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Infineon Technologies CY7C1460KV33-167AXC

Part No.:
CY7C1460KV33-167AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1460KV33-167AXC.pdf
Description:
IC SRAM 36MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,597

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Product details

Overview

CY7C1460KV33 from Cypress Semiconductor is a 36-Mbit synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, configured as 1M × 36 or 2M × 18. It supports zero-wait-state 167-MHz bus operation (3.4 ns access), features fully registered I/O, byte-write capability, and 3.3-V core/2.5-V or 3.3-V I/O supply. Used in high-throughput network packet buffering and telecom line-card data path memory.

For engineers reviewing the CY7C1460KV33 datasheet, CY7C1460KV33 pinout, CY7C1460KV33 application, or CY7C1460KV33 equivalent, key selection criteria include burst order (linear/interleaved via MODE pin), ECC correction capability, synchronous self-timed write timing, clock enable (CEN) behavior, and TQFP-100 vs. FBGA-165 package compatibility.

Technical Context

This SRAM implements a fully synchronous, pipelined read/write interface with all inputs and outputs registered on the rising edge of CLK, qualified by CEN. Internal address counter advancement is controlled by ADV/LD, enabling burst sequences without external address generation.

NoBL™ logic eliminates bus turnaround latency, allowing true back-to-back reads and writes at full clock rate. On-chip ECC encodes/decodes parity across DQa–DQd and DQPa–DQPd lines, correcting single-bit errors and detecting double-bit errors per 36-bit word.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 or 2M × 18 configuration)
Max Clock Frequency 167 MHz - enables 167 million consecutive read/write cycles per second with no wait states
Access Time 3.4 ns - defines minimum clock-to-output delay for read operations at 167 MHz
VDD Supply 3.3 V ± 0.3 V - core voltage rail; requires stable low-noise regulation
VDDQ Supply 2.5 V or 3.3 V - independent I/O voltage rail supporting mixed-voltage system interfacing
ECC Support On-chip SEC-DED - corrects single-bit errors and detects double-bit errors per 36-bit data + 4-bit parity word
Burst Order Selectable linear or interleaved via MODE pin - determines address increment pattern during burst accesses

Pinout & Package

Package: 100-pin JEDEC-standard Pb-free TQFP (14 mm × 14 mm, 0.5 mm pitch). Pin-compatible with CY7C1460KVE33 and CY7C1462KVE33 in same footprint.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Input Synchronous address inputs sampled on rising CLK edge; A0–A19 used for 1M × 36 mode (20-bit address)
BWa–BWd Byte Write Select Active-low synchronous controls for DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd - enables partial-word writes
CLK Clock Input Rising-edge-triggered master clock; gated by CEN - all synchronous operations synchronized to this signal
CEN Clock Enable Active-low input that masks CLK when HIGH - suspends internal state progression without deselecting device
DQa–DQd / DQPa–DQPd Bidirectional Data I/O 36-bit data + 4-bit parity bus; direction controlled by OE and internal write/read state - tristated automatically during write data phase
OE Asynchronous Output Enable Active-low control for output drivers; masked during write data phase and device deselection to prevent bus contention
CE1, CE2, CE3 Chip Enable Three-level synchronous chip select (CE1/CE3 active LOW, CE2 active HIGH) - enables multi-bank memory expansion
ADV/LD Address Counter Control High = advance internal burst counter; Low = load new address - enables seamless burst and random access modes
MODE Burst Configuration Strap pin selecting linear (LOW) or interleaved (HIGH) burst order - must be static during operation
ZZ Deep Sleep Mode Active-low entry into low-power sleep; reduces ICC to ≤ 50 µA - retains data but halts all timing operations

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) Architecture Enables unlimited back-to-back read/write operations with zero wait states - eliminates pipeline stalls in burst-intensive systems
Synchronous Self-Timed Writes Internal write timing control ensures deterministic setup/hold margins - removes dependency on external write pulse width
IEEE 1149.1 JTAG Boundary Scan Full scan chain support for PCB interconnect test - includes TDI, TDO, TMS, TCK pins with defined instruction set and register mapping
Flexible I/O Voltage (VDDQ) Supports 2.5 V or 3.3 V I/O interfaces - allows direct connection to FPGA or ASIC I/O banks operating at either voltage
Byte-Write Capability Four independent BWx signals enable selective 8-bit, 16-bit, or 24-bit writes within 36-bit word - reduces unnecessary data traffic and power

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet or SONET/SDH frames in real time with minimal latency.

IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer between ingress/egress MACs and traffic manager ASICs.

Use Value: 167-MHz zero-wait-state operation sustains 6 Gbps sustained throughput (36-bit × 167 MHz); ECC prevents frame corruption from alpha-particle strikes in carrier-grade equipment.

Use Scenario: Holding call-control tables, signaling buffers, and voice sample queues in VoIP gateways and base station controllers.

IC Role / Device Role / Timing Role: Synchronous burst-access memory for time-critical DSP co-processing and protocol stack execution.

Use Value: Fully registered I/O and ADV/LD-controlled burst addressing align precisely with TI C6000 or Analog Devices SHARC timing requirements; ZZ mode enables rapid power cycling during idle periods.

Industrial PLC Data Logging Medical Imaging Frame Store

Use Scenario: Capturing sensor telemetry and motion-control trajectory data at microsecond intervals in deterministic automation systems.

IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory for real-time OS task context switching and cyclic data acquisition buffers.

Use Value: CEN-gated clocking allows precise synchronization to PLC scan cycle boundaries; byte-write capability minimizes bus activity during sparse update patterns.

Use Scenario: Temporary storage of uncompressed DICOM image tiles during CT/MRI reconstruction pipelines.

IC Role / Device Role / Timing Role: High-bandwidth, error-resilient frame buffer interfacing with FPGA-based image processors.

Use Value: On-chip SEC-DED ECC meets IEC 62304 Class C software safety requirements for radiation-induced soft errors; 100-pin TQFP simplifies thermal management in air-cooled diagnostic chassis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1460KVE33 Same die, Pb-free 100-pin TQFP package - identical electrical specs and timing; RoHS-compliant finish only No functional difference; selected where lead-free compliance is mandatory per regional regulatory requirement Choose KVE33 for new designs requiring RoHS-6 compliance; KV33 remains viable for legacy rework or non-RoHS environments
CY7C1462KVE33 2M × 18 organization (vs. 1M × 36); shares same pinout but different BWx mapping (BWa/BWb only) and no DQPc/DQPd pins Optimized for 18-bit datapath systems (e.g., older DSPs); lacks full 36-bit parity coverage - reduced ECC granularity Select CY7C1462KVE33 only when system bus width is strictly 18-bit and cost-per-bit optimization outweighs ECC robustness trade-off

Compared with CY7C1460KVE33, the KV33 offers identical performance with non-Pb-free finish; versus CY7C1462KVE33, it delivers full 36-bit ECC coverage and byte-select flexibility critical for modern 32/64-bit data paths - making it the preferred choice for new high-reliability designs.

Availability

CY7C1460KV33 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply across extended product lifecycles.

Supply support for CY7C1460KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure.

CY7C1460KV33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in deterministic real-time systems where bus turnaround overhead must be eliminated.

FAQ

What is the function of the MODE pin, and can it be changed dynamically?

The MODE pin selects burst address order: HIGH enables interleaved burst, LOW enables linear burst. It is a strap pin intended for static configuration at power-up; changing its state during operation violates timing and may cause undefined burst address sequencing. The datasheet specifies MODE must remain stable during device operation.

How does the ZZ (sleep) mode affect data retention and wake-up timing?

In ZZ mode, the device enters deep sleep with ICC ≤ 50 µA while retaining all stored data. Wake-up occurs synchronously on the first valid CLK edge after ZZ is deasserted; no additional stabilization delay is required. The internal registers and memory array remain powered, ensuring immediate access upon exit.

Is the OE pin truly asynchronous, and how does it interact with write cycles?

OE is asynchronous in assertion (LOW), but masked during the data portion of write cycles, on first clock after deselection, and when device is deselected. This prevents bus contention by forcing tristate regardless of OE state during write data sampling - a hardware-enforced safety feature confirmed in the functional description and truth table.

Does the on-chip ECC cover both data and parity bits, and what error detection capability does it provide?

Yes - ECC operates across the full 36-bit data word plus four dedicated parity bits (DQPa–DQPd), forming a (40,36) Hamming code. It provides single-error correction (SEC) and double-error detection (DED) per 40-bit codeword, meeting JEDEC JESD8-12 requirements for soft error resilience in mission-critical applications.

CY7C1460KV33-167AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1460KV33-167AXC FAQ

1.How can I place an order for CY7C1460KV33-167AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460KV33-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460KV33-167AXC reliable?

The price and inventory of CY7C1460KV33-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV33-167AXC is usually 5 days.

3.What payment methods are accepted for CY7C1460KV33-167AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV33-167AXC transactions.

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CY7C1460KV33-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460KV33-167AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460KV33-167AXC?

For technical support, including CY7C1460KV33-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV33-167AXC requirements.

6.How does Aetrix verify that CY7C1460KV33-167AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1460KV33-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV33-167AXC meets industry standards.

7.What is the process for return or replacement of CY7C1460KV33-167AXC?

All CY7C1460KV33-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV33-167AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460KV33-167AXC part is unused and in its original packaging.

Return procedure for CY7C1460KV33-167AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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