Infineon Technologies CY7C1460AV33-200AXC

Overview

CY7C1460AV33-200AXC from Cypress Semiconductor is a 3.3V, 36 Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems requiring zero-wait-state back-to-back read/write operations at 200 MHz. It features fully registered inputs/outputs, byte write capability via four BW pins (BWa–BWd), 3.3V core and 3.3V/2.5V I/O supply support, and clock-enable (CEN) controlled operation. Used in network packet buffers, FPGA co-processor caches, and telecom line-card data path memory.

For engineers reviewing the CY7C1460AV33-200AXC datasheet, CY7C1460AV33-200AXC pinout, CY7C1460AV33-200AXC application, or CY7C1460AV33-200AXC equivalent, key selection criteria include its 200 MHz maximum bus frequency, 3.2 ns clock-to-output time, JEDEC-standard 100-pin TQFP or 165-ball FBGA packaging, synchronous self-timed writes, and ZBT-compatible functional equivalence.

Technical Context

The device implements a No Bus Latency™ (NoBL™) logic architecture enabling true consecutive read/write cycles without wait states, driven by rising-edge-triggered input and output registers synchronized to CLK. All address, control, and data signals-including CE1 (active-low), CE2 (active-high), CE3 (active-low), WE, and BWa–BWd-are sampled on the rising edge of CLK when CEN is asserted low.

Output drivers are synchronously tristated during write-data phases to prevent bus contention, while asynchronous OE provides additional output enable control. Burst addressing supports both linear and interleaved orders via MODE pin configuration, and IEEE 1149.1 JTAG boundary scan is integrated for testability in high-density PCBs.

Key Specifications

Pinout & Package

The CY7C1460AV33-200AXC is available in a 100-pin TQFP (JEDEC MO-145AA) and a 165-ball FBGA (15 × 17 mm, 0.8 mm pitch). Both packages support Pb-free and RoHS-compliant assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2115L10PF and IS61WV102436B, the CY7C1460AV33-200AXC uniquely delivers 200 MHz operation with dual-voltage I/O, integrated ZZ sleep, and JTAG-all in both TQFP and FBGA packages-making it optimal for upgradable telecom and high-reliability embedded designs.

Availability

CY7C1460AV33-200AXC is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom line-card memory applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1460AV33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

The CY7C1460AV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory subsystems in networking infrastructure and real-time embedded systems demanding deterministic timing and robust burst operation.

FAQ

What is the function of the MODE pin on CY7C1460AV33-200AXC?

The MODE pin configures burst addressing order: tied to VDD for interleaved burst (used in cache-like access patterns), or grounded for linear burst (suitable for sequential streaming). It is sampled at power-up and remains static during operation-no dynamic reconfiguration is supported. This setting directly affects how ADV/LD increments the internal address counter across successive clock cycles.

Can CY7C1460AV33-200AXC operate with 2.5V I/O while maintaining 3.3V core supply?

Yes-VDDQ (I/O supply) accepts 2.5 V ±0.2 V independently of VDD (3.3 V ±0.3 V core supply). This allows direct interfacing with 2.5V FPGAs or ASICs without level shifters. The device maintains full 200 MHz operation and all timing specifications under this mixed-supply condition, as validated in the datasheet's 2.5V TAP AC test conditions section.

How does the ZZ (Sleep) mode affect data retention and wake-up timing?

In ZZ mode (pin driven LOW), the device enters ultra-low-power state drawing <100 µA while retaining full memory contents. Wake-up is synchronous: after ZZ returns HIGH, the device requires one full CLK cycle plus tZZH (min 5 ns) before accepting new commands. No initialization sequence is needed-the internal state machine resumes operation transparently.

Is the CY7C1460AV33-200AXC pin-compatible with faster 250 MHz variants like CY7C1460AV33-250AXC?

Yes-CY7C1460AV33-200AXC shares identical pinout, package dimensions, and electrical interface with -250AXC and -167AXC speed grades. The only differences are internal timing parameters (e.g., tCO = 3.2 ns vs. 2.6 ns) and maximum guaranteed clock frequency. System-level compatibility is maintained across all speed grades in the same package.