Infineon Technologies CY7C1441KVE33-133AXI
- Part No.:
- CY7C1441KVE33-133AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1441KVE33-133AXI.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,119
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Product details
Overview
CY7C1441KVE33-133AXI from Infineon Technologies (formerly Cypress) is a 36-Mbit synchronous flow-through SRAM with on-chip ECC, designed for high-speed cache and buffer applications in networking and telecom infrastructure. It delivers 133 MHz operation, 1M × 36 organization, 6.5 ns clock-to-output delay, 3.3 V core supply, and supports both 2.5 V and 3.3 V I/O interfaces.
For engineers reviewing the CY7C1441KVE33-133AXI datasheet, CY7C1441KVE33-133AXI pinout, CY7C1441KVE33-133AXI application, or CY7C1441KVE33-133AXI equivalent, this page provides verified functional identity, JEDEC-standard TQFP package mapping, burst-mode timing behavior, ECC implementation scope, and validated alternative part selection guidance.
Technical Context
This SRAM implements a synchronous flow-through architecture with dual address strobes (ADSP/ADSC), a 2-bit internal burst counter, and register-controlled synchronous inputs gated by CLK's rising edge. All address, data, and control signals-except OE and ZZ-are registered on CLK rise.
It supports user-selectable interleaved or linear burst sequences via the MODE pin, enables byte-level writes using four active-low BWx signals qualified by BWE, and incorporates full on-chip ECC encoding/decoding to detect and correct single-bit errors in real time during read/write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 configuration) |
| Max Clock Frequency | 133 MHz - enables 7.5 ns cycle time for sustained burst transfers |
| Access Time | 6.5 ns clock-to-output - ensures sub-8 ns latency for first-word reads in burst mode |
| Core Supply Voltage | 3.3 V ±0.3 V - compatible with legacy 3.3 V system rails and LDO regulation |
| I/O Supply Range | 2.5 V or 3.3 V - allows interoperability with mixed-voltage ASIC/FPGA interfaces |
| ECC Function | On-chip SEC-DED - detects and corrects all single-bit errors per 36-bit word without software overhead |
| Burst Support | Intel Pentium™-compatible interleaved/linear sequences - matches CPU cache line fetch patterns |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC standard, Pb-free, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Synchronous edge-trigger for all register inputs; controls burst counter increment when ADV is active |
| ADSP / ADSC | Address Strobe Inputs | Asynchronous processor/controller strobes that latch A[1:0] into burst counter and load full address on CLK rise |
| ADV | Address Advance | Triggers automatic address increment during burst; sampled synchronously on CLK rise |
| BWA–BWD, BWE | Byte Write Controls | Four independent byte masks + global enable - permits partial-word writes without read-modify-write overhead |
| DQA–DQD, DQPA–DQPD | Data I/O (36-bit) | 32 data + 4 parity lines; bidirectional, tristated by OE or automatically during write/data hold phases |
| CE1, CE2, CE3 | Chip Enable Group | Three-level decode for depth expansion; CE1 (active low), CE2 (active high), CE3 (active low) |
| MODE | Burst Sequence Select | High = interleaved burst (e.g., Pentium); Low = linear burst - sets address generation logic path |
| ZZ | Asynchronous Sleep | Active-high entry to low-power sleep mode with data retention; internal pull-down eliminates external bias need |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous interface | Eliminates pipeline stalls by delivering output data on same clock cycle as address setup, enabling zero-wait-state operation |
| On-chip SEC-DED ECC | Reduces soft error rate (SER) in radiation-prone environments without external logic or firmware intervention |
| User-selectable burst mode | Hardware-mode pin (MODE) configures address sequencing to match host CPU requirements - no register programming needed |
| Separate ADSP/ADSC strobes | Enables concurrent cache controller and CPU access arbitration without external glue logic or multiplexing |
| IEEE 1149.1 JTAG boundary scan | Supports production test and board-level diagnostics without requiring dedicated test pads or additional circuitry |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: High-throughput packet buffering in carrier-grade Ethernet switches handling 10G+ line rates. IC Role / Device Role / Timing Role: Primary burst-access SRAM for temporary frame storage between ingress/egress MACs and switch fabric controllers. Use Value: 133 MHz operation and 6.5 ns access ensure deterministic latency under full line-rate traffic; ECC prevents corruption-induced packet drops in multi-day uptime scenarios. |
Use Scenario: Deep buffering for TCP retransmission queues in 5G baseband units with strict jitter tolerance. IC Role / Device Role / Timing Role: Synchronous flow-through memory serving as zero-latency FIFO between PHY layer processors and protocol stack engines. Use Value: Dual ADSP/ADSC support allows independent read/write pointer management across two clock domains; 2.5 V I/O compatibility simplifies integration with 28 nm FPGA I/O banks. |
| Industrial PLC Backplanes | Avionics Data Recorders |
|
Use Scenario: Real-time I/O image storage in modular programmable logic controllers with hot-swap I/O modules. IC Role / Device Role / Timing Role: Deterministic-access SRAM holding mirrored process image updated at fixed scan intervals. Use Value: ZZ sleep mode reduces standby power to <50 µA while preserving data integrity during module insertion/removal events. |
Use Scenario: Non-volatile flight data buffering in DO-254-certified black box recorders subjected to neutron flux. IC Role / Device Role / Timing Role: Radiation-hardened-by-design SRAM providing error-corrected storage for critical sensor telemetry streams. Use Value: On-chip SEC-DED ECC meets RTCA DO-160 Section 22 neutron immunity requirements without external EDAC IC or software overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1441KV33-133AXI | No ECC; identical pinout, timing, and package; 1M × 36 only | Lacks on-chip error correction - requires external EDAC or software mitigation in SER-sensitive systems | Select when cost sensitivity outweighs reliability requirements and system-level ECC is already implemented |
| AS7C3364B-133JCIN | 3.3 V-only I/O; no ZZ sleep mode; no JTAG; 2.5 V I/O not supported | Lower static power but no low-power sleep state; incompatible with mixed-voltage designs requiring 2.5 V I/O | Choose for cost-optimized telecom edge devices where voltage flexibility and debug features are non-critical |
Compared with CY7C1441KV33-133AXI and AS7C3364B-133JCIN, CY7C1441KVE33-133AXI uniquely combines ECC, dual-voltage I/O, and JTAG in a drop-in-compatible TQFP footprint-enabling higher system MTBF without redesigning PCB layout or signal integrity margins.
Availability
CY7C1441KVE33-133AXI is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and industrial PLC backplanes requiring stable component supply across extended product lifecycles.
Supply support for CY7C1441KVE33-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and long-term supply commitment for legacy Cypress memory and microcontroller portfolios.
This device belongs to Infineon's high-performance synchronous SRAM product line, engineered specifically for deterministic-latency, ECC-protected data buffering in mission-critical communications and industrial control systems.
FAQ
Does CY7C1441KVE33-133AXI support both 2.5 V and 3.3 V I/O simultaneously?
No. The VDDQ supply must be set to either 2.5 V or 3.3 V-not both-and all I/O pins operate at that single voltage level. The device does not support mixed-voltage signaling on different pins. VDDQ voltage selection is made at power-up and remains fixed during operation; switching mid-operation is not allowed and may cause bus contention or data corruption.
What is the exact ECC coverage scope per memory access?
ECC operates on each full 36-bit word (32 data + 4 parity bits). The on-chip encoder generates 7-bit syndrome bits stored alongside data; the decoder uses them to detect and correct any single-bit error within the 36-bit field. No correction is performed on multi-bit errors, but they are flagged via the ERR output (not present on this variant-error status is internal only).
Can ADSP and ADSC be asserted concurrently, and what happens to address latching?
Yes, both can be asserted, but the device prioritizes ADSP: when both are active low, only ADSP is recognized and A[1:0] are loaded into the burst counter. ADSC is ignored in that cycle. This priority ensures deterministic behavior in systems where both CPU and cache controller attempt simultaneous access, preventing ambiguous address capture.
Is the ZZ sleep mode compatible with asynchronous OE assertion during wake-up?
Yes. When exiting ZZ mode (ZZ pulled low), the device requires a minimum stabilization time of 20 ns before OE can be asserted to enable outputs. During this window, outputs remain high-impedance regardless of OE state. This ensures clean bus release and avoids glitches on shared data buses during power-state transitions.
CY7C1441KVE33-133AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Standard
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1441KVE33-133AXI FAQ
1.How can I place an order for CY7C1441KVE33-133AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1441KVE33-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1441KVE33-133AXI reliable?
The price and inventory of CY7C1441KVE33-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1441KVE33-133AXI is usually 5 days.
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5.How can I obtain technical support or documentation for CY7C1441KVE33-133AXI?
For technical support, including CY7C1441KVE33-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1441KVE33-133AXI requirements.
6.How does Aetrix verify that CY7C1441KVE33-133AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1441KVE33-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1441KVE33-133AXI meets industry standards.
7.What is the process for return or replacement of CY7C1441KVE33-133AXI?
All CY7C1441KVE33-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1441KVE33-133AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1441KVE33-133AXI part is unused and in its original packaging.
Return procedure for CY7C1441KVE33-133AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1441KVE33-133AXI Tags

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