Infineon Technologies CY7C1460KV33-167AXCT
- Part No.:
- CY7C1460KV33-167AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1460KV33-167AXCT.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1460KV33 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, integrated on-chip ECC, 167 MHz maximum clock frequency, 3.3-V core supply, and 3.3-V/2.5-V I/O support. It enables zero-wait-state back-to-back read/write operations in high-throughput networking line cards and packet buffering subsystems.
For engineers reviewing the CY7C1460KV33 datasheet, CY7C1460KV33 pinout, CY7C1460KV33 application, or CY7C1460KV33 equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select mapping to DQ/DQP groups, synchronous self-timed write timing, JTAG boundary-scan capability, and ECC correction latency impact on system-level error recovery.
Technical Context
This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK (qualified by CEN), and all outputs are driven from output registers synchronized to CLK. The internal NoBL logic eliminates bus turnaround latency between consecutive reads and writes.
It supports linear or interleaved burst addressing via the MODE strap pin, provides four independent byte-write controls (BWa–BWd) for DQa–DQd and corresponding parity lines (DQPa–DQPd), and integrates IEEE 1149.1 JTAG boundary-scan for production testability - all while maintaining strict 167 MHz timing compliance with 3.4 ns max access time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 167 MHz - defines maximum sustained burst throughput of 600 MB/s (36-bit bus) |
| Access Time | 3.4 ns - clock-to-output delay at 167 MHz, enabling deterministic timing closure in FPGA-attached buffers |
| Supply Voltages | VDD = 3.3 V ± 0.3 V (core); VDDQ = 3.3 V or 2.5 V ± 0.2 V (I/O) - supports mixed-voltage system integration |
| ECC Capability | On-chip single-bit error correction / double-bit error detection - reduces soft error rate in radiation-prone telecom environments |
| Burst Order | Configurable via MODE pin: HIGH = interleaved; LOW = linear - matches legacy ZBT or modern memory controller expectations |
| Package | 100-pin TQFP (14 × 20 mm, 0.5 mm pitch) - compatible with standard PCB assembly and thermal management for mid-density SRAMs |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, 14 mm × 20 mm body, 0.5 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | 20-bit synchronous address bus sampled on rising CLK edge; selects one of 1M locations in 1M × 36 mode |
| BWa–BWd | Byte Write Select | Four active-low synchronous controls: BWa → DQa/DQPa, BWb → DQb/DQPb, etc.; enables partial writes without read-modify-write |
| CLK, CEN | Clock & Enable | CLK qualified by active-low CEN; deasserting CEN extends previous cycle without losing state or requiring re-synchronization |
| DQa–DQd, DQPa–DQPd | Data I/O & Parity I/O | 36-bit data + 4-bit parity (4 × 9-bit groups); bidirectional, tristated synchronously during write data phase regardless of OE |
| CE1, CE2, CE3 | Chip Enable Group | Three synchronous enables (CE1/CE3 active-low, CE2 active-high) allow hierarchical bank decoding in multi-SRAM systems |
| MODE | Burst Configuration | Strap pin determining burst address sequence: HIGH = interleaved (e.g., for DDR-compatible controllers), LOW = linear |
| ADV/LD | Burst Counter Control | Active-HIGH advances internal burst counter; LOW loads new address - enables seamless burst/non-burst mode switching |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables true back-to-back read/write transitions with no wait states - critical for packet forwarding engines requiring sub-10 ns latency per operation |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints; internal logic guarantees data capture within one clock cycle at 167 MHz |
| On-Chip ECC (SEC/DED) | Corrects single-bit errors and detects double-bit errors in real time - reduces uncorrectable error rate by >99% in neutron-rich environments |
| IEEE 1149.1 JTAG Support | Full boundary-scan capability with TDI/TDO/TMS/TCK pins - enables automated PCB test and interconnect verification without physical probe access |
| Flexible I/O Voltage | VDDQ supports 3.3 V or 2.5 V operation - allows direct interfacing to FPGAs or ASICs with either I/O standard without level shifters |
Applications
| Telecom Line Card Buffering | Network Packet Switching |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in carrier-grade Ethernet switches operating at 10 Gbps+ line rates. IC Role / Device Role / Timing Role: High-speed, low-latency buffer between MAC layer and traffic manager, synchronized to system clock domain. Use Value: 167 MHz burst throughput and zero bus turnaround enable full-line-rate packet queuing without pipeline stalls or external arbitration logic. |
Use Scenario: Temporary storage of fragmented IP packets during deep packet inspection in next-generation firewalls. IC Role / Device Role / Timing Role: Dual-port-accessible SRAM used as a scratchpad for parallel pattern-matching engines. Use Value: Byte-write capability and ECC ensure reliable partial updates of packet payloads without corruption from alpha-particle strikes in datacenter environments. |
| Industrial PLC Data Logging | Radar Signal Processing Buffer |
|
Use Scenario: Cyclic logging of sensor timestamps and analog input snapshots in deterministic real-time control systems. IC Role / Device Role / Timing Role: Synchronous memory mapped into processor's AXI-lite interface for deterministic write bursts every 100 µs. Use Value: CEN pin allows precise clock gating to reduce dynamic power during idle intervals while preserving address and data register states. |
Use Scenario: Intermediate storage of FFT coefficients between processing stages in airborne phased-array radar receivers. IC Role / Device Role / Timing Role: Pipelined SRAM acting as a ping-pong buffer between ADC sampling and DSP cores. Use Value: Interleaved burst mode (via MODE pin) aligns with radar waveform memory access patterns, reducing average latency by 30% vs. linear addressing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1460KVE33 | Same die, Pb-free 165-ball FBGA package (vs. TQFP); identical electrical specs and timing | Requires different PCB layout, thermal pad, and BGA reflow profile; better for space-constrained designs | Select when board area is constrained and BGA assembly capability exists; not drop-in compatible with TQFP footprint |
| IS61WV102436BLL-167TQLI | 1024K × 36, 167 MHz, no on-chip ECC; 3.3-V only (no VDDQ flexibility); different pinout and burst control scheme | Lacks SEC/DED protection and MODE-configurable burst order; requires external parity handling | Choose only if ECC is unnecessary and cost sensitivity outweighs reliability requirements in non-critical applications |
Compared with CY7C1460KVE33, the CY7C1460KV33 offers identical functionality in a more manufacturable TQFP package, while IS61WV102436BLL-167TQLI trades ECC and flexible I/O voltage for lower unit cost - making it suitable only where radiation tolerance and mixed-voltage interoperability are not required.
Availability
CY7C1460KV33 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and aerospace avionics requiring stable component supply across extended product lifecycles.
Supply support for CY7C1460KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.
The CY7C1460KV33 belongs to Cypress's NoBL™ SRAM product line, designed specifically for zero-latency, high-bandwidth buffering in packet-switched networks and real-time signal processing systems.
FAQ
What is the function of the MODE pin, and how does it affect burst addressing?
The MODE pin is a static strap input that configures burst address sequencing: pulled HIGH (or left floating) selects interleaved burst order (e.g., 0, 8, 1, 9…), while pulled LOW selects linear order (e.g., 0, 1, 2, 3…). It must be set before initialization and held stable during operation; changing it mid-burst causes undefined address generation and potential data corruption.
How does the on-chip ECC operate during read and write cycles?
During writes, the ECC encoder computes and stores 4 parity bits alongside each 36-bit word. During reads, the decoder checks all 40 bits and corrects any single-bit error in real time before output registration - adding no extra clock cycles. Double-bit errors are flagged via uncorrectable error status but do not halt operation.
Can the CY7C1460KV33 interface directly with a 2.5-V FPGA I/O bank?
Yes - the VDDQ supply can be set to 2.5 V ± 0.2 V independently of the 3.3-V VDD core supply. All DQ/DQP pins, BW signals, and OE are referenced to VDDQ, enabling direct connection to 2.5-V FPGA I/O banks without level-shifting circuitry, provided the FPGA supports 2.5-V LVTTL or LVCMOS signaling.
What happens to internal state when CEN is deasserted during active operation?
When CEN is deasserted HIGH, the internal clock is masked but all registers retain their current values - address, data, and control states remain intact. The device extends the previous clock cycle indefinitely, allowing precise pause/resume control without loss of context or need for reinitialization upon CEN reassertion.
CY7C1460KV33-167AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1460KV33-167AXCT FAQ
1.How can I place an order for CY7C1460KV33-167AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV33-167AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV33-167AXCT reliable?
The price and inventory of CY7C1460KV33-167AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV33-167AXCT is usually 5 days.
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Once your CY7C1460KV33-167AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV33-167AXCT?
For technical support, including CY7C1460KV33-167AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV33-167AXCT requirements.
6.How does Aetrix verify that CY7C1460KV33-167AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV33-167AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV33-167AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1460KV33-167AXCT?
All CY7C1460KV33-167AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV33-167AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV33-167AXCT part is unused and in its original packaging.
Return procedure for CY7C1460KV33-167AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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