Infineon Technologies CY7C1441KV33-133BZXI
- Part No.:
- CY7C1441KV33-133BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1441KV33-133BZXI.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1441KV33-133BZXI from Infineon Technologies (formerly Cypress) is a 36-Mbit synchronous flow-through SRAM with on-chip ECC, designed for high-speed cache and buffer interfacing in microprocessor systems. It supports 133-MHz bus operation with 6.5 ns clock-to-output delay, offers 1M × 36 organization, operates from a 3.3 V core supply with 2.5 V/3.3 V I/O compatibility, and implements IEEE 1149.1 JTAG boundary scan.
For engineers reviewing the CY7C1441KV33-133BZXI datasheet, CY7C1441KV33-133BZXI pinout, CY7C1441KV33-133BZXI application, or CY7C1441KV33-133BZXI equivalent, key selection criteria include burst mode flexibility (interleaved/linear), synchronous self-timed write timing, dual-voltage I/O support, and integrated ECC for soft error mitigation in mission-critical embedded memory paths.
Technical Context
This SRAM implements a synchronous, flow-through architecture with separate processor (ADSP) and controller (ADSC) address strobes, enabling seamless integration with Pentium-class CPUs and cache controllers. Its 2-bit internal burst counter increments addresses automatically upon ADV assertion, supporting both Intel-style interleaved and linear burst sequences selected via the MODE pin.
All synchronous inputs-including address, data, CE1/CE2/CE3, BWx, BWE, GW, ADSP, ADSC, ADV, and CLK-are registered on the rising edge of CLK; only OE and ZZ are asynchronous. The device features byte-write capability via four active-low BWx signals plus BWE, and global write control via GW-enabling precise memory access granularity without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 configuration) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns cycle time for high-bandwidth burst transfers |
| Access Time | 6.5 ns - clock-to-output delay at 133 MHz, critical for tight CPU-SRAM timing budgets |
| Core Supply Voltage | 3.3 V ± 0.3 V - standard LVTTL-compatible core rail with defined power integrity requirements |
| I/O Supply Voltage | 2.5 V or 3.3 V - supports mixed-voltage system interfacing without level shifters |
| ECC Support | On-chip encoder/decoder - corrects single-bit errors and detects double-bit errors per 36-bit word |
| Burst Mode Control | MODE pin-selectable - HIGH = Intel Pentium interleaved; LOW = linear addressing sequence |
Pinout & Package
Package: 100-pin TQFP (JEDEC standard, Pb-free, body size 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Figure 1 (Rev. *J, p.5) of datasheet 001-66677.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master clock synchronizing all register inputs and burst counter advancement |
| ADSP / ADSC | Address strobe inputs | Separate synchronous strobes for processor vs. controller address capture; ADSP takes priority when both asserted |
| ADV | Address advance signal | Synchronous control to increment internal burst counter; enables automatic address progression during burst reads/writes |
| BWA–BWD, BWE | Byte write controls | Four independent byte-enable lines + shared enable; allows selective 8-bit writes within 36-bit data bus without read-modify-write |
| OE | Asynchronous output enable | Tristates DQ/DQP pins immediately when HIGH; overrides synchronous timing for flexible bus sharing |
| ZZ | Asynchronous sleep input | Places device in low-power retention mode (data preserved) while maintaining I/O high-impedance state |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline stalls by delivering data on same clock cycle as address registration - reduces latency vs. pipelined SRAMs |
| User-selectable burst sequence | MODE pin configures interleaved (Pentium-compatible) or linear addressing - ensures drop-in compatibility with legacy and modern controllers |
| On-chip ECC (Error Correction Code) | Single-bit correction/double-bit detection per 36-bit word - reduces soft error rate (SER) in radiation-prone or high-reliability environments |
| Dual-voltage I/O support | 2.5 V or 3.3 V VDDQ selection - enables direct interface to both older 3.3 V and newer 2.5 V logic families without external translators |
| IEEE 1149.1 JTAG boundary scan | Fully compliant test access port - supports automated PCB test, interconnect verification, and in-system diagnostics |
Applications
| High-Performance CPU Cache | Industrial Real-Time Controller Buffer |
|---|---|
|
Use Scenario: L2/L3 cache memory for x86-compatible embedded processors operating at ≥100 MHz bus speeds. IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing zero-wait-state burst reads aligned to CPU clock domain. Use Value: 6.5 ns clock-to-output and 133 MHz operation meet strict timing closure requirements for cache tag/data arrays without glue logic. |
Use Scenario: Deterministic data buffering in motion-control PLCs requiring guaranteed memory access within fixed interrupt windows. IC Role / Device Role / Timing Role: High-reliability buffer with ECC protection and deterministic 133 MHz burst transfer for servo command queues. Use Value: On-chip ECC prevents silent data corruption in long-running industrial firmware; synchronous self-timed write ensures predictable write latency. |
| Avionics Data Acquisition Buffer | Medical Imaging Frame Store |
|
Use Scenario: Radiation-tolerant intermediate storage for sensor telemetry in UAV flight control systems. IC Role / Device Role / Timing Role: SRAM with neutron soft-error immunity and JTAG testability for DO-254-compliant hardware. Use Value: Documented SER reduction via ECC and JEDEC-standard 100-pin TQFP package support full traceability and reworkability in safety-critical assemblies. |
Use Scenario: Temporary frame storage in portable ultrasound devices where compact footprint and low power are essential. IC Role / Device Role / Timing Role: Low-latency, burst-capable memory interfacing directly to FPGA-based image processing pipelines. Use Value: Dual-voltage I/O (2.5 V) reduces power consumption vs. 3.3 V alternatives; 100-pin TQFP enables high-density PCB layout without BGA reflow complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C361024B-133BIN | No on-chip ECC; 1M × 36 organization; 3.3 V only I/O; identical 133 MHz speed grade | Lacks soft-error protection; suitable for cost-sensitive non-safety-critical buffers | Select when ECC is unnecessary and BOM cost optimization is prioritized over reliability assurance |
| IS61WV102436B-133TQLI | Same 1M × 36, 133 MHz, 3.3 V core; no JTAG; different burst control (no MODE pin); 165-ball FBGA only | Requires board redesign for FBGA; lacks boundary scan testability and burst mode flexibility | Choose only if existing design uses IS61WV102436B footprint and JTAG/test coverage is not required |
Compared with AS7C361024B-133BIN and IS61WV102436B-133TQLI, CY7C1441KV33-133BZXI uniquely combines ECC, MODE-selectable burst sequencing, and 100-pin TQFP packaging with JTAG - making it the sole option meeting simultaneous requirements for reliability, compatibility, and testability in certified embedded systems.
Availability
CY7C1441KV33-133BZXI is available at Aetrix Electronics and suitable for high-reliability CPU cache subsystems, industrial real-time controllers, avionics data acquisition units, and medical imaging frame stores requiring stable component supply across extended product lifecycles.
Supply support for CY7C1441KV33-133BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, emphasizing automotive-grade reliability, industrial longevity, and functional safety compliance.
CY7C1441KV33-133BZXI belongs to the Cypress Flow-Through SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in microprocessor-based systems where timing predictability and data integrity are non-negotiable.
FAQ
What is the function of the MODE pin on CY7C1441KV33-133BZXI?
The MODE pin selects burst address sequencing: HIGH configures interleaved addressing (compatible with Intel Pentium processors), while LOW enables linear addressing. This pin is sampled synchronously on the rising edge of CLK during burst initiation and determines how the internal 2-bit counter increments subsequent addresses within a burst cycle.
Does CY7C1441KV33-133BZXI support both 2.5 V and 3.3 V I/O simultaneously?
No - VDDQ must be externally set to either 2.5 V or 3.3 V, not both. The device supports either voltage level on its I/O rails, but the selected VDDQ voltage applies uniformly to all DQ and DQP pins. Mixing voltages on the same device is not permitted and violates absolute maximum ratings.
How does the ZZ pin affect power consumption and data retention?
When ZZ is driven HIGH, the device enters a non-time-critical sleep mode with significantly reduced ICC (core current), while preserving all stored data. Data retention is guaranteed across the full industrial temperature range (–40 °C to +85 °C) with VDD ≥ 2.7 V. ZZ has an internal pull-down, so floating defaults to active-low normal operation.
Is JTAG boundary scan enabled by default on CY7C1441KV33-133BZXI?
Yes - IEEE 1149.1 JTAG is fully implemented and enabled by default. No external configuration is required to access TAP signals (TCK, TMS, TDI, TDO). The boundary scan chain is operational whenever VDD and VDDQ are powered, supporting interconnect testing and in-system programming without requiring special initialization sequences.
CY7C1441KV33-133BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1441KV33-133BZXI FAQ
1.How can I place an order for CY7C1441KV33-133BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1441KV33-133BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1441KV33-133BZXI reliable?
The price and inventory of CY7C1441KV33-133BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441KV33-133BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1441KV33-133BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1441KV33-133BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1441KV33-133BZXI?
CY7C1441KV33-133BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1441KV33-133BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1441KV33-133BZXI?
For technical support, including CY7C1441KV33-133BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441KV33-133BZXI requirements.
6.How does Aetrix verify that CY7C1441KV33-133BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1441KV33-133BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441KV33-133BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1441KV33-133BZXI?
All CY7C1441KV33-133BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441KV33-133BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1441KV33-133BZXI part is unused and in its original packaging.
Return procedure for CY7C1441KV33-133BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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