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Infineon Technologies CY7C1441KVE33-133AXC
- Part No.:
- CY7C1441KVE33-133AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1441KVE33-133AXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,955
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Product details
Overview
CY7C1441KVE33-133AXC from Infineon Technologies (formerly Cypress) is a 36-Mbit synchronous flow-through SRAM with on-chip ECC, configured as 1M × 36, supporting 133 MHz bus operations with 6.5 ns clock-to-output delay. It features JEDEC-standard 100-pin TQFP packaging, dual-voltage I/O (2.5 V/3.3 V), and synchronous burst addressing via ADSP/ADSC with user-selectable interleaved or linear sequences - deployed in high-speed cache buffers for industrial control processors.
For engineers reviewing the CY7C1441KVE33-133AXC datasheet, CY7C1441KVE33-133AXC pinout, CY7C1441KVE33-133AXC application, or CY7C1441KVE33-133AXC equivalent, key selection criteria include burst mode compatibility, ECC-enabled soft-error resilience, 3.3 V core + flexible I/O supply, synchronous self-timed write timing, and JTAG boundary-scan support for system-level testability.
Technical Context
This SRAM implements a synchronous flow-through architecture with a 2-bit on-chip burst counter that captures A[1:0] at the rising edge of CLK when ADSP or ADSC is asserted, enabling automatic address incrementing during burst cycles controlled by ADV. All address, data, and control inputs (CE1–CE3, BWx, BWE, GW) are registered synchronously to CLK.
Asynchronous functions include OE (output enable, tristate control) and ZZ (sleep mode, active-HIGH with internal pull-down). The device integrates full ECC encoding/decoding logic to detect and correct single-bit errors, reducing soft error rate without external logic - critical for mission-critical embedded memory subsystems operating in radiation-prone environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns cycle time for high-bandwidth processor interfacing |
| Access Time (tCO) | 6.5 ns - guaranteed clock-to-output delay under 133 MHz operation |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers memory array and internal logic; requires stable low-noise regulation |
| I/O Supply Voltage | 2.5 V or 3.3 V - supports mixed-voltage system integration with legacy or low-power peripherals |
| ECC Functionality | On-chip SEC-DED - detects and corrects single-bit errors per 36-bit word, preserving data integrity |
| Burst Mode Support | Intel Pentium™-compatible interleaved or linear sequences - selectable via MODE pin |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, JEDEC-standard footprint (14 mm × 14 mm, 0.5 mm pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Positive-edge-triggered master clock; registers all synchronous inputs and advances burst counter when ADV is active |
| ADSP / ADSC | Address Strobe Inputs | ADSP = processor-initiated address capture; ADSC = controller-initiated; ADSP takes priority when both asserted |
| ADV | Address Advance | Synchronous signal that increments internal burst counter on CLK rise - enables sequential burst access without external address generation |
| BWA–BWD, BWE | Byte Write Controls | Four independent byte-enable lines (BWA–BWD) qualified by BWE - allows granular 8-bit writes within 36-bit word |
| DQA–DQD, DQPA–DQPD | Data I/O Bus | 36-bit bidirectional data path (DQA–DQD = 4×8-bit; DQPA–DQPD = parity bits for ECC); direction controlled by OE |
| OE | Output Enable | Asynchronous, active-low control - tristates outputs when HIGH; masked during first read clock after deselection |
| ZZ | Sleep Mode | Asynchronous, active-high entry into low-power sleep state with data retention; internal pull-down ensures safe default LOW |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline stalls during consecutive reads - delivers deterministic 2-1-1-1 access pattern for real-time cache applications |
| User-selectable burst sequence | MODE pin configures Intel Pentium™-compatible interleaved (MODE = HIGH) or linear (MODE = LOW) addressing - matches host CPU expectations |
| On-chip ECC (SEC-DED) | Reduces system-level soft error rate without external syndrome calculation logic - lowers BOM count and PCB area |
| JTAG boundary scan (IEEE 1149.1) | Enables board-level interconnect testing and in-system programming verification without physical probe access |
| Dual-voltage I/O support | 2.5 V or 3.3 V I/O interface allows seamless integration with mixed-supply SoCs and FPGAs while maintaining 3.3 V core stability |
Applications
| Industrial PLC Cache Buffer | Avionics Data Recorder Memory |
|---|---|
|
Use Scenario: High-reliability buffer between FPGA-based motion controller and real-time I/O module in programmable logic controllers. IC Role / Device Role / Timing Role: Synchronous flow-through SRAM providing zero-wait-state burst reads/writes to sustain 133 MHz instruction fetch and status update cycles. Use Value: ECC correction prevents undetected memory corruption during electromagnetic interference events common in factory-floor motor drives. |
Use Scenario: Non-volatile write buffer in flight data recorder systems requiring continuous 36-bit telemetry packet storage under vibration and temperature cycling. IC Role / Device Role / Timing Role: Burst-capable SRAM with self-timed write and asynchronous ZZ sleep - enables power-gated recording during idle intervals without data loss. Use Value: 6.5 ns tCO ensures deterministic response to ARINC 429 or MIL-STD-1553 bus arbitration signals during high-priority event capture. |
| Medical Imaging Frame Store | Test Equipment Pattern Generator |
|
Use Scenario: Intermediate frame buffer in ultrasound beamformer ASICs where pixel data must be accessed at >100 MHz with sub-ns timing precision. IC Role / Device Role / Timing Role: 1M × 36 organization maps directly to 1024×1024×36-bit scan-line buffers; synchronous flow-through eliminates address setup overhead. Use Value: Dual-voltage I/O allows direct connection to 2.5 V ADC/DAC interfaces while maintaining 3.3 V core for ECC logic integrity. |
Use Scenario: High-speed stimulus memory in automated test equipment generating multi-channel digital patterns for SoC validation. IC Role / Device Role / Timing Role: Burst-mode SRAM supplies deterministic 36-bit parallel vectors synchronized to tester clock - supports 133 MHz pattern rates with no glue logic. Use Value: JTAG boundary scan enables automated continuity and shorts testing of dense TQFP routing on high-frequency ATE backplanes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-133TQLI | No on-chip ECC; 3.3 V only I/O; identical 1M × 36, 133 MHz, TQFP-100 package | Lacks SER mitigation - requires external error handling or redundant memory schemes in safety-critical use | Select when ECC is managed at system level or cost sensitivity outweighs reliability requirements |
| CY7C1441KV33-133AXC | Same die, no ECC logic enabled; otherwise identical timing, pinout, and voltage specs | Used where burst performance and low-latency access are prioritized over radiation tolerance | Choose for non-safety-certified industrial controls where BOM simplification justifies absence of ECC overhead |
Compared with IS61WV102436BLL-133TQLI and CY7C1441KV33-133AXC, the CY7C1441KVE33-133AXC uniquely delivers integrated SEC-DED correction within the same timing envelope and footprint - eliminating external syndrome logic while preserving deterministic 6.5 ns access for real-time systems.
Availability
CY7C1441KVE33-133AXC is available at Aetrix Electronics and suitable for industrial PLC cache buffers, avionics data recorders, medical imaging frame stores, and automated test equipment pattern generators requiring stable component supply across extended product lifecycles.
Supply support for CY7C1441KVE33-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical documentation, and long-term supply commitment for legacy Cypress memory and microcontroller portfolios.
This device belongs to Infineon's high-performance synchronous SRAM product line, designed specifically for deterministic, low-latency memory interfacing in real-time embedded systems where ECC-enhanced data integrity is mandatory.
FAQ
Does CY7C1441KVE33-133AXC support both 2.5 V and 3.3 V I/O simultaneously?
No - VDDQ must be set to a single voltage (either 2.5 V or 3.3 V) for all I/O pins. The device does not support mixed-voltage operation on the same bus. VDDQ is supplied externally and must be stable within ±0.1 V for 2.5 V mode or ±0.15 V for 3.3 V mode to ensure signal integrity and timing compliance.
How does the on-chip ECC handle uncorrectable multi-bit errors?
When a double-bit error occurs within a 36-bit word, the ECC decoder asserts the ERR output (not present on this variant - CY7C1441KVE33 uses internal correction only). No external ERR pin is provided; uncorrectable errors result in undefined data output, requiring system-level detection via checksum or watchdog timeout - consistent with SEC-DED implementation in this family.
Can ADSP and ADSC be used concurrently in burst mode?
No - the device prioritizes ADSP over ADSC. When both are asserted LOW, only ADSP is recognized and latches the address into the register and burst counter. ADSC is ignored in that condition. This behavior is hardwired in the logic block diagram and verified in the truth tables on pages 10–11 of datasheet 001-66677 Rev. *J.
Is the ZZ sleep mode compatible with JTAG boundary scan operation?
Yes - JTAG remains fully functional in ZZ sleep mode. The TAP controller operates independently of the memory core and ECC logic, allowing boundary scan testing and IDCODE reads even when the SRAM array is in low-power retention. This is confirmed in Section "IEEE 1149.1 Serial Boundary Scan" on page 12 of the datasheet.
CY7C1441KVE33-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1441KVE33-133AXC FAQ
1.How can I place an order for CY7C1441KVE33-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1441KVE33-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1441KVE33-133AXC reliable?
The price and inventory of CY7C1441KVE33-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441KVE33-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1441KVE33-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1441KVE33-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1441KVE33-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1441KVE33-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1441KVE33-133AXC?
For technical support, including CY7C1441KVE33-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441KVE33-133AXC requirements.
6.How does Aetrix verify that CY7C1441KVE33-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1441KVE33-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441KVE33-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1441KVE33-133AXC?
All CY7C1441KVE33-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441KVE33-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1441KVE33-133AXC part is unused and in its original packaging.
Return procedure for CY7C1441KVE33-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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