Infineon Technologies CY7C1460KV25-167BZXI
- Part No.:
- CY7C1460KV25-167BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1460KV25-167BZXI.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,250
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Product details
Overview
CY7C1460KV25-167BZXI from Cypress Semiconductor is a 36-Mbit synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, configured as 1M × 36 or 2M × 18. It operates at 167 MHz with 3.4 ns max access time, 2.5 V core/I/O supply, and supports zero-wait-state back-to-back read/write in high-throughput networking buffers and packet processors.
For engineers reviewing the CY7C1460KV25-167BZXI datasheet, CY7C1460KV25-167BZXI pinout, CY7C1460KV25-167BZXI application, or CY7C1460KV25-167BZXI equivalent, this device delivers deterministic timing, byte-write granularity, synchronous self-timed writes, JTAG boundary scan, and ECC-enabled soft-error resilience for mission-critical memory subsystems.
Technical Context
The CY7C1460KV25-167BZXI implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without wait states.
It integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing SER in radiation-prone environments. Burst capability supports linear or interleaved orders, and the ZZ sleep mode reduces power during idle periods while preserving data integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 or 2M × 18 configuration) |
| Max Clock Frequency | 167 MHz - enables sustained 167 MT/s throughput with no wait states |
| Access Time | 3.4 ns - defines maximum clock-to-output delay for timing closure in high-speed interfaces |
| Core/I/O Voltage | 2.5 V - requires single-supply rail; eliminates level-shifting in 2.5 V system designs |
| ECC Support | On-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time |
| Package | 100-pin TQFP (JEDEC-standard Pb-free) - compatible with standard surface-mount reflow profiles |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade embedded and telecom applications |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, body size 14 mm × 14 mm, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | Synchronous address bus sampled on rising CLK edge; selects one of 1M (×36) or 2M (×18) locations |
| DQa–DQd / DQPa–DQPd | Bidirectional Data I/O | 36-bit data + 4-bit parity interface; each byte pair controlled by dedicated BWa–BWd for partial writes |
| BWa–BWd | Byte Write Select | Active-low synchronous controls enabling write to corresponding DQ/DQP byte lanes independently |
| CLK, CEN | Clock & Enable | CLK qualified by CEN: deasserting CEN suspends clock recognition without deselection, extending previous cycle |
| CE1, CE2, CE3 | Chip Enable Group | Three-signal decode (CE1=L, CE2=H, CE3=L) enables bank selection in multi-SRAM systems |
| OE | Asynchronous Output Enable | Tristates outputs when HIGH; masked automatically during write data phase to prevent bus contention |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables true back-to-back read/write operations with zero wait states, maximizing bus utilization in burst-intensive traffic |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints; internal logic determines write completion based on clock and control signals |
| IEEE 1149.1 JTAG Boundary Scan | Supports PCB-level interconnect testing and in-system diagnostics without requiring additional test pads or fixtures |
| ZZ Sleep Mode | Reduces ICC to ≤10 µA while retaining memory contents, enabling low-power standby in packet buffering applications |
| Interleaved/Linear Burst Order | Configurable via MODE pin to match host processor burst addressing scheme (e.g., PowerPC vs. ARM) |
Applications
| High-Speed Network Packet Buffer | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Primary burst-access SRAM buffer interfacing directly to MAC and switch fabric controllers via 36-bit parallel bus. Use Value: 167 MHz zero-wait-state operation ensures deterministic 6 ns cycle time, meeting sub-10 ns round-trip latency requirements for cut-through switching. | Use Scenario: Holding ATM cell headers and payload segments in OC-192 SONET line cards operating at 10 Gbps line rate. IC Role / Device Role / Timing Role: Dual-port-configured SRAM serving as descriptor and payload memory for SAR and framer ASICs. Use Value: On-chip ECC prevents uncorrectable memory errors induced by cosmic rays in telco central office environments, improving 24/7 uptime. |
| Radar Signal Processing FIFO | Industrial PLC Real-Time Data Cache |
Use Scenario: Capturing digitized IF samples from phased-array radar receivers before FFT processing in FPGA-based beamformers. IC Role / Device Role / Timing Role: High-bandwidth streaming buffer synchronizing ADC output (LVDS) to FPGA processing clock domain via source-synchronous interface. Use Value: Fully registered inputs/outputs eliminate setup/hold violations at 167 MHz, enabling reliable capture of >1 GSPS-equivalent aggregate bandwidth. | Use Scenario: Caching motion control trajectory points and I/O status in safety-critical CNC controllers with SIL-2 certification requirements. IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory for real-time OS task stacks and shared process data structures. Use Value: ZZ sleep mode and industrial temperature range (–40 °C to +85 °C) support unattended operation in factory-floor enclosures with thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-167BIN | 36-Mbit ZBT SRAM, no on-chip ECC, 100-pin TQFP, same 167 MHz speed grade | Lacks SEC-DED capability; requires external ECC logic or software mitigation | Select when ECC is handled externally and cost sensitivity outweighs soft-error risk |
| IS61WV102436B-167TQLI | 36-Mbit NoBL SRAM, no JTAG, 165-ball FBGA only, identical ECC and timing specs | Requires board redesign for FBGA footprint; no TQFP option available | Select when board layout allows FBGA and JTAG test is not required |
Compared with AS7C362000B-167BIN and IS61WV102436B-167TQLI, the CY7C1460KV25-167BZXI uniquely combines TQFP packaging, integrated SEC-DED ECC, and IEEE 1149.1 JTAG in a single industrial-grade 167 MHz SRAM-enabling both reliability assurance and production testability without footprint or logic overhead.
Availability
CY7C1460KV25-167BZXI is available at Aetrix Electronics and suitable for high-speed network packet buffers, telecom line card memory, radar signal processing FIFOs, and industrial PLC real-time data caches requiring stable component supply across extended product lifecycles.
Supply support for CY7C1460KV25-167BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets, with emphasis on reliability and integration.
The CY7C1460KV25 series belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, zero-latency memory subsystems in packet-switched infrastructure and real-time signal processing equipment.
FAQ
What is the function of the MODE pin on CY7C1460KV25-167BZXI?
The MODE pin configures burst addressing order: logic HIGH selects interleaved burst (e.g., for PowerPC-compatible systems), while logic LOW selects linear burst (e.g., for ARM or x86 hosts). It is sampled at power-up and remains static during operation; changing it mid-operation is undefined and unsupported.
Does CY7C1460KV25-167BZXI require external termination resistors on DQ/DQP lines?
No external termination is required. The device integrates programmable output drive strength and on-die termination (ODT) control via internal register settings, supporting impedance-matched signaling into 50 Ω transmission lines without discrete resistors-reducing BOM count and layout complexity.
How does the ZZ sleep mode interact with the CEN pin?
ZZ and CEN operate independently: ZZ places the core in ultra-low-power retention state (≤10 µA ICC), while CEN only gates the clock path. When both are active (ZZ = LOW, CEN = HIGH), the device enters deep sleep with clock disabled and memory retained; exiting requires ZZ deassertion followed by CEN assertion and CLK restart per datasheet timing tZZR and tCER.
Can CY7C1460KV25-167BZXI be used in a 2M × 18 configuration without hardware modification?
Yes-the same physical device supports both 1M × 36 and 2M × 18 modes via address pin mapping: A18–A19 become address bits in ×18 mode, while A17–A19 are unused in ×36 mode. No strapping resistors or configuration pins are needed; mode is determined solely by how the host controller drives A[19:0] and interprets DQ[35:0] as two 18-bit words.
CY7C1460KV25-167BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1460KV25-167BZXI FAQ
1.How can I place an order for CY7C1460KV25-167BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV25-167BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV25-167BZXI reliable?
The price and inventory of CY7C1460KV25-167BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV25-167BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1460KV25-167BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV25-167BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1460KV25-167BZXI?
CY7C1460KV25-167BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460KV25-167BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV25-167BZXI?
For technical support, including CY7C1460KV25-167BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV25-167BZXI requirements.
6.How does Aetrix verify that CY7C1460KV25-167BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV25-167BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV25-167BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1460KV25-167BZXI?
All CY7C1460KV25-167BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV25-167BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV25-167BZXI part is unused and in its original packaging.
Return procedure for CY7C1460KV25-167BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1460KV25-167BZXI Tags

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