Infineon Technologies CY7C1447AV25-133BGI

Overview

CY7C1447AV25-133BGI from Cypress Semiconductor is a 36-Mbit (512K × 72) synchronous flow-through SRAM with 2.5 V core/I/O supply, 133 MHz operation, and 6.5 ns clock-to-output delay. It supports interleaved or linear burst sequences via MODE pin selection, uses synchronous ADSP/ADSC address strobes and asynchronous OE/ZZ controls, and targets high-speed secondary cache in Pentium-class microprocessor systems.

For engineers reviewing the CY7C1447AV25-133BGI datasheet, CY7C1447AV25-133BGI pinout, CY7C1447AV25-133BGI application, or CY7C1447AV25-133BGI equivalent, key selection criteria include burst sequence compatibility (Intel Pentium vs. linear), 209-ball FBGA mechanical fit, JTAG boundary-scan support, ZZ sleep mode behavior, and byte-write granularity across eight 9-bit data groups (DQA–DQH + DQPA–DQPH).

Technical Context

This SRAM implements a synchronous flow-through architecture where all address, control, and data inputs are registered on the rising edge of CLK. A 2-bit on-chip burst counter captures A[1:0] at ADSP/ADSC assertion and auto-increments for subsequent burst addresses controlled by ADV.

It supports dual-burst initiation paths: processor-driven (ADSP) and controller-driven (ADSC), with CE1 (active-low), CE2 (active-high), and CE3 (active-low) enabling depth expansion. Output enable (OE) is asynchronous and masks tri-state during deselected transitions, while ZZ (active-high) enables non-time-critical sleep with data retention.

Key Specifications

Pinout & Package

Package: 209-ball Fine-Pitch Ball Grid Array (FBGA), 14 mm × 22 mm body, 1.76 mm height, non-RoHS-compliant (contains lead). Pinout validated per Cypress Document 001-75380 Rev. *F, Figure 2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with CY7C1447AV25-133BGI, the CY7C1441AV25-133BAXI reduces package size and adds RoHS compliance but removes JTAG and sleep functionality, while the IDT71V67603S133BQI maintains 209-ball compatibility but mandates 3.3 V operation and lacks ZZ control - making the Cypress part uniquely suited for 2.5 V, JTAG-testable, low-power cache designs.

Availability

CY7C1447AV25-133BGI is available at Aetrix Electronics and suitable for Intel Pentium-based industrial controllers, high-reliability test equipment, network switching buffers, and embedded DSP cache subsystems requiring stable component supply and long-lifecycle support.

Supply support for CY7C1447AV25-133BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

The CY7C144xAV25 product line delivers high-speed synchronous SRAMs optimized for secondary cache and burst-buffer applications in microprocessor-centric systems, emphasizing timing predictability, low-voltage operation, and JTAG testability in high-pin-count packages.

FAQ

What is the function of the MODE pin, and how must it be configured?

The MODE pin selects burst address order: HIGH (VDD or floating) enables interleaved burst for Intel Pentium compatibility; LOW (tied to GND) enables linear burst. It is a static strap pin - configuration must be fixed before operation and cannot change dynamically. Internal pull-up requires explicit grounding for linear mode.

Does CY7C1447AV25-133BGI support true 72-bit-wide data access, and how are parity bits handled?

Yes - it provides 72-bit-wide access via eight 9-bit groups: DQA–DQH (data) and DQPA–DQPH (parity). Each DQPx pair corresponds to its DQx group and is controlled by the same BWx signal during writes. Parity is user-managed; the device does not generate or check parity automatically.

How does the ZZ sleep mode interact with ongoing burst operations?

ZZ is asynchronous and active-HIGH. If asserted during a burst, the device completes the current burst cycle then enters sleep - data remains valid, but CLK is ignored and all outputs tri-state. No new accesses are accepted until ZZ returns LOW and a stabilization period elapses (tZZH = 5 ns min).

Is JTAG boundary scan functional immediately after power-up, and what initialization is required?

JTAG is enabled by default after power-on reset. No firmware or configuration is needed - the TAP controller responds to standard IEEE 1149.1 instructions (SAMPLE/PRELOAD, EXTEST, IDCODE) once TCK toggles with proper TMS state transitions. TDI/TDO operate at 2.5 V logic levels.