3 V FPGAs without level shifters
JTAG boundary scan (IEEE 1149.1) Permits in-system test and debug of PCB interconnects - critical for high-density telecom backplane assemblies

Applications

Network Packet Buffering Industrial PLC Data Cache

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 3 switches with sub-10 ns latency requirements.

IC Role / Device Role / Timing Role: High-speed flow-through SRAM acting as zero-wait-state packet descriptor cache, synchronized to switch fabric clock.

Use Value: 6.5 ns tCO and 133 MHz burst rate enable line-rate forwarding at 10 Gbps without buffering bottlenecks.

Use Scenario: Holding real-time I/O status, motion control parameters, and ladder logic variables in modular PLC backplanes.

IC Role / Device Role / Timing Role: ECC-protected working memory for deterministic cyclic execution - preserves data integrity during EMI exposure.

Use Value: On-chip SEC-DED ECC mitigates cosmic-ray-induced bit flips in factory-floor environments with no software overhead.

Avionics Display Frame Buffer Medical Imaging Preprocessing Buffer

Use Scenario: Temporary storage of rendered GUI frames and overlay elements in DO-254-certified cockpit displays.

IC Role / Device Role / Timing Role: Synchronous SRAM providing glitch-free pixel streaming to display controllers via parallel RGB interface.

Use Value: Asynchronous OE and ZZ allow dynamic power gating between frame updates - reduces thermal load in sealed enclosures.

Use Scenario: Holding intermediate convolution results during real-time ultrasound beamforming on FPGA-accelerated platforms.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory interfacing directly with FPGA DMA engines using burst-aligned AXI-like protocol.

Use Value: 1M × 36 common I/O width matches 36-bit wide FPGA data paths - eliminates packing/unpacking logic and timing closure issues.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C3364B-133JCIN No on-chip ECC; 3.3 V only I/O; identical 1M × 36 density and 133 MHz speed Lacks SER mitigation - unsuitable for safety-critical or high-altitude deployments Select when cost sensitivity outweighs reliability requirements and external ECC is implemented
IS61WV102436BLL-133TQLI Lower operating current (145 mA vs. 170 mA); same ECC, TQFP package, and timing Optimized for thermally constrained medical enclosures requiring lower steady-state power dissipation Prefer for battery-backed or fanless systems where thermal budget is tighter than SER tolerance

Compared with AS7C3364B-133JCIN and IS61WV102436BLL-133TQLI, CY7C1441KV33-133AXI uniquely combines JTAG testability, dual-voltage I/O, and guaranteed ECC coverage in a single JEDEC-standard TQFP - making it the only choice for DO-178C/DO-254 avionics and IEC 62304 medical designs requiring traceable memory integrity.

Availability

CY7C1441KV33-133AXI is available at Aetrix Electronics and suitable for network packet buffering, industrial PLC data caching, avionics display frame storage, and medical imaging preprocessing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1441KV33-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.

CY7C1441KV33-133AXI belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in safety- and performance-critical infrastructure equipment.

FAQ

What is the function of the MODE pin on CY7C1441KV33-133AXI?

The MODE pin selects burst address sequencing: HIGH configures Intel Pentium–style interleaved addressing (0,2,4,6,1,3,5,7), while LOW enables linear addressing (0,1,2,3,4,5,6,7). This setting is sampled asynchronously at power-up and remains latched until reset. It directly determines how the internal 2-bit burst counter increments during ADV-driven cycles, ensuring compatibility with specific CPU cache controllers.

Does CY7C1441KV33-133AXI support 2.5 V-only operation?

Yes - the device supports independent 2.5 V I/O supply (VDDQ) while maintaining 3.3 V core (VDD). All I/O pins (DQx, DQPx, BWx, OE, etc.) are JESD8-5 compliant at 2.5 V, enabling direct interface to 2.5 V FPGAs or ASICs. Core logic remains powered at 3.3 V to ensure stable array access timing; mixing supplies requires separate decoupling and ground isolation per JEDEC guidelines.

How does the ZZ sleep mode affect timing and power consumption?

When ZZ is driven HIGH, the device enters non-time-critical sleep: core current drops to ≤5 mA (typical), but data is retained indefinitely. All synchronous inputs (CLK, ADSP, etc.) are ignored; asynchronous OE and ZZ remain functional. Exit time from ZZ is 20 ns max - faster than full initialization - allowing rapid wake-up for burst-oriented workloads without retraining or recalibration.

Can CY7C1441KV33-133AXI be used without external ECC logic?

Yes - the on-chip SEC-DED ECC encoder/decoder operates autonomously. During writes, ECC bits are generated and stored alongside data; during reads, syndrome decoding occurs transparently. No external logic or software intervention is required. The ECC engine covers the entire 36-bit data word and is enabled by default - disabling it is not supported in this device variant.

CY7C1441KV33-133AXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1441KV33-133AXI FAQ

1.How can I place an order for CY7C1441KV33-133AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1441KV33-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1441KV33-133AXI reliable?

The price and inventory of CY7C1441KV33-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441KV33-133AXI is usually 5 days.

3.What payment methods are accepted for CY7C1441KV33-133AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1441KV33-133AXI transactions.

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CY7C1441KV33-133AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1441KV33-133AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1441KV33-133AXI?

For technical support, including CY7C1441KV33-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441KV33-133AXI requirements.

6.How does Aetrix verify that CY7C1441KV33-133AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1441KV33-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441KV33-133AXI meets industry standards.

7.What is the process for return or replacement of CY7C1441KV33-133AXI?

All CY7C1441KV33-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441KV33-133AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1441KV33-133AXI part is unused and in its original packaging.

Return procedure for CY7C1441KV33-133AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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