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Infineon Technologies CY7C1460AV25-200BZXI

Part No.:
CY7C1460AV25-200BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1460AV25-200BZXI.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,375

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Product details

Overview

CY7C1460AV25-200BZXI from Cypress Semiconductor is a 36-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 1M × 36, operating at 200 MHz with 3.2 ns clock-to-output delay, 2.5V core supply, and 2.5V/1.8V I/O supply. It delivers zero-wait-state back-to-back read/write capability in high-throughput networking packet buffers and telecom line-card memory subsystems.

For engineers reviewing the CY7C1460AV25-200BZXI datasheet, CY7C1460AV25-200BZXI pinout, CY7C1460AV25-200BZXI application, or CY7C1460AV25-200BZXI equivalent, key selection criteria include burst order control (linear/interleaved), byte-write select granularity (BWa–BWd), synchronous self-timed write timing, and JTAG boundary-scan support for system-level testability.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. The internal NoBL™ logic eliminates bus latency by enabling consecutive read/write operations without wait states.

It supports linear or interleaved burst ordering via the MODE strap pin, uses three synchronous chip enables (CE1 active LOW, CE2 active HIGH, CE3 active LOW) for bank selection, and features asynchronous ZZ sleep mode and OE-controlled output tri-state-automatically enforced during write data cycles to prevent bus contention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 organization), enabling compact high-bandwidth buffer design in space-constrained line cards.
Max Clock Frequency 200 MHz - guarantees sustained 400 MT/s throughput with deterministic pipelined timing.
tCO (Clock-to-Output) 3.2 ns - defines minimum valid data hold window after clock edge for downstream latch capture.
VDD Core Supply 2.5 V ± 0.2 V - requires dedicated low-noise 2.5V rail; not compatible with 3.3V or 1.8V core systems.
VDDQ I/O Supply 2.5 V or 1.8 V - supports dual-voltage interface interoperability with FPGA I/O banks or ASIC SerDes PHYs.
Burst Capability Linear or interleaved - selectable via MODE pin; determines address increment pattern during burst reads/writes.
Byte Write Control BWa–BWd (4 independent signals) - enables selective 9-bit writes to DQa/DQPa through DQd/DQPd without masking logic.

Pinout & Package

The CY7C1460AV25-200BZXI is packaged in a lead-free 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) per JEDEC MO-145, with thermal pad exposed on underside for enhanced heat dissipation in sustained burst operation.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Synchronous Address Input Latched on rising CLK edge; selects one of 1M memory locations; no address multiplexing required.
BWa–BWd Synchronous Byte Write Select Active-LOW per 9-bit data group; controls write enable to DQa/DQPa through DQd/DQPd independently.
CLK Synchronous Clock Input Rising-edge-triggered master timing reference; qualified by CEN - no clock activity when CEN = HIGH.
CEN Clock Enable Active-LOW; suspends clock recognition without deselecting device - extends previous cycle for timing margin.
CE1, CE2, CE3 Synchronous Chip Enables Three-input decode: CE1=LOW, CE2=HIGH, CE3=LOW activates device; enables depth expansion with minimal glue logic.
OE Asynchronous Output Enable Active-LOW; overrides internal control to force I/O tri-state - masked automatically during write data phase.
ZZ Asynchronous Sleep Input Active-HIGH; places device in low-power retention mode (data preserved) with non-critical wake-up timing.
DQa–DQd, DQPa–DQPd Bidirectional Data I/O 36-bit data + 4-bit parity; direction controlled by OE and internal state; tri-stated synchronously during writes.
MODE Burst Order Strap Static input: HIGH = interleaved burst, LOW = linear burst; must be stable before operation begins.
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface; enables board-level interconnect verification without functional access.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) Architecture Enables true back-to-back read/write transitions with zero wait states - critical for real-time packet buffering in 10G+ switches.
Fully Registered Pipelined Interface All inputs and outputs synchronized to CLK rising edge - eliminates setup/hold violations across PCB traces and simplifies timing closure.
Synchronous Self-Timed Writes On-chip write timing control removes external write-pulse generation - reduces FPGA logic overhead and improves write reliability.
Flexible I/O Voltage Support VDDQ configurable for 2.5V or 1.8V - allows direct interfacing with both legacy and modern FPGA I/O standards without level shifters.
Hardware Burst Control MODE pin selects linear or interleaved burst order - matches specific DMA engine requirements in network processors and baseband ICs.

Applications

Telecom Line Card Buffer High-Speed Network Switch ASIC Cache

Use Scenario: Storing and forwarding variable-length Ethernet frames in OC-192/STM-64 line cards with strict latency budgets.

IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfaced directly to framer and switch fabric controller via synchronous burst interface.

Use Value: 3.2 ns tCO and zero-wait-state pipelining ensure sub-10 ns read turnaround - meeting 10 Gbps line-rate timing constraints.

Use Scenario: Serving as L2/L3 lookup cache for ternary CAM-assisted forwarding engines in modular chassis switches.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory backing fast-path packet classification logic with burst-aligned access patterns.

Use Value: 200 MHz clock rate and 36-bit width deliver 7.2 GB/s peak bandwidth - sustaining concurrent ingress/egress flow lookups.

Baseband Processor Memory Subsystem Test Equipment Pattern Memory

Use Scenario: Holding channel estimation coefficients and FFT intermediate results in LTE-Advanced eNodeB baseband units.

IC Role / Device Role / Timing Role: Synchronous burst-access memory co-located with DSP cores, supporting deterministic multi-cycle burst reads/writes.

Use Value: Byte-write capability (BWa–BWd) enables efficient partial coefficient updates without full-word overwrites - reducing power and bus traffic.

Use Scenario: Storing stimulus/response vectors in high-speed ATE systems requiring precise timing alignment and repeatable pattern replay.

IC Role / Device Role / Timing Role: Deterministic-access pattern memory synchronized to tester clock domain with JTAG visibility for debug and calibration.

Use Value: JTAG boundary scan (TCK/TMS/TDI/TDO) enables in-system interconnect validation - eliminating probe-based continuity testing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V251L15PF 36-Mbit (1M × 36), 15 ns access, 3.3V-only core/I/O, no JTAG, no ZZ sleep mode. Lacks 200 MHz speed grade and dual-VDDQ support - unsuitable for 1.8V FPGA interfaces or low-power sleep modes. Select only if legacy 3.3V system compatibility and absence of JTAG are acceptable trade-offs.
ISSI IS61WV102436B 36-Mbit (1M × 36), 167 MHz max, 3.0–3.6V core, 2.5V/3.3V I/O, no MODE pin, no JTAG. Lower max frequency and no burst-order selection - limits use in 200 MHz+ burst-intensive designs like packet classification. Consider only for cost-sensitive, lower-speed applications where burst flexibility and JTAG are non-critical.

Compared with IDT72V251L15PF and ISSI IS61WV102436B, the CY7C1460AV25-200BZXI uniquely combines 200 MHz operation, dual-VDDQ support, hardware-selectable burst order, and IEEE 1149.1 JTAG - making it the only option for high-speed, testable, voltage-flexible SRAM subsystems.

Availability

CY7C1460AV25-200BZXI is available at Aetrix Electronics and suitable for telecom infrastructure, high-end network switching, baseband processing, and automated test equipment requiring stable component supply across extended product lifecycles.

Supply support for CY7C1460AV25-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1460AV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in packet-processing and real-time signal-path applications.

FAQ

What is the function of the MODE pin, and how does it affect burst behavior?

The MODE pin is a static strap input that selects burst order: tied HIGH enables interleaved burst addressing (e.g., 0, 2, 4, 6…), while pulled LOW enables linear burst (e.g., 0, 1, 2, 3…). It must remain stable before and during operation; floating defaults to HIGH. This setting directly determines how ADV/LD increments the internal address counter during burst sequences - matching specific DMA or processor burst expectations.

Can CY7C1460AV25-200BZXI operate with VDDQ = 1.8V while VDD = 2.5V?

Yes - the device supports independent 2.5V core (VDD) and 1.8V I/O (VDDQ) supplies. This allows direct interfacing with 1.8V FPGA I/O banks without level shifters, while maintaining 2.5V internal logic integrity. The datasheet specifies VDDQ tolerance of 1.7V to 2.7V, and operation at 1.8V is validated across all speed grades including 200 MHz.

How does the ZZ sleep mode interact with data retention and wake-up timing?

Asserting ZZ HIGH places the device in a non-time-critical sleep state where core power is reduced but data is retained indefinitely. Wake-up occurs on the next valid CLK edge after ZZ returns LOW, with no additional stabilization delay required. Unlike deep power-down modes, ZZ does not require reinitialization - the device resumes normal operation immediately upon clock resumption.

Is the CY7C1460AV25-200BZXI pin-compatible with ZBT SRAMs?

Yes - it is pin-compatible and functionally equivalent to standard ZBT SRAMs (e.g., IDT ZBT series), sharing identical pinout, timing model, and control protocol. This enables drop-in replacement in existing ZBT-based designs while delivering improved features including NoBL™ latency elimination, dual-VDDQ support, and integrated JTAG test capability.

CY7C1460AV25-200BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.2 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1460AV25-200BZXI FAQ

1.How can I place an order for CY7C1460AV25-200BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460AV25-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460AV25-200BZXI reliable?

The price and inventory of CY7C1460AV25-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460AV25-200BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1460AV25-200BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460AV25-200BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1460AV25-200BZXI?

CY7C1460AV25-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460AV25-200BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460AV25-200BZXI?

For technical support, including CY7C1460AV25-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460AV25-200BZXI requirements.

6.How does Aetrix verify that CY7C1460AV25-200BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1460AV25-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460AV25-200BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1460AV25-200BZXI?

All CY7C1460AV25-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460AV25-200BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460AV25-200BZXI part is unused and in its original packaging.

Return procedure for CY7C1460AV25-200BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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