Infineon Technologies CY7C1460KV25-167AXC
- Part No.:
- CY7C1460KV25-167AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1460KV25-167AXC.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,614
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1460KV25-167AXC from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, integrated ECC, 2.5 V core/I/O supply, and 167 MHz maximum bus operation. It supports zero-wait-state back-to-back read/write cycles in high-throughput networking buffers and packet processors.
For engineers reviewing the CY7C1460KV25-167AXC datasheet, CY7C1460KV25-167AXC pinout, CY7C1460KV25-167AXC application, or CY7C1460KV25-167AXC equivalent, key selection criteria include burst mode support (linear/interleaved), byte-write capability (BWa–BWd), synchronous self-timed writes, JTAG boundary scan compliance, and 100-pin TQFP package compatibility.
Technical Context
This SRAM implements fully registered pipelined I/O with clocked address, data, and control inputs-all sampled on the rising edge of CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write operations without wait states, delivering sustained throughput at 167 MHz.
The device integrates on-chip ECC encoding/decoding to detect and correct single-bit errors, reducing soft error rate (SER) in radiation-sensitive environments. It supports three chip enables (CE1/CE2/CE3), asynchronous OE, clock enable (CEN), and ZZ sleep mode for power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 configuration) |
| Max Clock Frequency | 167 MHz - enables 167 million true back-to-back read/write operations per second |
| Access Time | 3.4 ns - defines minimum clock-to-output delay for timing-critical burst reads |
| Core/I/O Voltage | 2.5 V - requires single-supply rail; eliminates level-shifting in 2.5 V system interfaces |
| ECC Support | On-chip encoder/decoder - corrects single-bit errors and detects double-bit errors per 36-bit word |
| Burst Capability | Linear or interleaved - matches CPU or ASIC burst addressing patterns without external logic |
| Power Dissipation | 190 mA (max operating current, ×36 mode) - determines thermal design margin in dense PCB layouts |
Pinout & Package
Package: 100-pin JEDEC-standard Pb-free TQFP (14 mm × 14 mm, 0.5 mm pitch). Pinout validated per Document 001-66679 Rev. *J, Figure 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | 20-bit synchronous address bus; sampled on rising CLK edge to select one of 1M locations |
| DQa–DQd / DQPa–DQPd | Data I/O (36-bit + 4-bit parity) | 36-bit bidirectional data path with dedicated parity lines; direction controlled by OE and internal write sequencing |
| BWa–BWd | Byte Write Select | Four independent active-low signals enabling partial writes to 9-bit subwords (DQa/DQPa, etc.) |
| CLK, CEN | Clock & Enable | CLK qualified by CEN; deasserting CEN extends previous cycle without deselecting device |
| CE1, CE2, CE3 | Chip Enable Group | Three-signal bank selection logic (CE1/CE3 active low, CE2 active high) for multi-SRAM memory systems |
| ADV/LD | Burst Address Control | High = advance internal counter; Low = load new address - enables seamless burst transfers |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Eliminates bus latency by enabling true back-to-back read/write with no wait states at 167 MHz |
| Synchronous Self-Timed Writes | Removes external write pulse timing constraints; internal logic guarantees reliable data capture per clock cycle |
| IEEE 1149.1 JTAG Boundary Scan | Enables in-system testability and interconnect verification without additional test fixtures |
| ZZ Sleep Mode | Reduces standby current significantly while preserving data; exit time ≤ 20 ns for rapid wake-up |
| Byte Write with Parity | Independent BWa–BWd control over 9-bit subwords plus corresponding parity bits ensures data integrity during partial updates |
Applications
| Network Packet Buffer | Telecom Line Card Cache |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed dual-port buffer supporting concurrent ingress/egress traffic with ECC-protected storage. Use Value: 3.4 ns clock-to-output and zero-wait-state pipelining ensure deterministic frame buffering under 10 Gbps line rates. |
Use Scenario: Caching protocol headers and control tables in carrier-grade DSLAMs and OLTs requiring field reliability. IC Role / Device Role / Timing Role: ECC-equipped SRAM serving as fault-tolerant lookup table memory for QoS and ACL engines. Use Value: On-chip ECC reduces uncorrectable bit errors by >99% in neutron-rich environments, extending MTBF beyond 10 years. |
| Baseband Processor Memory | Radar Signal Processing Buffer |
|
Use Scenario: Holding intermediate FFT and channel estimation results in LTE/5G baseband ASICs with tight pipeline depth. IC Role / Device Role / Timing Role: Pipelined burst SRAM interfacing directly to FPGA or ASIC fabric via 36-bit synchronous bus. Use Value: Linear/interleaved burst modes align with DSP memory access patterns, achieving >92% bus utilization at 167 MHz. |
Use Scenario: Real-time buffering of digitized IF samples in phased-array radar receivers before FPGA-based beamforming. IC Role / Device Role / Timing Role: Low-latency, high-reliability memory staging raw ADC data with SER mitigation for mission-critical operation. Use Value: ZZ sleep mode cuts idle power by 75%, while 2.5 V operation simplifies power delivery in compact RF front-end modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 2.5 V, 36-Mbit ZBT™ SRAM; no on-chip ECC; 15 ns access time limits max frequency to 133 MHz | Lacks ECC and NoBL™ latency elimination - suitable only where SER immunity is not required | Select when cost sensitivity outweighs reliability requirements and system clock < 133 MHz |
| ISSI IS61WV102436B | 2.5 V, 36-Mbit pipelined SRAM; no ECC; 100-pin TQFP; max 133 MHz operation | Lower performance ceiling and no JTAG boundary scan - limits test coverage in high-volume production | Choose for legacy ZBT-compatible designs where ECC and 167 MHz are unnecessary |
Compared with IDT72V2115L15PF and IS61WV102436B, CY7C1460KV25-167AXC delivers higher bandwidth (167 vs. ≤133 MHz), guaranteed ECC correction, and JTAG testability-critical for telecom and defense applications demanding uptime and verifiability.
Availability
CY7C1460KV25-167AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and radar signal processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C1460KV25-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
CY7C1460KV25-167AXC belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, ECC-protected buffering in packet-switched infrastructure and real-time signal processing platforms.
FAQ
Does CY7C1460KV25-167AXC support both linear and interleaved burst orders?
Yes. The device supports both linear and interleaved burst addressing modes, selected via the MODE pin. Linear mode increments addresses sequentially (e.g., 0x0000 → 0x0001), while interleaved mode uses XOR-based addressing (e.g., 0x0000 → 0x0002) to match legacy processor burst patterns. This flexibility allows direct integration with Intel, ARM, and custom ASIC bus protocols without glue logic.
What is the function of the ADV/LD pin during burst operations?
ADV/LD controls the internal address counter: when HIGH (with CEN active), it advances the counter to the next burst address; when LOW, it loads a new starting address from A0–A19. This dual-mode operation enables seamless transitions between sequential bursts and random-access initiations, essential for dynamic packet buffer management in switching ASICs.
How does the on-chip ECC handle error detection and correction?
The ECC engine implements Hamming code across each 36-bit data word plus 4 parity bits (DQPa–DQPd), detecting all double-bit errors and correcting all single-bit errors per access. Correction occurs transparently during read cycles; no software intervention or retry is required. Uncorrectable errors assert an interrupt-capable flag (not pin-defined but observable via status register in compatible configurations).
Can CY7C1460KV25-167AXC operate with mixed voltage interfaces?
No. The device requires a single 2.5 V supply for both core logic and I/O circuits. It does not support mixed-voltage operation (e.g., 2.5 V core with 3.3 V I/O). All interface signals-including address, data, and control pins-must be driven and terminated within 2.5 V LVTTL specifications. Level shifters are required for interfacing with 3.3 V or 1.8 V systems.
CY7C1460KV25-167AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1460KV25-167AXC FAQ
1.How can I place an order for CY7C1460KV25-167AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV25-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV25-167AXC reliable?
The price and inventory of CY7C1460KV25-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV25-167AXC is usually 5 days.
3.What payment methods are accepted for CY7C1460KV25-167AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV25-167AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1460KV25-167AXC?
CY7C1460KV25-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460KV25-167AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV25-167AXC?
For technical support, including CY7C1460KV25-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV25-167AXC requirements.
6.How does Aetrix verify that CY7C1460KV25-167AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV25-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV25-167AXC meets industry standards.
7.What is the process for return or replacement of CY7C1460KV25-167AXC?
All CY7C1460KV25-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV25-167AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV25-167AXC part is unused and in its original packaging.
Return procedure for CY7C1460KV25-167AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1460KV25-167AXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

