Infineon Technologies CY7C1442KV33-250AXC

Overview

CY7C1442KV33-250AXC from Cypress Semiconductor is a 36-Mbit pipelined synchronous SRAM with on-chip ECC, configured as 2M × 18, operating at 250 MHz with 2.5 ns clock-to-output delay, 3.3 V core supply, and dual-voltage I/O (2.5 V/3.3 V). It supports interleaved or linear burst sequences and is used in high-speed secondary cache subsystems for Pentium-class processors.

For engineers reviewing the CY7C1442KV33-250AXC datasheet, CY7C1442KV33-250AXC pinout, CY7C1442KV33-250AXC application, or CY7C1442KV33-250AXC equivalent, key selection criteria include burst mode control (MODE/ADV/ADSP/ADSC), byte-write granularity (BWA–BWD + BWE), synchronous self-timed write timing, JTAG boundary scan compliance, and ECC-enabled soft-error resilience in mission-critical embedded memory buffers.

Technical Context

This SRAM implements a two-bit synchronous wraparound burst counter, registered address/data paths, and pipelined enable logic gated by CLK's rising edge. All synchronous inputs-including ADSP, ADSC, CE1–CE3, BWX, BWE, GW, and ADV-are sampled on CLK rise; OE and ZZ operate asynchronously.

The device integrates ECC encoding/decoding logic to detect and correct single-bit errors, reducing soft error rate (SER) in radiation-sensitive environments. It supports both processor-initiated (ADSP) and controller-initiated (ADSC) address capture, with independent chip enable qualification (CE1 active-low, CE2 active-high, CE3 active-low).

Key Specifications

Pinout & Package

Package: 100-pin TQFP (Pb-free), 165-ball FBGA (Pb-free and non-Pb-free options). Pin functions validated per Cypress Document 001-66676 Rev. *G.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with IS61WV102432BLL-10BLI and AS7C33128PFS-15TIN, CY7C1442KV33-250AXC delivers 2.5× higher bandwidth, integrated ECC, and IEEE 1149.1 testability-making it uniquely suited for new designs demanding deterministic timing, radiation resilience, and production test coverage.

Availability

CY7C1442KV33-250AXC is available at Aetrix Electronics and suitable for high-speed secondary cache, network packet buffering, and industrial motion controller memory requiring stable component supply, long-term lifecycle support, and Pb-free compliance.

Supply support for CY7C1442KV33-250AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets.

CY7C1442KV33 belongs to the KVI family of pipelined sync SRAMs engineered for deterministic, ECC-protected memory subsystems in real-time embedded processors and networking silicon.

FAQ

What is the function of the MODE pin on CY7C1442KV33-250AXC?

The MODE pin selects burst address sequencing: logic HIGH configures interleaved addressing (compatible with Intel Pentium processors), while logic LOW selects linear addressing. It is sampled synchronously on the rising edge of CLK during initialization and remains latched until reset or power cycle. This setting determines how the internal two-bit burst counter increments addresses during ADV-driven bursts.

How does the ZZ pin affect power consumption and data retention?

When ZZ is driven HIGH, the device enters a non-time-critical sleep mode that reduces ICC to ≤5 mA (typical) while preserving all stored data. The internal pull-down ensures safe LOW default if left unconnected. Data retention is guaranteed over full industrial temperature range (–40°C to +85°C) with VDD ≥ 2.0 V, making it suitable for intermittent operation in battery-backed systems.

Can CY7C1442KV33-250AXC operate with 2.5 V I/O while using 3.3 V core supply?

Yes - VDDQ is independently supplied and accepts either 2.5 V ± 0.2 V or 3.3 V ± 0.3 V, while VDD must be 3.3 V ± 0.3 V. This dual-rail capability allows direct interfacing with 2.5 V FPGA I/O banks or ASIC cores without level translators, provided VDDQ and VDD are properly decoupled and sequenced during power-up (VDD before VDDQ recommended).

Is JTAG boundary scan enabled by default on CY7C1442KV33-250AXC?

Yes - IEEE 1149.1 boundary scan is factory-enabled and active whenever TCK, TMS, TDI, and TDO pins are driven per JTAG protocol. No configuration fuse or software command is needed. The feature supports full interconnect testing and can be disabled only by pulling TMS HIGH during power-up, per datasheet Section 13, but this is not recommended for production boards requiring testability.