Infineon Technologies CY7C1460AV33-167AXIT
- Part No.:
- CY7C1460AV33-167AXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1460AV33-167AXIT.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,702
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1460AV33-167AXIT from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with 3.3 V core supply, 3.3 V/2.5 V I/O support, and delivers 3.4 ns clock-to-output delay. Its fully registered interface enables true back-to-back read/write operations without wait states in packet buffering applications.
For engineers reviewing the CY7C1460AV33-167AXIT datasheet, CY7C1460AV33-167AXIT pinout, CY7C1460AV33-167AXIT application, or CY7C1460AV33-167AXIT equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write granularity (BWa–BWd), synchronous self-timed write timing, and compatibility with ZBT-style bus protocols in high-speed data path designs.
Technical Context
The device implements a fully synchronous, rising-edge-triggered interface with three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) and clock enable (CEN) to gate CLK recognition. All address, control, and data inputs are registered on the rising edge of CLK when CEN is asserted.
It features internal burst logic supporting linear or interleaved burst orders via MODE strap, synchronous self-timed writes qualified by WE and BW signals, and output drivers synchronously tristated during write data cycles to prevent bus contention - eliminating need for external OE timing management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 167 MHz - supports sustained 167 MT/s throughput with zero wait states |
| Access Time (tCO) | 3.4 ns - guaranteed clock-to-output delay for timing-critical read paths |
| Supply Voltages | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - enables interoperability with mixed-voltage ASIC/FPGA interfaces |
| Burst Capability | Linear or interleaved burst order - selected by MODE pin; required for cache-line-aligned access in protocol engines |
| Byte Write Control | Four independent BWa–BWd signals - enables selective 9-bit writes to DQa/DQPa through DQd/DQPd groups |
| Power Management | ZZ sleep mode and stop-clock option - reduces standby current to ≤120 mA while preserving data |
Pinout & Package
Package: JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, surface-mountable with standard reflow profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock; qualified by CEN - defines all register sampling boundaries |
| CEN | Clock enable (active LOW) | Gate for CLK recognition; deassertion extends previous cycle without deselecting device |
| CE1, CE3 | Chip enable (active LOW) | Combined with CE2 (active HIGH) for 3-signal bank decode - enables multi-SRAM memory mapping |
| BWa–BWd | Byte write select (active LOW) | Independent 9-bit write masking for DQa/DQPa through DQd/DQPd - eliminates need for external write gating logic |
| ADV/LD | Address advance/load control | HIGH advances internal burst counter; LOW loads new address - enables seamless burst vs. random access switching |
| MODE | Burst order configuration strap | Static input: HIGH = interleaved, LOW = linear - determines address sequence for burst reads/writes |
| ZZ | Deep sleep mode enable | Active LOW entry into low-power state with data retention - critical for power-constrained line card designs |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL) architecture | Enables unlimited consecutive read/write transitions with no wait states - essential for packet buffer FIFOs in 10G+ Ethernet switches |
| Fully registered I/O interface | All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in high-speed PCB layouts with matched trace lengths |
| Synchronous self-timed writes | On-chip write timing control eliminates external write pulse width constraints - removes need for FPGA/ASIC write strobe generation logic |
| IEEE 1149.1 JTAG boundary scan | Full scan chain support (TCK/TDI/TDO/TMS) - enables in-system testability and interconnect verification on dense line card assemblies |
| 3.3 V/2.5 V I/O flexible voltage | VDDQ independently configurable - allows direct interfacing with both 3.3 V and 2.5 V logic families without level shifters |
Applications
| Packet Buffer Memory | Network Processor Interface |
|---|---|
|
Use Scenario: High-speed packet buffering in Layer 2/3 switches handling 10 Gbps+ line rates with variable packet sizes. IC Role / Device Role / Timing Role: Primary burst-access SRAM providing zero-latency read/write turnaround for ingress/egress FIFOs. Use Value: NoBL architecture sustains full 167 MT/s throughput across mixed read/write sequences - avoids pipeline stalls that degrade switch fabric utilization. |
Use Scenario: External memory for network processors requiring deterministic latency and burst-aligned data transfers. IC Role / Device Role / Timing Role: Synchronous pipelined memory mapped to NP's external bus, configured for interleaved burst to match cache-line fetch patterns. Use Value: Fully registered interface and 3.4 ns tCO meet tight setup/hold timing budgets of 167 MHz NP buses without added logic delay. |
| Telecom Line Card Buffer | Baseband Processing Cache |
|
Use Scenario: ATM/SONET framer buffering in OC-192 line cards where deterministic latency and error resilience are mandatory. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration for continuous frame capture and processing. Use Value: ZZ sleep mode reduces idle power by >80% during low-traffic periods while retaining data integrity - critical for NEBS-compliant thermal design. |
Use Scenario: Shared instruction/data cache between multiple DSP cores in wireless baseband units. IC Role / Device Role / Timing Role: High-bandwidth memory resource supporting concurrent read/write from multiple masters via CE partitioning. Use Value: Four independent byte-write enables (BWa–BWd) allow precise 9-bit updates to parity-protected data - maintains ECC coherency without full-word writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 16-Mbit (512K × 32), 167 MHz, 3.3 V only, no VDDQ flexibility | Lacks byte-write parity support and MODE-configurable burst order | Select when lower density suffices and I/O voltage matching is fixed at 3.3 V |
| ISSI IS61WV102436B | 36-Mbit (1M × 36), 166 MHz, 3.3 V core/I/O, no JTAG or ZZ mode | Missing IEEE 1149.1 scan and deep-sleep capability - limits testability and power optimization | Choose for cost-sensitive designs where boundary scan and ultra-low standby are not required |
Compared with IDT72V2115L16PF and IS61WV102436B, CY7C1460AV33-167AXIT uniquely combines full ZBT pin compatibility, dual-voltage I/O, hardware-configurable burst order, and integrated JTAG - making it the only option supporting both high-assurance testability and mixed-voltage system integration in telecom infrastructure.
Availability
CY7C1460AV33-167AXIT is available at Aetrix Electronics and suitable for packet buffering, network processor interfacing, and telecom line card applications requiring stable component supply, long-lifecycle support, and RoHS-compliant manufacturing.
Supply support for CY7C1460AV33-167AXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable systems-on-chip for industrial, automotive, and communications markets.
CY7C1460AV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-throughput data buffering in networking and telecom infrastructure where deterministic latency and bus efficiency are critical.
FAQ
What does "NoBL™" mean and how does it improve system performance?
NoBL™ (No Bus Latency) is Cypress's proprietary architecture enabling consecutive read and write operations without wait states. Unlike conventional SRAMs requiring turnaround cycles, CY7C1460AV33 uses internal pipelining and synchronous self-timed writes to deliver data on every clock edge - increasing effective bandwidth by up to 40% in mixed-access workloads like packet buffering.
Can CY7C1460AV33-167AXIT operate with 2.5 V I/O while maintaining 3.3 V core supply?
Yes. The device supports independent VDDQ (I/O supply) at either 3.3 V or 2.5 V while VDD (core) remains at 3.3 V. This is confirmed in the DC specifications table (Rev. *P, p.19) and allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters - provided VDDQ and VDD are ramped monotonically during power-up.
How is burst order selected, and can it be changed dynamically?
Burst order (linear or interleaved) is set by the MODE pin at power-up and latched internally. MODE must remain static during operation - changing it mid-operation causes undefined behavior per Functional Description (p.7). Interleaved is default (MODE floating HIGH); linear requires pulling MODE LOW before initialization.
Does CY7C1460AV33-167AXIT support JTAG boundary scan in-system testing?
Yes. It implements full IEEE 1149.1 JTAG compliance with TCK, TDI, TDO, and TMS pins. The boundary scan chain covers all I/Os and control signals, enabling interconnect testing and fault isolation on populated PCBs - detailed in Sections 11–15 of the datasheet (pp.11–15).
CY7C1460AV33-167AXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1460AV33-167AXIT FAQ
1.How can I place an order for CY7C1460AV33-167AXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460AV33-167AXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460AV33-167AXIT reliable?
The price and inventory of CY7C1460AV33-167AXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460AV33-167AXIT is usually 5 days.
3.What payment methods are accepted for CY7C1460AV33-167AXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460AV33-167AXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1460AV33-167AXIT?
CY7C1460AV33-167AXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460AV33-167AXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460AV33-167AXIT?
For technical support, including CY7C1460AV33-167AXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460AV33-167AXIT requirements.
6.How does Aetrix verify that CY7C1460AV33-167AXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1460AV33-167AXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460AV33-167AXIT meets industry standards.
7.What is the process for return or replacement of CY7C1460AV33-167AXIT?
All CY7C1460AV33-167AXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460AV33-167AXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460AV33-167AXIT part is unused and in its original packaging.
Return procedure for CY7C1460AV33-167AXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1460AV33-167AXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

