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Infineon Technologies CY7C1441KV33-133BZM

Part No.:
CY7C1441KV33-133BZM
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1441KV33-133BZM.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,862

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Product details

Overview

CY7C1441KV33 from Cypress Semiconductor is a military-temperature 36-Mbit (1M × 36) synchronous flow-through SRAM designed for high-speed secondary cache in embedded computing and defense systems. It supports 133 MHz bus operation, delivers 6.5 ns clock-to-output delay, operates with 3.3 V core and selectable 2.5 V/3.3 V I/O supplies, and implements synchronous self-timed write with interleaved or linear burst addressing.

For engineers reviewing the CY7C1441KV33 datasheet, CY7C1441KV33 pinout, CY7C1441KV33 application, or CY7C1441KV33 equivalent, key selection criteria include burst mode control via MODE pin, dual address strobe support (ADSP/ADSC), IEEE 1149.1 JTAG boundary scan capability, ZZ sleep mode, and JEDEC-compliant TQFP/FBGA packaging for ruggedized deployment.

Technical Context

The CY7C1441KV33 uses a synchronous architecture where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. A 2-bit on-chip wraparound burst counter captures A[1:0] at ADSP/ADSC assertion and auto-increments addresses during burst sequences.

Burst order-interleaved (MODE = HIGH) or linear (MODE = LOW)-is statically configured and determines memory access pattern compatibility with Pentium-class processors. Address advancement is controlled by ADV, while CE1 (active-low), CE2 (active-high), and CE3 (active-low) enable depth-expansion and bank selection in multi-chip configurations.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (1M × 36 organization), enabling full-word cache line storage without external width expansion
Max Clock Frequency133 MHz, supporting sustained burst transfers aligned with high-end microprocessor bus timing
Access Time (tCDV)6.5 ns max from CLK rise to valid DQ output, meeting tight timing budgets in real-time military systems
Core Supply+3.3 V ±0.3 V, compatible with standard LVTTL/SSTL-2 I/O interface domains
I/O Supply OptionsSelectable +2.5 V or +3.3 V, allowing interoperability with mixed-voltage SoC or FPGA interfaces
Operating Temperature−55 °C to +125 °C, qualified for airborne, ground vehicle, and space-qualified avionics applications
Burst ControlUser-selectable interleaved/linear via MODE pin, directly matching Pentium or PowerPC cache controller protocols

Pinout & Package

Available in JEDEC-standard 100-pin TQFP (14 mm × 20 mm) and 165-ball FBGA (13 mm × 15 mm) Pb-free packages. Both packages support military-grade thermal and mechanical reliability.

Pin/TerminalCircuit RoleDesign Meaning
CLKSynchronous clock inputPositive-edge-triggered master timing reference for all registered inputs and internal burst counter
ADSP / ADSCAddress strobe inputsSeparate processor- and controller-initiated address capture; ADSP takes precedence when both asserted
ADVBurst address advanceControls automatic increment of internal burst counter on each rising CLK edge during burst sequence
MODEBurst order selectStatic strap pin: HIGH = interleaved (Pentium-compatible), LOW = linear; must remain stable during operation
ZZAsynchronous sleep enableActive-HIGH entry into low-power non-time-critical sleep mode with full data retention
DQs / DQPx36-bit bidirectional data + parity I/OCommon I/O structure with OE-controlled direction; DQPx lines provide parity for error detection in safety-critical systems
BWA–BWD, BWE, GWByte write controlsPer-byte write masking (BWA–BWD) enabled only when BWE = LOW; GW overrides all for full-word write

Key Features

FeatureDesign Value
Synchronous self-timed writeEliminates external write pulse timing constraints-write cycle completes automatically after clocked data latch
IEEE 1149.1 JTAG boundary scanEnables in-system test and interconnect verification without additional test fixtures in dense PCB layouts
Dual address strobe supportADSP and ADSC allow seamless integration with both CPU and cache controller subsystems in split-bus architectures
Asynchronous OE and ZZOE enables fast output tristate independent of clock; ZZ provides immediate low-power entry without clock dependency
JEDEC-compliant voltage interfacesAll I/Os meet JESD8-5 specs for 2.5 V/3.3 V operation, ensuring signal integrity across mixed-voltage system boundaries

Applications

Avionics Flight Control Unit CacheMilitary Radar Signal Processor Buffer

Use Scenario: Real-time deterministic caching of guidance algorithm coefficients and sensor fusion data in DO-254-certified flight computers.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM serving as Level 2 instruction/data cache between FPGA-based processing core and DDR SDRAM.

Use Value: 6.5 ns tCDV and 133 MHz burst throughput ensure sub-microsecond access to critical control vectors under worst-case temperature extremes.

Use Scenario: Storing intermediate FFT and CFAR results in airborne AESA radar front-end modules operating in −40 °C to +85 °C extended range.

IC Role / Device Role / Timing Role: Flow-through SRAM buffer interfacing between ADC/DSP chain and high-speed serial backplane, synchronized to system clock domain.

Use Value: Interleaved burst mode matches radar pulse repetition interval alignment, reducing latency jitter in time-sensitive beamforming operations.

Tactical Vehicle Electronic Warfare MemorySecure Satellite Communication Modem

Use Scenario: Jamming waveform lookup table storage in compact EW pods requiring radiation-tolerant, wide-temperature memory with fast reconfiguration.

IC Role / Device Role / Timing Role: Standalone SRAM holding encrypted jamming profiles, accessed via microcontroller with ADSP-driven single-cycle reads.

Use Value: ZZ sleep mode reduces standby power to <50 µA while preserving data integrity during intermittent operational windows.

Use Scenario: Storing convolutional encoder/decoder state tables and interleaver buffers in LEO satellite modems exposed to thermal cycling and single-event upsets.

IC Role / Device Role / Timing Role: Parity-enabled (DQPx) SRAM providing fault-detectable memory for forward error correction logic in radiation-hardened FPGA fabric.

Use Value: Built-in DQPx parity I/O lines eliminate need for external parity generators, saving board area and routing complexity in SWaP-constrained payloads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102436BLL-133TQLI133 MHz, 1M × 36, 3.3 V core, but lacks JTAG boundary scan and ZZ sleep modeNo built-in test infrastructure; requires external test access; no low-power sleep statePreferred where cost sensitivity outweighs testability and power management needs
MT48LC32M36A2-133:GSDR SDRAM (not SRAM), 128M × 36, 3.3 V, requires refresh and command protocol overheadHigher density but asynchronous refresh and longer latency; not drop-in compatibleOnly suitable when system architecture accommodates SDRAM timing and controller complexity

Compared with IS61WV102436BLL-133TQLI and MT48LC32M36A2-133:G, the CY7C1441KV33 uniquely combines military-temperature flow-through SRAM performance, JTAG testability, and hardware sleep control-making it irreplaceable in deterministic, safety-critical, and low-power embedded systems where timing predictability and in-field diagnostics are mandatory.

Availability

CY7C1441KV33 is available at Aetrix Electronics and suitable for avionics flight control units, military radar signal processors, tactical electronic warfare systems, and secure satellite communication modems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1441KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and aerospace applications, with emphasis on signal integrity, radiation tolerance, and long-term supply assurance.

The CY7C1441KV33 belongs to Cypress's military-temperature synchronous SRAM product line, engineered specifically for deterministic, low-latency cache and buffer roles in mission-critical embedded systems where timing predictability and environmental resilience are non-negotiable.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst addressing order: HIGH enables interleaved burst (compatible with Intel Pentium processors), LOW enables linear burst. It is a static strap pin with internal pull-up; must be hard-wired to VDD or GND before device operation and held stable during all accesses. Floating is allowed only for default interleaved mode due to internal pull-up.

Does CY7C1441KV33 support true dual-port operation?

No. The CY7C1441KV33 is a synchronous common-I/O SRAM with single-port architecture. It supports concurrent read/write only through pipelined burst cycles-not simultaneous independent access on separate ports. True dual-port functionality requires dedicated dual-port SRAM devices such as the CY7C1355BV33 series.

Can the ZZ (sleep) pin be driven dynamically during normal operation?

Yes-the ZZ pin is asynchronous and active-HIGH. Asserting ZZ HIGH places the device in non-time-critical sleep mode with full data retention and reduced current draw (<50 µA typical). It may be toggled at any time, independent of CLK or other control signals, and does not require synchronization or setup/hold timing.

How does the CY7C1441KV33 handle byte write masking during burst writes?

Byte write masking is controlled by BWA–BWD (active-low) and BWE (active-low). All four BWx signals must be sampled with BWE = LOW on the same CLK edge to enable selective byte writes. During burst writes, the same BWx/BWE combination applies to all burst words unless reasserted per cycle; no dynamic per-word mask update is supported within a single burst.

CY7C1441KV33-133BZM Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1441KV33-133BZM FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1441KV33-133BZM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1441KV33-133BZM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441KV33-133BZM is usually 5 days.

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5.How can I obtain technical support or documentation for CY7C1441KV33-133BZM?

For technical support, including CY7C1441KV33-133BZM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441KV33-133BZM requirements.

6.How does Aetrix verify that CY7C1441KV33-133BZM is sourced from the original manufacturer or authorized distributors?

All CY7C1441KV33-133BZM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441KV33-133BZM meets industry standards.

7.What is the process for return or replacement of CY7C1441KV33-133BZM?

All CY7C1441KV33-133BZM units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441KV33-133BZM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1441KV33-133BZM part is unused and in its original packaging.

Return procedure for CY7C1441KV33-133BZM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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