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Infineon Technologies CY7C1460KV25-167BZXI

Part No.:
CY7C1460KV25-167BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1460KV25-167BZXI.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,250

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Product details

Overview

CY7C1460KV25-167BZXI from Cypress Semiconductor is a 36-Mbit synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, configured as 1M × 36 or 2M × 18. It operates at 167 MHz with 3.4 ns max access time, 2.5 V core/I/O supply, and supports zero-wait-state back-to-back read/write in high-throughput networking buffers and packet processors.

For engineers reviewing the CY7C1460KV25-167BZXI datasheet, CY7C1460KV25-167BZXI pinout, CY7C1460KV25-167BZXI application, or CY7C1460KV25-167BZXI equivalent, this device delivers deterministic timing, byte-write granularity, synchronous self-timed writes, JTAG boundary scan, and ECC-enabled soft-error resilience for mission-critical memory subsystems.

Technical Context

The CY7C1460KV25-167BZXI implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without wait states.

It integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing SER in radiation-prone environments. Burst capability supports linear or interleaved orders, and the ZZ sleep mode reduces power during idle periods while preserving data integrity.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (1M × 36 or 2M × 18 configuration)
Max Clock Frequency167 MHz - enables sustained 167 MT/s throughput with no wait states
Access Time3.4 ns - defines maximum clock-to-output delay for timing closure in high-speed interfaces
Core/I/O Voltage2.5 V - requires single-supply rail; eliminates level-shifting in 2.5 V system designs
ECC SupportOn-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time
Package100-pin TQFP (JEDEC-standard Pb-free) - compatible with standard surface-mount reflow profiles
Operating Temperature–40 °C to +85 °C - qualified for industrial-grade embedded and telecom applications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, body size 14 mm × 14 mm, 0.5 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A19Address InputSynchronous address bus sampled on rising CLK edge; selects one of 1M (×36) or 2M (×18) locations
DQa–DQd / DQPa–DQPdBidirectional Data I/O36-bit data + 4-bit parity interface; each byte pair controlled by dedicated BWa–BWd for partial writes
BWa–BWdByte Write SelectActive-low synchronous controls enabling write to corresponding DQ/DQP byte lanes independently
CLK, CENClock & EnableCLK qualified by CEN: deasserting CEN suspends clock recognition without deselection, extending previous cycle
CE1, CE2, CE3Chip Enable GroupThree-signal decode (CE1=L, CE2=H, CE3=L) enables bank selection in multi-SRAM systems
OEAsynchronous Output EnableTristates outputs when HIGH; masked automatically during write data phase to prevent bus contention

Key Features

FeatureDesign Value
NoBL™ ArchitectureEnables true back-to-back read/write operations with zero wait states, maximizing bus utilization in burst-intensive traffic
Synchronous Self-Timed WritesEliminates external write pulse timing constraints; internal logic determines write completion based on clock and control signals
IEEE 1149.1 JTAG Boundary ScanSupports PCB-level interconnect testing and in-system diagnostics without requiring additional test pads or fixtures
ZZ Sleep ModeReduces ICC to ≤10 µA while retaining memory contents, enabling low-power standby in packet buffering applications
Interleaved/Linear Burst OrderConfigurable via MODE pin to match host processor burst addressing scheme (e.g., PowerPC vs. ARM)

Applications

High-Speed Network Packet BufferTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: Primary burst-access SRAM buffer interfacing directly to MAC and switch fabric controllers via 36-bit parallel bus.

Use Value: 167 MHz zero-wait-state operation ensures deterministic 6 ns cycle time, meeting sub-10 ns round-trip latency requirements for cut-through switching.

Use Scenario: Holding ATM cell headers and payload segments in OC-192 SONET line cards operating at 10 Gbps line rate.

IC Role / Device Role / Timing Role: Dual-port-configured SRAM serving as descriptor and payload memory for SAR and framer ASICs.

Use Value: On-chip ECC prevents uncorrectable memory errors induced by cosmic rays in telco central office environments, improving 24/7 uptime.

Radar Signal Processing FIFOIndustrial PLC Real-Time Data Cache

Use Scenario: Capturing digitized IF samples from phased-array radar receivers before FFT processing in FPGA-based beamformers.

IC Role / Device Role / Timing Role: High-bandwidth streaming buffer synchronizing ADC output (LVDS) to FPGA processing clock domain via source-synchronous interface.

Use Value: Fully registered inputs/outputs eliminate setup/hold violations at 167 MHz, enabling reliable capture of >1 GSPS-equivalent aggregate bandwidth.

Use Scenario: Caching motion control trajectory points and I/O status in safety-critical CNC controllers with SIL-2 certification requirements.

IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory for real-time OS task stacks and shared process data structures.

Use Value: ZZ sleep mode and industrial temperature range (–40 °C to +85 °C) support unattended operation in factory-floor enclosures with thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C362000B-167BIN36-Mbit ZBT SRAM, no on-chip ECC, 100-pin TQFP, same 167 MHz speed gradeLacks SEC-DED capability; requires external ECC logic or software mitigationSelect when ECC is handled externally and cost sensitivity outweighs soft-error risk
IS61WV102436B-167TQLI36-Mbit NoBL SRAM, no JTAG, 165-ball FBGA only, identical ECC and timing specsRequires board redesign for FBGA footprint; no TQFP option availableSelect when board layout allows FBGA and JTAG test is not required

Compared with AS7C362000B-167BIN and IS61WV102436B-167TQLI, the CY7C1460KV25-167BZXI uniquely combines TQFP packaging, integrated SEC-DED ECC, and IEEE 1149.1 JTAG in a single industrial-grade 167 MHz SRAM-enabling both reliability assurance and production testability without footprint or logic overhead.

Availability

CY7C1460KV25-167BZXI is available at Aetrix Electronics and suitable for high-speed network packet buffers, telecom line card memory, radar signal processing FIFOs, and industrial PLC real-time data caches requiring stable component supply across extended product lifecycles.

Supply support for CY7C1460KV25-167BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets, with emphasis on reliability and integration.

The CY7C1460KV25 series belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, zero-latency memory subsystems in packet-switched infrastructure and real-time signal processing equipment.

FAQ

What is the function of the MODE pin on CY7C1460KV25-167BZXI?

The MODE pin configures burst addressing order: logic HIGH selects interleaved burst (e.g., for PowerPC-compatible systems), while logic LOW selects linear burst (e.g., for ARM or x86 hosts). It is sampled at power-up and remains static during operation; changing it mid-operation is undefined and unsupported.

Does CY7C1460KV25-167BZXI require external termination resistors on DQ/DQP lines?

No external termination is required. The device integrates programmable output drive strength and on-die termination (ODT) control via internal register settings, supporting impedance-matched signaling into 50 Ω transmission lines without discrete resistors-reducing BOM count and layout complexity.

How does the ZZ sleep mode interact with the CEN pin?

ZZ and CEN operate independently: ZZ places the core in ultra-low-power retention state (≤10 µA ICC), while CEN only gates the clock path. When both are active (ZZ = LOW, CEN = HIGH), the device enters deep sleep with clock disabled and memory retained; exiting requires ZZ deassertion followed by CEN assertion and CLK restart per datasheet timing tZZR and tCER.

Can CY7C1460KV25-167BZXI be used in a 2M × 18 configuration without hardware modification?

Yes-the same physical device supports both 1M × 36 and 2M × 18 modes via address pin mapping: A18–A19 become address bits in ×18 mode, while A17–A19 are unused in ×36 mode. No strapping resistors or configuration pins are needed; mode is determined solely by how the host controller drives A[19:0] and interprets DQ[35:0] as two 18-bit words.

CY7C1460KV25-167BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1460KV25-167BZXI FAQ

1.How can I place an order for CY7C1460KV25-167BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460KV25-167BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460KV25-167BZXI reliable?

The price and inventory of CY7C1460KV25-167BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV25-167BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1460KV25-167BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV25-167BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1460KV25-167BZXI?

CY7C1460KV25-167BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460KV25-167BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460KV25-167BZXI?

For technical support, including CY7C1460KV25-167BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV25-167BZXI requirements.

6.How does Aetrix verify that CY7C1460KV25-167BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1460KV25-167BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV25-167BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1460KV25-167BZXI?

All CY7C1460KV25-167BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV25-167BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460KV25-167BZXI part is unused and in its original packaging.

Return procedure for CY7C1460KV25-167BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1460KV25-167BZXI Tags

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