Infineon Technologies CY7C1460BV25-250BZXC
- Part No.:
- CY7C1460BV25-250BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1460BV25-250BZXC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1460BV25-250BZXC from Cypress Semiconductor is a 36-Mbit (1 M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems requiring zero-wait-state back-to-back read/write operations at 250 MHz. It features 2.5 V core/I/O supplies, 2.6 ns clock-to-output delay, byte-write capability via four BW inputs, and IEEE 1149.1 JTAG boundary scan support in a 165-ball FBGA package.
For engineers reviewing the CY7C1460BV25-250BZXC datasheet, CY7C1460BV25-250BZXC pinout, CY7C1460BV25-250BZXC application, or CY7C1460BV25-250BZXC equivalent, key selection criteria include burst order configuration (linear/interleaved), synchronous self-timed write timing, CEN-controlled clock gating, and compatibility with ZBT™-based system designs.
Technical Context
This SRAM implements fully registered synchronous operation: all address, control, and data inputs are latched on the rising edge of CLK (qualified by CEN), and all outputs pass through output registers synchronized to the same edge. The NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without pipeline stalls.
Burst addressing is controlled by ADV/LD and MODE pins-supporting both linear and interleaved orders-and write operations use on-chip self-timed circuitry with byte-select granularity (BWa–BWd). Three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) provide flexible bank selection, while asynchronous OE manages output tri-state during writes and deselects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1 M × 36 organization) |
| Max Clock Frequency | 250 MHz - enables zero-wait-state bus operation in high-speed interfaces |
| Access Time (tCO) | 2.6 ns - deterministic clock-to-output delay for timing-critical pipelines |
| Supply Voltages | 2.5 V core and I/O - compatible with 2.5 V logic families and low-power system rails |
| Burst Capability | Linear or interleaved - configurable via MODE pin for optimal cache-line alignment |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testability without external test logic |
| Power Management | ZZ sleep mode and CEN-gated clock - reduces dynamic power during idle cycles |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A | Address Input | Synchronous address latch sampled on rising CLK edge; defines 1 M-word location |
| BWa–BWd | Byte Write Select | Active-low synchronous controls for DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd |
| CLK, CEN | Clock & Enable | Rising-edge-triggered clock qualified by CEN; CEN HIGH suspends operation without deselection |
| CE1, CE2, CE3 | Chip Enable | Three-input decode (CE1↓, CE2↑, CE3↓) enables depth expansion and bank isolation |
| DQa–DQd / DQPa–DQPd | Data I/O & Parity | 36-bit bidirectional data bus with 4 parity bits; auto-tri-stated during write data phase |
| MODE | Burst Order Control | Strap pin selecting linear (LOW) or interleaved (HIGH) burst addressing sequence |
| ADV/LD | Address Counter Control | HIGH advances internal burst counter; LOW loads new address after deselect |
| OE | Output Enable | Asynchronous, active-low; masked during write data phase to prevent bus contention |
| ZZ | Deep Sleep | Active-low entry into low-power standby mode with retained data |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables true back-to-back read/write cycles with no pipeline bubbles or wait states |
| Synchronous Self-Timed Writes | On-chip timing eliminates external write pulse width constraints and simplifies controller design |
| Configurable Burst Order | MODE pin selects linear or interleaved addressing to match processor/cache burst patterns |
| Byte-Write Granularity | Four independent BW signals allow partial 8-bit writes within 36-bit word without read-modify-write |
| JTAG Boundary Scan | Full IEEE 1149.1 support enables PCB-level interconnect testing and debug visibility |
Applications
| High-Speed Network Switching | Telecom Line Card Buffering |
|---|---|
Use Scenario: Storing packet headers and metadata in multi-gigabit Ethernet switch ASICs requiring sub-3 ns access latency. IC Role / Device Role / Timing Role: Primary pipeline buffer SRAM interfacing directly with SerDes MAC controllers and traffic managers. Use Value: 250 MHz zero-wait-state operation sustains full line-rate throughput across 10G/25G/40G ports without stalling the datapath. | Use Scenario: Acting as shared buffer memory in carrier-grade SDH/SONET line cards handling OC-192 and OTU3 traffic. IC Role / Device Role / Timing Role: Dual-port accessible burst SRAM supporting simultaneous ingress/egress scheduling and header processing. Use Value: Byte-write capability and burst ordering flexibility reduce memory bandwidth overhead by 35% vs. legacy async SRAMs. |
| Real-Time Video Processing | Industrial Motion Controller Cache |
Use Scenario: Frame buffering and pixel reordering in 4K60 video encoders with FPGA-based image pipelines. IC Role / Device Role / Timing Role: Low-latency frame store synchronized to pixel clock domain with precise burst alignment. Use Value: 2.6 ns tCO and MODE-configurable burst order ensure deterministic pixel fetch timing across multiple parallel streams. | Use Scenario: Storing motion trajectory tables and real-time servo loop coefficients in CNC and robotics controllers. IC Role / Device Role / Timing Role: Deterministic-access SRAM co-located with DSP/FPGA for jitter-free position update cycles. Use Value: ZZ sleep mode and CEN gating enable microsecond-scale power cycling between motion segments without data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 1.8 V core supply; 165-ball FBGA; 167 MHz max frequency; no ZZ sleep mode | Limited to lower-power, lower-frequency systems; lacks deep-sleep and JTAG | Select when 1.8 V system integration and cost sensitivity outweigh 250 MHz performance needs. |
| ISSI IS61WV102436B | 3.3 V core/I/O; 165-ball FBGA; 166 MHz max frequency; no NoBL™ or burst order control | Requires external wait-state insertion; no burst optimization for cache-line access | Choose only for legacy 3.3 V designs where pin compatibility with older ZBT devices is mandatory. |
Compared with IDT72V2115L15PF and IS61WV102436B, CY7C1460BV25-250BZXC delivers 50% higher bandwidth, integrated power management (ZZ/CEN), and configurable burst behavior-critical for modern packet-processing and real-time control pipelines.
Availability
CY7C1460BV25-250BZXC is available at Aetrix Electronics and suitable for high-speed network switching, telecom line card buffering, real-time video processing, and industrial motion controller cache applications requiring stable component supply and long-term manufacturability.
Supply support for CY7C1460BV25-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC mixed-signal arrays, and USB/USB-C solutions for industrial, automotive, and communications markets.
CY7C1460BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for eliminating bus latency in high-clock-rate memory subsystems used in networking, telecom, and real-time embedded systems.
FAQ
What is the function of the MODE pin on CY7C1460BV25-250BZXC?
The MODE pin is a strap input that configures burst addressing order: pulled HIGH (or left floating) selects interleaved burst mode, while pulled LOW selects linear burst mode. It must remain static during operation and is sampled at power-up or reset. This setting directly determines how consecutive addresses increment during burst reads/writes, aligning with processor or ASIC burst expectations.
How does the ZZ pin differ from CEN in power management?
ZZ (deep sleep) disables internal circuitry including clocks, memory array, and I/O buffers, reducing current to ≤100 µA while retaining data. CEN (clock enable) only gates the CLK input-preserving register states and allowing immediate resumption-but draws ~120 mA standby current. ZZ is used for extended idle periods; CEN is for cycle-accurate clock suspension during brief pauses.
Can CY7C1460BV25-250BZXC operate with mixed voltage supplies (e.g., 2.5 V core + 3.3 V I/O)?
No. The device requires strictly 2.5 V ±0.2 V for both VDD (core) and VDDQ (I/O) supplies. Applying 3.3 V to VDDQ exceeds absolute maximum ratings and risks permanent damage. Interface to 3.3 V systems requires level-shifting on all I/O lines, or use of a compatible 3.3 V SRAM such as the IS61WV102436B (with associated performance trade-offs).
Is the CY7C1460BV25-250BZXC pin-compatible with ZBT™ SRAMs?
Yes-Cypress explicitly states pin compatibility and functional equivalence with industry-standard ZBT™ SRAMs (e.g., IDT 72V2115 series). This includes identical pin functions, timing behavior, and package footprints (165-ball FBGA), enabling drop-in replacement in existing ZBT-based designs without layout changes or firmware updates.
CY7C1460BV25-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 2.6 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1460BV25-250BZXC FAQ
1.How can I place an order for CY7C1460BV25-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460BV25-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460BV25-250BZXC reliable?
The price and inventory of CY7C1460BV25-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460BV25-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1460BV25-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460BV25-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1460BV25-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460BV25-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460BV25-250BZXC?
For technical support, including CY7C1460BV25-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460BV25-250BZXC requirements.
6.How does Aetrix verify that CY7C1460BV25-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1460BV25-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460BV25-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1460BV25-250BZXC?
All CY7C1460BV25-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460BV25-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460BV25-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1460BV25-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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