Infineon Technologies CY7C1460KV25-250BZC
- Part No.:
- CY7C1460KV25-250BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1460KV25-250BZC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1460KV25-250BZC from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, ECC support, 2.5 V core/I/O supply, and 250 MHz zero-wait-state operation. It delivers 2.5 ns clock-to-output timing, full input/output registration, and byte-write capability for high-throughput memory buffering in telecom line cards and packet-switching ASIC interfaces.
For engineers reviewing the CY7C1460KV25-250BZC datasheet, CY7C1460KV25-250BZC pinout, CY7C1460KV25-250BZC application, or CY7C1460KV25-250BZC equivalent, this device supports back-to-back read/write transitions without latency, integrates on-chip ECC for SER reduction, and provides JEDEC-compliant 100-pin TQFP packaging with JTAG boundary scan.
Technical Context
This SRAM implements fully registered synchronous interface logic: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to CLK. The NoBL™ architecture eliminates bus latency by enabling true consecutive read/write operations - each clock cycle transfers valid data without wait states.
It features synchronous self-timed writes, burst capability (linear/interleaved), IEEE 1149.1 JTAG boundary scan, and "ZZ" sleep mode. On-chip ECC encodes/decodes parity across DQa–DQd and DQPa–DQPd lines to detect and correct single-bit errors, reducing soft error rate in radiation-sensitive environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 configuration) |
| Max Clock Frequency | 250 MHz - enables 2.5 ns clock-to-output timing for real-time data streaming |
| Core/I/O Voltage | 2.5 V - matches industry-standard low-voltage I/O interfaces and reduces power dissipation |
| ECC Support | On-chip encoder/decoder for DQ/DQP lines - corrects single-bit errors per access, critical for telecom control plane reliability |
| Access Mode | Pipelined synchronous burst - supports unlimited back-to-back reads/writes with no wait states |
| Package | 100-pin TQFP (Pb-free, RoHS-compliant) - compatible with standard surface-mount reflow profiles |
| Byte Write Control | BWa–BWd pins - enable independent write masking of four 9-bit data groups (DQa/DQPa through DQd/DQPd) |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), Pb-free, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | Synchronous address bus (20-bit); sampled on rising CLK edge to select 1M × 36 location |
| DQa–DQd / DQPa–DQPd | Bidirectional Data I/O | 36-bit data + 4-bit parity (9-bit groups); direction controlled by OE and internal write sequencing |
| BWa–BWd | Byte Write Select | Active-low synchronous masks for 9-bit data/parity subwords - enables partial writes without read-modify-write |
| CLK, CEN | Clock & Enable | CLK qualified by CEN (active-low); CEN suspends clock recognition while preserving internal state |
| CE1/CE2/CE3, OE | Chip & Output Enable | Three-signal chip select (CE1/CE3 active-low, CE2 active-high); OE is asynchronous but masked during write cycles |
| ADV/LD, ZZ, MODE | Burst & Sleep Control | ADV/LD advances or loads burst address counter; ZZ enables low-power sleep; MODE selects burst order (linear/interleaved) |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables true back-to-back read/write operations - eliminates pipeline stalls in high-bandwidth packet buffering |
| On-chip ECC | Single-bit error correction across full 40-bit data+parity bus - meets telecom NEBS Level 3 soft-error immunity requirements |
| Zero Wait State @ 250 MHz | Guarantees deterministic 4 Gbps sustained throughput (36-bit × 250 MHz) without arbitration delay |
| Full Input/Output Registration | All signals synchronized to CLK rising edge - simplifies timing closure in FPGA-ASIC co-designs with tight setup/hold margins |
| JTAG Boundary Scan | IEEE 1149.1 compliance - enables in-system testability and interconnect verification on dense PCB layouts |
Applications
| Telecom Line Card Buffering | Network Processor Interface |
|---|---|
|
Use Scenario: Storing incoming/outgoing packet headers and metadata in OC-192/STM-64 line interface units. IC Role / Device Role / Timing Role: High-speed dual-port buffer between SerDes PHY and traffic manager ASIC, operating at 250 MHz with zero latency handoff. Use Value: Eliminates FIFO depth expansion and reduces jitter accumulation via deterministic pipelined access - critical for sub-100 ns packet processing deadlines. |
Use Scenario: Acting as instruction/data cache for multi-threaded network processors handling IPv4/IPv6 forwarding lookups. IC Role / Device Role / Timing Role: Synchronous burst SRAM providing concurrent read/write access to multiple execution pipelines under shared clock domain. Use Value: Enables simultaneous header parsing and table update without pipeline bubbles - increases packets-per-second throughput by ≥22% vs. async SRAM. |
| Radar Signal Processing Memory | Industrial PLC Real-Time Log Buffer |
|
Use Scenario: Capturing and staging digitized IF samples in phased-array radar front-ends before FFT computation. IC Role / Device Role / Timing Role: Burst-mode memory buffer aligned to ADC sampling clock, supporting interleaved burst reads for parallel FFT engines. Use Value: On-chip ECC prevents bit corruption in high-radiation airborne environments - avoids false target detection due to memory soft errors. |
Use Scenario: Logging sensor event timestamps and diagnostic codes in safety-critical programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile shadow buffer (with external backup) holding last 10k fault records, accessed synchronously during watchdog-triggered diagnostics. Use Value: Byte-write capability allows atomic updates of individual log entries without erasing full sectors - preserves integrity during brown-out conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 36-Mbit (1M × 36), 10 ns access, 100 MHz max, no ECC, 3.3 V I/O | Lacks on-chip ECC and 250 MHz performance - suitable only for non-critical, lower-speed buffering | Select when cost sensitivity outweighs SER requirements and system clock ≤100 MHz |
| ISSI IS61WV102436B | 36-Mbit (1M × 36), 2.5 V, 167 MHz max, no ECC, 100-pin TQFP | Slower max frequency (167 MHz vs. 250 MHz) and no ECC - limits use in high-reliability telecom infrastructure | Choose for legacy designs requiring pin compatibility but tolerating reduced bandwidth and no error correction |
Compared with IDT72V2115L10PF and IS61WV102436B, CY7C1460KV25-250BZC uniquely combines 250 MHz zero-wait-state operation with on-chip ECC in a JEDEC-standard package - making it the only option meeting NEBS-compliant telecom switching and radar signal integrity requirements.
Availability
CY7C1460KV25-250BZC is available at Aetrix Electronics and suitable for telecom infrastructure, network processor interfacing, radar signal buffering, and industrial real-time logging requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1460KV25-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded systems, with focus on reliability, low power, and system-level integration.
CY7C1460KV25 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth buffering in telecom, networking, and defense applications where deterministic timing and data integrity are mandatory.
FAQ
Does CY7C1460KV25-250BZC support both linear and interleaved burst modes?
Yes. The MODE pin selects burst order: logic HIGH configures linear addressing (A0–A19 increment sequentially), while LOW enables interleaved addressing (bit-reversed LSB toggling). This flexibility supports both cache-line-aligned and DSP-friendly memory access patterns without external logic.
How does the "ZZ" sleep mode reduce power consumption?
When ZZ is asserted LOW, the device enters low-power sleep mode drawing ≤50 µA typical standby current. Internal clocks and array biasing are gated, but data retention is maintained across the full industrial temperature range (–40°C to +85°C) without external refresh.
Can CY7C1460KV25-250BZC operate with mixed voltage supplies?
No. It requires a single 2.5 V ±0.2 V supply for both core logic and I/O. VDD and VDDQ must be tied together and decoupled with 0.1 µF ceramic capacitors per power pin - mixing voltages violates absolute maximum ratings and risks latch-up.
Is JTAG boundary scan functional without external programming hardware?
Yes. IEEE 1149.1 TAP operates independently of memory function: TCK/TMS/TDI/TDO pins enable full interconnect testing and register visibility even when the SRAM is deselected or in ZZ mode - no external programmer required for board-level continuity checks.
CY7C1460KV25-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 2.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1460KV25-250BZC FAQ
1.How can I place an order for CY7C1460KV25-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV25-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV25-250BZC reliable?
The price and inventory of CY7C1460KV25-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV25-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1460KV25-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV25-250BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1460KV25-250BZC?
CY7C1460KV25-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460KV25-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV25-250BZC?
For technical support, including CY7C1460KV25-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV25-250BZC requirements.
6.How does Aetrix verify that CY7C1460KV25-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV25-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV25-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1460KV25-250BZC?
All CY7C1460KV25-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV25-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV25-250BZC part is unused and in its original packaging.
Return procedure for CY7C1460KV25-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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