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Infineon Technologies CY7C1460AV33-250AXI

Part No.:
CY7C1460AV33-250AXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1460AV33-250AXI.pdf
Description:
IC SRAM 36MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,246

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Product details

Overview

CY7C1460AV33 from Cypress Semiconductor is a 3.3V, 1M × 36 (36 Mbit) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems requiring zero-wait-state back-to-back read/write operations at 250 MHz. It features fully registered inputs/outputs, byte-write capability via BWa–BWd, 2.6 ns clock-to-output delay, and supports 3.3V core / 3.3V or 2.5V I/O supply rails. Used in network packet buffers, FPGA co-processor caches, and telecom line-card data path memory.

For engineers reviewing the CY7C1460AV33 datasheet, CY7C1460AV33 pinout, CY7C1460AV33 application, or CY7C1460AV33 equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed write timing, JTAG boundary scan compliance, and compatibility with ZBT-style bus protocols in high-speed memory interfaces.

Technical Context

The CY7C1460AV33 implements a fully synchronous, pipelined memory architecture where all address, control, and data signals are registered on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without wait states, achieving sustained 250 MHz throughput.

It integrates three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank decoding, asynchronous OE for output tristate control, and dedicated byte write selects (BWa–BWd) that gate writes to four 9-bit data groups. Output drivers are synchronously disabled during write data phases to prevent bus contention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 organization), enabling single-chip replacement for legacy ZBT SRAMs in 36-bit wide data paths.
Max Clock Frequency 250 MHz - supports full-speed operation with zero wait states in high-bandwidth memory controllers.
Access Time 2.6 ns - defines minimum clock-to-valid-output delay for timing-critical read cycles.
Supply Voltages VDD = 3.135–3.6 V (core); VDDQ = 2.3–3.6 V (I/O) - allows interoperability with both 2.5V and 3.3V logic families.
Write Cycle Control Synchronous self-timed writes using WE + BWa–BWd - eliminates external write pulse width constraints and simplifies controller design.
Burst Capability Linear or interleaved burst order - matches standard memory controller addressing patterns for cache line fills and DMA transfers.
JTAG Support IEEE 1149.1-compliant boundary scan - enables in-system testability and PCB-level fault isolation without additional test fixtures.

Pinout & Package

Available in JEDEC-standard Pb-Free 100-pin TQFP (14 × 14 mm) and 165-ball FBGA (15 × 17 mm, 1.4 mm height). Pin functions are synchronized to CLK rising edge except OE (asynchronous) and ZZ (sleep mode control).

Pin/Terminal Circuit Role Design Meaning
A0–A19 Synchronous Address Input 20-bit address bus sampled on CLK rising edge; supports full 1M-word addressing space.
BWa–BWd Synchronous Byte Write Select Active-low controls write enable for DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd groups respectively.
CE1, CE3 Synchronous Chip Enable (active low) Combined with CE2 (active high) to decode device selection; all sampled on CLK rising edge.
CLK, CEN Clock input and enable CLK only recognized when CEN = LOW; deasserting CEN extends previous cycle without deselection.
OE Asynchronous Output Enable Tristates outputs when HIGH; masked during write data phase and after deselection to avoid bus conflicts.
DQa–DQd, DQPa–DQPd Bidirectional Data I/O 36-bit data bus (4 × 9-bit groups); direction controlled by OE and internal logic; outputs registered on CLK rising edge.
ADV/LD Advance/Load Control HIGH advances internal burst counter; LOW loads new address - enables seamless burst and random access modes.
ZZ Deep Sleep Mode Input Active-low entry into low-power sleep state (<120 µA standby current), retaining memory contents.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) Architecture Enables true back-to-back read/write operations with no wait states, delivering sustained 250 MHz throughput in burst-mode systems.
Byte-Write Granularity (BWa–BWd) Allows independent 9-bit writes within 36-bit word - critical for partial updates in packet header processing and descriptor management.
Fully Registered I/O Path All inputs and outputs pass through CLK-synchronized registers, eliminating setup/hold violations and easing timing closure in FPGA-based controllers.
Flexible I/O Voltage (VDDQ) Supports 2.5V or 3.3V I/O interface independently of 3.3V core supply - simplifies integration with mixed-voltage SoCs and FPGAs.
IEEE 1149.1 Boundary Scan Provides standardized test access for interconnect verification and fault diagnosis on dense PCBs without physical probe points.

Applications

Network Packet Buffer FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/3 switches before classification and forwarding.

IC Role / Device Role / Timing Role: High-speed, low-latency shared memory between MAC and switch fabric logic, operating at line rate (10 Gbps+).

Use Value: 250 MHz zero-wait-state operation ensures deterministic frame buffering with no pipeline stalls during bursty traffic.

Use Scenario: Acting as local instruction/data scratchpad for soft-core processors (e.g., MicroBlaze) embedded in Xilinx FPGAs.

IC Role / Device Role / Timing Role: Synchronous pipelined memory interfaced directly to FPGA fabric via dedicated high-speed I/O banks.

Use Value: Fully registered interface eliminates timing closure challenges; byte-write capability enables efficient variable-length data structure updates.

Telecom Line Card Memory Real-Time Signal Processing Buffer

Use Scenario: Holding time-division multiplexed (TDM) voice channel samples in base station remote radio units (RRUs).

IC Role / Device Role / Timing Role: Dual-port-like behavior via burst reads/writes synchronized to system clock domain for jitter-free sample transfer.

Use Value: Interleaved burst mode aligns with TDM frame boundaries; ZZ sleep mode reduces power during idle slots.

Use Scenario: Buffering sensor data streams (e.g., radar ADC output) for real-time FFT or filtering in defense/aerospace systems.

IC Role / Device Role / Timing Role: Low-jitter, deterministic memory stage between ADC interface and DSP engine, minimizing pipeline bubbles.

Use Value: 2.6 ns clock-to-output ensures minimal latency in feedback loops; JTAG scan supports field-replaceable module validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L15PF 2.5V-only core/I/O; 15 ns access at 66 MHz; no JTAG; 165-ball FBGA only Limited to lower-frequency industrial control; lacks burst flexibility and sleep mode Select when cost-sensitive, non-telecom designs require basic ZBT compatibility without high-speed or low-power features
ISSI IS61WV102436B 3.3V core/I/O; 167 MHz max; 3.4 ns access; no ADV/LD or MODE pin; simpler control set Suitable for static burst applications but not dynamic address loading or interleaved bursts Choose for simplified controller logic where full NoBL™ feature set is unnecessary and 250 MHz is not required

Compared with IDT72V2115L15PF and IS61WV102436B, the CY7C1460AV33 delivers higher bandwidth (250 MHz vs ≤167 MHz), lower latency (2.6 ns), integrated JTAG, and flexible burst/addressing modes - making it optimal for next-generation networking and real-time embedded memory subsystems.

Availability

CY7C1460AV33 is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor caches, and telecom line card memory requiring stable component supply across extended product lifecycles.

Supply support for CY7C1460AV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

The CY7C1460AV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in networking infrastructure, baseband processing, and real-time embedded systems demanding deterministic timing.

FAQ

What is the function of the MODE pin on CY7C1460AV33?

The MODE pin selects burst addressing order: tied to VDD for interleaved burst (used in cache-line fills), or grounded for linear burst (suitable for sequential DMA transfers). It is sampled at power-up and latched; changing it mid-operation has no effect. This pin is not present on the CY7C1460AV33 variant - it appears only on CY7C1462AV33 and CY7C1464AV33 per datasheet Figure 2 and Pin Definitions table.

Can CY7C1460AV33 operate with 2.5V I/O while maintaining 3.3V core supply?

Yes. VDDQ (I/O supply) accepts 2.3–3.6 V, independent of VDD (core supply, 3.135–3.6 V). This allows direct interfacing with 2.5V FPGA I/O banks or ASICs while preserving full 250 MHz performance and 2.6 ns access time - confirmed in DC Electrical Characteristics Table on page 19 of Rev. *F datasheet.

How does the ZZ (Sleep) mode affect data retention and wake-up time?

In ZZ mode (pin driven LOW), the device enters deep sleep with typical standby current <120 µA while retaining all stored data. Wake-up is synchronous: exit occurs on the first valid CLK rising edge after ZZ returns HIGH, with no additional latency beyond one clock cycle - verified in Sleep Mode section (page 9) and AC Switching Characteristics (page 21).

Is CY7C1460AV33 pin-compatible with standard ZBT SRAMs like IDT72V2115?

Yes - the CY7C1460AV33 is explicitly stated as "pin compatible and functionally equivalent to ZBT" devices in its datasheet Features section. It matches ZBT pinouts for 100-pin TQFP and 165-ball FBGA packages, including identical signal names, placement, and timing behavior for CE, WE, OE, CLK, and DQ pins.

CY7C1460AV33-250AXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
2.6 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1460AV33-250AXI FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1460AV33-250AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1460AV33-250AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460AV33-250AXI is usually 5 days.

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5.How can I obtain technical support or documentation for CY7C1460AV33-250AXI?

For technical support, including CY7C1460AV33-250AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460AV33-250AXI requirements.

6.How does Aetrix verify that CY7C1460AV33-250AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1460AV33-250AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460AV33-250AXI meets industry standards.

7.What is the process for return or replacement of CY7C1460AV33-250AXI?

All CY7C1460AV33-250AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460AV33-250AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460AV33-250AXI part is unused and in its original packaging.

Return procedure for CY7C1460AV33-250AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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