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Infineon Technologies CY7C1460AV33-167AXCT
- Part No.:
- CY7C1460AV33-167AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1460AV33-167AXCT.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,076
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Product details
Overview
CY7C1460AV33-167AXCT from Cypress Semiconductor is a 3.3V, 1M × 36 pipelined synchronous SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It supports 167 MHz bus operation (3.4 ns access), zero wait-state back-to-back read/write cycles, and 3.3V/2.5V I/O compatibility. Its fully registered interface enables deterministic timing in FPGA- or ASIC-based control planes.
For engineers reviewing the CY7C1460AV33-167AXCT datasheet, CY7C1460AV33-167AXCT pinout, CY7C1460AV33-167AXCT application, or CY7C1460AV33-167AXCT equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability (BWa–BWd), synchronous self-timed writes, and JTAG boundary scan compliance for system-level testability.
Technical Context
The CY7C1460AV33-167AXCT implements a fully synchronous, clocked memory interface where all inputs (address, control, data) and outputs pass through registers triggered on the rising edge of CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write operations without pipeline stalls.
It features three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank decoding, asynchronous OE for output tristate control, and CEN to gate clock recognition without deselecting the device. Burst addressing is controlled via MODE pin (GND = linear, floating/VDD = interleaved), and ADV/LD manages internal address counter advancement or reload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 167 MHz - defines maximum sustained transaction rate in synchronous systems |
| Access Time | 3.4 ns - determines minimum clock-to-output delay for timing-critical read paths |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - enables interoperability with mixed-voltage SoCs and FPGAs |
| Byte Write Control | BWa–BWd (active-low) - allows independent 9-bit writes to each DQa–DQd byte lane |
| Power Consumption | 375 mA max operating current - sets thermal budget for dense memory modules |
| Standby Current | 120 mA max CMOS standby - critical for low-power sleep modes in packet buffers |
Pinout & Package
Package: 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) and 165-ball FBGA (15 × 17 mm, 1.0 mm ball pitch). Both packages are JEDEC-standard, Pb-free compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Synchronous Address Inputs | Sampled on rising CLK edge; select one of 1M addresses (20-bit address bus) |
| BWa–BWd | Byte Write Selects | Active-low controls write enable per 9-bit data byte (DQa/DQPa through DQd/DQPd) |
| CLK, CEN | Clock & Clock Enable | CEN masks CLK without deselecting device; enables cycle extension for timing margin |
| CE1, CE2, CE3 | Chip Enables | Three-signal decode (CE1↓, CE2↑, CE3↓) allows hierarchical memory banking |
| OE | Asynchronous Output Enable | Tristates DQ outputs immediately when HIGH; masked during write data phase |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data bus (4 × 9-bit bytes); DQP pins provide parity for error detection |
| ADV/LD | Address Counter Control | HIGH advances internal burst counter; LOW loads new address from A0–A19 |
| MODE | Burst Order Selector | GND = linear burst; floating/VDD = interleaved burst - configures address sequence for cache lines |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables true back-to-back read/write with no pipeline bubbles - sustains 167 MT/s throughput |
| Fully Registered Interface | All inputs and outputs synchronized to CLK rising edge - eliminates setup/hold violations in high-speed PCB layouts |
| Synchronous Self-Timed Writes | On-chip write timing control eliminates external write pulse generation - simplifies controller logic |
| JTAG Boundary Scan (IEEE 1149.1) | 165-ball FBGA supports full interconnect test - reduces board-level debug time for multi-SRAM designs |
| "ZZ" Sleep Mode | Reduces power to standby level while preserving data - enables dynamic power gating in packet buffering applications |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 3 switches. IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM acting as first-level packet buffer between MAC and NPU. Use Value: 3.4 ns access + zero-wait-state pipelining ensures line-rate forwarding at 10 Gbps with minimal jitter. | Use Scenario: Providing instruction and context memory for multi-threaded network processors. IC Role / Device Role / Timing Role: Synchronous memory interface supporting dual-port-like behavior via burst reads/writes. Use Value: Byte-write capability (BWs) and 167 MHz clock enable fine-grained context switching without bus contention. |
| Telecom Line Card Memory | FPGA-Based Protocol Accelerator |
Use Scenario: Frame assembly/disassembly in SONET/SDH framer ICs requiring deterministic latency. IC Role / Device Role / Timing Role: Pipelined SRAM serving as elastic store for rate adaptation between OC-192 and backplane interfaces. Use Value: Fully registered interface guarantees ±0.3 ns skew across 36-bit bus - meets SONET jitter specs. | Use Scenario: Offloading TCP/IP checksum, encryption, or header parsing in FPGA-accelerated servers. IC Role / Device Role / Timing Role: High-bandwidth local memory for FPGA soft-core processors executing protocol stacks. Use Value: Interleaved burst mode (MODE=VDD) delivers 2× bandwidth efficiency for sequential descriptor table access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 2M × 18 organization, 167 MHz, 3.3V only (no VDDQ flexibility) | Lacks DQP parity pins and JTAG scan; requires external OE timing control | Select when parity not required and board layout favors smaller footprint (128-TQFP vs 100-TQFP) |
| ISSI IS61WV102436B | 1M × 36, 166 MHz, 3.3V core/I/O, no burst mode or MODE pin | Supports only linear burst; no interleaved mode or ADV/LD counter control | Choose for cost-sensitive designs where burst flexibility and advanced addressing are unnecessary |
Compared with IDT72V2115L16PF and IS61WV102436B, the CY7C1460AV33-167AXCT uniquely combines parity-enabled 36-bit width, dual-voltage I/O, programmable burst order, and IEEE 1149.1 testability - making it optimal for carrier-grade infrastructure where data integrity and system-level debug are mandatory.
Availability
CY7C1460AV33-167AXCT is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, and telecom line card memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1460AV33-167AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and communications markets.
The CY7C1460AV33 series belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, zero-latency memory access in packet-switched infrastructure and real-time control systems.
FAQ
What is the function of the MODE pin on CY7C1460AV33-167AXCT?
The MODE pin selects burst address sequencing: tied to GND enables linear burst (incrementing addresses), while left floating or pulled to VDD enables interleaved burst (bit-swapped address progression). This matches cache line access patterns in network processors and avoids bank conflicts in multi-bank systems.
Does CY7C1460AV33-167AXCT support 2.5V I/O voltage with 3.3V core?
Yes - VDDQ (I/O supply) operates independently at either 3.3V or 2.5V, while VDD (core supply) remains fixed at 3.3V. This allows direct interfacing with 2.5V FPGA I/O banks without level shifters, reducing BOM count and signal integrity risk.
How does the "ZZ" sleep mode affect data retention?
In ZZ mode, the device enters low-power standby while maintaining full data retention in the SRAM array. Core and I/O supplies remain active, but internal clocks and output drivers are gated. Exit time is one clock cycle, enabling rapid resumption of traffic handling in bursty packet applications.
Can CY7C1460AV33-167AXCT be used in place of ZBT SRAMs?
Yes - it is pin-compatible and functionally equivalent to standard ZBT SRAMs (e.g., IDT72V2113), supporting identical control protocols, burst orders, and timing models. No redesign is needed when upgrading from legacy ZBT to NoBL™ architecture for improved throughput.
CY7C1460AV33-167AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1460AV33-167AXCT FAQ
1.How can I place an order for CY7C1460AV33-167AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460AV33-167AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460AV33-167AXCT reliable?
The price and inventory of CY7C1460AV33-167AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460AV33-167AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1460AV33-167AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460AV33-167AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1460AV33-167AXCT?
CY7C1460AV33-167AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460AV33-167AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460AV33-167AXCT?
For technical support, including CY7C1460AV33-167AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460AV33-167AXCT requirements.
6.How does Aetrix verify that CY7C1460AV33-167AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1460AV33-167AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460AV33-167AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1460AV33-167AXCT?
All CY7C1460AV33-167AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460AV33-167AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460AV33-167AXCT part is unused and in its original packaging.
Return procedure for CY7C1460AV33-167AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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