Infineon Technologies CY7C1444KV33-250AXC

Overview

CY7C1444KV33-250AXC from Cypress Semiconductor is a 36-Mbit (1M × 36) pipelined synchronous SRAM with registered inputs/outputs, 250 MHz bus operation support, 2.5 ns clock-to-output delay, and dual-voltage I/O (2.5 V or 3.3 V). It serves as high-speed secondary cache in Pentium-class processor systems requiring interleaved burst access and depth expansion without wait states.

For engineers reviewing the CY7C1444KV33-250AXC datasheet, CY7C1444KV33-250AXC pinout, CY7C1444KV33-250AXC application, or CY7C1444KV33-250AXC equivalent, key selection considerations include synchronous burst timing control (ADSP/ADSC/ADV), byte-write granularity (BWA–BWD + BWE), pipelined deselect behavior, and JEDEC-compliant 100-pin TQFP packaging with VDDQ/VSSQ separation.

Technical Context

This SRAM implements a two-bit synchronous wraparound burst counter, user-selectable linear or interleaved burst sequences via MODE pin, and dual address strobe logic (ADSP for processor-initiated, ADSC for controller-initiated accesses). All synchronous inputs-including addresses, CE1/CE2/CE3, BWE/BWX, GW, and ADV-are registered on the rising edge of CLK.

It supports synchronous self-timed writes with optional global write (GW) override, asynchronous OE for output tristate control, and ZZ sleep mode with data retention. Core operates at 3.3 V while I/Os support either 2.5 V or 3.3 V, meeting JESD8-5 compatibility requirements for mixed-voltage system interfacing.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, 14 mm × 14 mm body, 0.5 mm pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IS61WV102436BLL-250BLI and MT28EW128Axx-250WLC, the CY7C1444KV33-250AXC uniquely delivers guaranteed 2.5 ns tCO, dual-voltage I/O, and hardware-managed sleep-enabling tighter timing margins, broader system voltage compatibility, and lower idle power in real-time embedded caches.

Availability

CY7C1444KV33-250AXC is available at Aetrix Electronics and suitable for processor cache interfaces, network packet buffering, industrial motion controllers, and ATE pattern memory applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1444KV33-250AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing reliability, timing precision, and mixed-signal integration.

The CY7C1444KV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-oriented cache and buffer applications in computing, networking, and industrial control systems.

FAQ

What is the function of the MODE pin on CY7C1444KV33-250AXC?

The MODE pin selects burst address sequence behavior: logic HIGH configures interleaved burst order (compatible with Intel Pentium processors), while logic LOW selects linear burst order. It is sampled asynchronously at power-up and latched internally, determining how the two-bit burst counter increments addresses during ADV-driven bursts.

Can CY7C1444KV33-250AXC operate with 2.5 V I/O while maintaining 3.3 V core supply?

Yes. The device supports independent VDDQ (2.5 V or 3.3 V) and VDD (3.3 V) supplies. When VDDQ = 2.5 V, all I/O pins-including DQ/DQP, OE, and byte-write controls-meet JESD8-5 specifications for 2.5 V LVTTL interfaces, while the core remains powered at 3.3 V for optimal array performance and stability.

How does the pipelined enable register improve depth expansion?

The pipelined enable register delays output buffer tristate by one clock cycle after chip deselect (CE1/CE2/CE3 deactivation). This ensures that the final valid data word remains driven onto the bus during the first cycle of the next device's access-eliminating inter-bank wait states and enabling seamless 1M × 36 → 2M × 36 expansion using multiple devices.

Is ZZ pin required to be actively driven, or can it be left floating?

The ZZ pin has an internal pull-down resistor, so it may be left unconnected for normal operation (default LOW). However, for explicit sleep control, it must be driven HIGH with a clean, slow-rising signal (tR ≤ 10 ns) to enter sleep mode; floating is acceptable only if sleep functionality is unused and noise immunity is assured by board layout.