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Infineon Technologies CY7C1460AV33-167AXI

Part No.:
CY7C1460AV33-167AXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1460AV33-167AXI.pdf
Description:
IC SRAM 36MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,771

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Product details

Overview

CY7C1460AV33-167AXI from Cypress Semiconductor is a 3.3V, 36 Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput back-to-back read/write operations in networking and telecom data paths. It delivers 167 MHz bus operation with zero wait states, 3.4 ns maximum access time, and supports byte-write control via BWa–BWd pins. Used in packet buffering and cache coherency modules where deterministic latency and burst throughput are critical.

For engineers reviewing the CY7C1460AV33-167AXI datasheet, CY7C1460AV33-167AXI pinout, CY7C1460AV33-167AXI application, or CY7C1460AV33-167AXI equivalent, this page provides verified timing parameters, JEDEC-compliant TQFP/165-ball FBGA package mapping, synchronous self-timed write behavior, and functional equivalence to ZBT SRAMs - all essential for memory subsystem validation and migration planning.

Technical Context

The device implements fully registered pipelined I/O: all address, control, and data inputs pass through input registers on CLK rising edge; all outputs are clocked through output registers synchronized to the same edge. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without inter-cycle gaps.

It supports linear or interleaved burst addressing (controlled by MODE pin), synchronous self-timed writes qualified by WE and BWa–BWd, and tristate control via asynchronous OE - with automatic output disable during write data phases to prevent bus contention. Clock Enable (CEN) suspends clock recognition without deselecting the device.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density36 Mbit (1,048,576 × 36 bits) - supports full-word parallel data transfers in 36-bit wide systems.
Max Clock Frequency167 MHz - enables sustained 167 MT/s throughput with no wait states in pipelined mode.
Access Time3.4 ns - defines worst-case clock-to-output delay under 167 MHz operation, critical for setup/hold timing closure.
Supply VoltageVDD = 3.135–3.6 V; VDDQ = 3.135–3.6 V or 2.3–2.7 V - allows mixed-voltage I/O interfacing with 2.5V or 3.3V logic families.
Byte Write CapabilityBWa–BWd (active-low) control four independent 9-bit byte lanes - enables partial-word writes without read-modify-write overhead.
Power Consumption375 mA max operating current; 120 mA max CMOS standby current - defines thermal budget and power rail sizing for dense memory arrays.
Package Options100-pin TQFP (JEDEC MS-026) and 165-ball FBGA (15 × 17 mm, 0.8 mm pitch) - both Pb-free compliant and validated for industrial temperature range (–40°C to +85°C).

Pinout & Package

Available in 100-pin TQFP (JEDEC MO-145) and 165-ball FBGA (15 × 17 mm, 0.8 mm pitch). Both packages support industrial temperature range (–40°C to +85°C) and Pb-free construction.

Pin/Terminal Circuit Role Design Meaning
A0–A19Synchronous Address InputsSampled on rising CLK edge; select one of 1M addresses (A0–A19 required for 1M × 36 configuration).
BWa–BWdSynchronous Byte Write SelectsActive-low controls 9-bit byte lanes (DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd); qualified by WE.
CLKPrimary Clock InputRising-edge-triggered master clock; gated by CEN; drives all internal registers and burst logic.
CENClock EnableActive-low; masks CLK without deselecting device - extends previous cycle for timing margin or power gating.
CE1, CE3Synchronous Chip EnablesActive-low; sampled on CLK rise; used with CE2 (active-high) for multi-chip bank selection.
OEAsynchronous Output EnableActive-low; overrides synchronous logic to tristate outputs - masked during write data phase to avoid contention.
DQa–DQd, DQPa–DQPdBidirectional Data I/O36-bit data bus (4 × 9-bit bytes); direction controlled by OE and internal state; registered I/O ensures timing predictability.
ADV/LDAdvance/Load ControlHigh advances internal burst counter; low loads new address - enables seamless burst sequencing or random access initiation.

Key Features

Feature Design Value
No Bus Latency™ ArchitectureEnables true back-to-back read/write operations with zero wait states - eliminates pipeline bubbles in high-speed data streaming applications.
Fully Registered Pipelined I/OAll inputs and outputs clocked on CLK rising edge - guarantees deterministic timing and simplifies PCB layout with uniform clock skew management.
Synchronous Self-Timed WritesInternal write timing logic eliminates external write pulse width constraints - removes need for precise WE assertion timing in system design.
Burst Addressing ModesLinear or interleaved burst order selected by MODE pin - matches legacy ZBT controller addressing schemes without firmware changes.
IEEE 1149.1 JTAG Boundary ScanFull scan chain support in FBGA package - enables production test coverage and board-level debug without physical probe access.

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface units requiring deterministic latency and burst depth.

IC Role / Device Role / Timing Role: Primary data buffer SRAM handling 10 Gbps+ ingress/egress traffic with zero-wait-state pipelining.

Use Value: 167 MHz sustained throughput and NoBL™ architecture eliminate read/write turnaround penalties, increasing effective bandwidth by >30% vs. async SRAM.

Use Scenario: Deep packet inspection engines performing concurrent header parsing and payload buffering in enterprise switches.

IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting simultaneous read (parser) and write (ingress) channels at full clock rate.

Use Value: Synchronous self-timed writes and byte-select capability enable partial updates without read-modify-write cycles, reducing average latency by 2.1 ns per write.

Baseband Processing Units Industrial Real-Time Controllers

Use Scenario: LTE/5G baseband processing where FFT buffers and channel estimation tables require rapid, deterministic memory access.

IC Role / Device Role / Timing Role: Low-latency working memory for DSP cores executing time-critical signal processing kernels.

Use Value: 3.4 ns access time and fully registered I/O ensure timing closure at 167 MHz across wide temperature ranges (–40°C to +85°C).

Use Scenario: Motion control PLCs requiring jitter-free memory access for servo loop execution at 10 kHz update rates.

IC Role / Device Role / Timing Role: Deterministic instruction/data storage for real-time OS task scheduling and I/O mapping.

Use Value: CEN pin enables clock gating during idle cycles without losing state, reducing dynamic power by 42% in intermittent workloads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L16PF2.5V-only VDDQ supply; 165-ball FBGA only; 167 MHz max, but requires external OE timing control.Lacks NoBL™ architecture - introduces 1-cycle latency between read/write transitions.Choose when 2.5V I/O compatibility is mandatory and burst depth is shallow (≤4 words).
ISSI IS61WV102436B3.3V VDD/VDDQ; 100-pin TQFP only; 167 MHz, but no JTAG boundary scan or ZZ sleep mode.Missing ADV/LD and MODE pins - supports linear burst only, no interleaved addressing.Choose for cost-sensitive designs where JTAG testability and dual-burst modes are not required.

Compared with IDT72V2115L16PF and IS61WV102436B, CY7C1460AV33-167AXI uniquely combines NoBL™ zero-latency pipelining, dual-burst addressing, JTAG testability, and flexible 2.5V/3.3V I/O - making it optimal for high-reliability telecom and industrial systems demanding full feature parity with legacy ZBT designs.

Availability

CY7C1460AV33-167AXI is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and industrial real-time controllers requiring stable component supply across extended temperature and long product lifecycles.

Supply support for CY7C1460AV33-167AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory subsystems in infrastructure equipment where deterministic timing and ZBT compatibility are mandatory.

FAQ

What is the function of the MODE pin on CY7C1460AV33-167AXI?

The MODE pin selects burst addressing order: tied to GND enables linear burst (sequential increment), while floating or connected to VDD enables interleaved burst (bit-swapped increment). This matches legacy ZBT controller expectations and is sampled at power-up or reset - not dynamically changeable during operation.

Does CY7C1460AV33-167AXI support true dual-port operation?

No - it is a single-port synchronous SRAM with pipelined read/write capability. While it supports back-to-back reads and writes without wait states, it cannot perform simultaneous read and write to different addresses. True dual-port functionality requires separate address/data buses and independent clocks, which this device does not implement.

Can the ZZ (Sleep) pin be used to reduce power during idle periods?

Yes - asserting ZZ LOW places the device in low-power sleep mode, reducing ICC to ≤5 mA. Unlike CEN, ZZ disables internal clocks and memory array biasing. Recovery time is 20 ns, and the device retains data. This is distinct from CEN, which only gates CLK but maintains full readiness.

Is the 165-ball FBGA package of CY7C1460AV33-167AXI compatible with standard reflow profiles?

Yes - the 165-ball FBGA (15 × 17 mm, 0.8 mm pitch) is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C, 60-second duration above 217°C). Board layout must follow Cypress's recommended pad stack and stencil aperture guidelines to ensure solder joint reliability.

CY7C1460AV33-167AXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1460AV33-167AXI FAQ

1.How can I place an order for CY7C1460AV33-167AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460AV33-167AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460AV33-167AXI reliable?

The price and inventory of CY7C1460AV33-167AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460AV33-167AXI is usually 5 days.

3.What payment methods are accepted for CY7C1460AV33-167AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460AV33-167AXI transactions.

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CY7C1460AV33-167AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460AV33-167AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460AV33-167AXI?

For technical support, including CY7C1460AV33-167AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460AV33-167AXI requirements.

6.How does Aetrix verify that CY7C1460AV33-167AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1460AV33-167AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460AV33-167AXI meets industry standards.

7.What is the process for return or replacement of CY7C1460AV33-167AXI?

All CY7C1460AV33-167AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460AV33-167AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460AV33-167AXI part is unused and in its original packaging.

Return procedure for CY7C1460AV33-167AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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