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Infineon Technologies CY7C1460KV33-167AXIT

Part No.:
CY7C1460KV33-167AXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1460KV33-167AXIT.pdf
Description:
IC SRAM 36MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,573

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Product details

Overview

CY7C1460KV33 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, integrated ECC, 3.3-V core supply, and 3.3-V/2.5-V I/O support. It delivers zero wait-state 167-MHz bus operation (3.4 ns access), fully registered I/O, and byte-write capability for high-throughput memory subsystems in telecom line cards and network packet buffers.

For engineers reviewing the CY7C1460KV33 datasheet, CY7C1460KV33 pinout, CY7C1460KV33 application, or CY7C1460KV33 equivalent, this device is selected for deterministic latency, burst-read/write coherency, ECC-enabled data integrity in mission-critical embedded memory systems requiring back-to-back read/write transitions without turnaround cycles.

Technical Context

The CY7C1460KV33 implements a fully synchronous, clocked pipeline with input and output registers triggered on the rising edge of CLK, qualified by CEN. All address, control, and data inputs are latched synchronously, eliminating asynchronous timing windows.

Its NoBL™ logic enables true back-to-back read/write operations with no bus turnaround delay; burst modes (linear or interleaved) are selected via the MODE strap pin, and on-chip ECC encoding/decoding operates transparently during every access to correct single-bit errors and detect double-bit errors.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 organization), enabling 4.5 MB of fast, low-latency buffer storage per device.
Max Clock Frequency 167 MHz - supports sustained 167 MT/s throughput with guaranteed zero wait states in pipelined mode.
Access Time 3.4 ns - defines maximum clock-to-output delay at 167 MHz, critical for timing closure in high-speed bus interfaces.
Supply Voltages 3.3 V core (VDD), 3.3 V or 2.5 V I/O (VDDQ) - allows interoperability with both LVTTL and SSTL-2 interfaces.
ECC Support On-chip SEC-DED (Single Error Correction, Double Error Detection) - reduces soft error rate without external logic or software overhead.
Package 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) - JEDEC-standard Pb-free package with validated thermal and signal integrity for industrial PCB layouts.
Power Consumption 190 mA max operating current (×36 config at 167 MHz) - enables predictable thermal budgeting in dense memory modules.

Pinout & Package

Package: 100-pin TQFP (JEDEC MO-145AC), Pb-free, 14 mm × 14 mm body, 0.5 mm lead pitch, exposed pad optional.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Input 20-bit synchronous address bus sampled on rising CLK edge; selects one of 1M × 36 locations.
DQa–DQd, DQPa–DQPd Bidirectional Data I/O 36 data + 4 parity lines (40 total); DQa–DQd carry main data, DQPa–DQPd carry corresponding parity bits for ECC.
BWa–BWd Byte Write Select Four active-low synchronous controls - each enables write to one 9-bit byte group (DQa/DQPa, etc.) during partial writes.
CLK, CEN Clock & Enable CLK qualifies all synchronous inputs; CEN suspends clock recognition without deselecting device - preserves state across idle cycles.
CE1, CE2, CE3 Chip Enable Group Three-level synchronous chip select (CE1/CE3 active LOW, CE2 active HIGH) enables flexible bank decoding in multi-SRAM systems.
ADV/LD, MODE, ZZ Control Straps ADV/LD advances burst counter or loads new address; MODE selects linear/interleaved burst order; ZZ enables low-power sleep mode.

Key Features

Feature Design Value
No Bus Latency™ Architecture Enables unlimited consecutive read/write operations with zero turnaround cycles - eliminates pipeline stalls in burst-intensive traffic.
Fully Registered I/O All inputs and outputs pass through clocked registers - ensures deterministic setup/hold timing and simplifies FPGA/ASIC interface design.
On-Chip SEC-DED ECC Corrects single-bit errors and detects double-bit errors in real time - meets reliability requirements for telecom and industrial control without SW overhead.
Synchronous Self-Timed Writes Internal write timing logic eliminates external write pulse width constraints - guarantees reliable data capture across voltage/temperature corners.
Flexible I/O Voltage VDDQ supports 3.3 V or 2.5 V operation - permits direct connection to legacy LVTTL or modern SSTL-2 memory controllers without level shifters.

Applications

Telecom Line Card Buffering Network Packet Processing Engine

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer between ingress/egress ASICs and traffic managers.

Use Value: 167-MHz zero-wait-state operation sustains 6 Gbps sustained throughput; ECC prevents silent corruption in multi-day uptime deployments.

Use Scenario: Deep packet inspection engines requiring rapid access to flow state tables and temporary payload staging.

IC Role / Device Role / Timing Role: Synchronous burst-access scratchpad memory for pattern-matching accelerators and classifier lookups.

Use Value: Fully registered I/O and pipelined reads enable deterministic 3.4 ns clock-to-output timing - essential for cycle-accurate hardware parsing pipelines.

Radar Signal Processing Memory Industrial PLC Real-Time Data Log

Use Scenario: Capturing and buffering high-rate ADC samples from phased-array radar front ends before FFT processing.

IC Role / Device Role / Timing Role: Burst-capable frame buffer with linear/interleaved addressing aligned to DMA engine stride patterns.

Use Value: ADV/LD-controlled burst addressing and MODE-selectable order optimize data streaming efficiency; ZZ sleep mode reduces standby power during idle intervals.

Use Scenario: Logging sensor telemetry and actuator commands in safety-critical programmable logic controllers with nonvolatile backup.

IC Role / Device Role / Timing Role: Fast, error-resilient working memory for cyclic scan execution and fault-detection routines.

Use Value: On-chip SEC-DED ECC ensures data integrity across temperature cycling and EMI exposure - eliminating need for external checksum validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1460KVE33 Same die, Pb-free 100-pin TQFP, but rated for 200 MHz (3.2 ns access) - higher speed grade with identical pinout and ECC functionality. Used where system clock exceeds 167 MHz but ≤200 MHz; requires tighter timing margin on CLK and address setup. Select when higher bandwidth is required and board layout supports 200-MHz signal integrity.
IS61WV102436BLL-167TQLI ISSI 36-Mbit NoBL SRAM, 167 MHz, same 100-pin TQFP, but lacks on-chip ECC and uses different byte-write encoding (BW0–BW3 vs BWa–BWd). Applicable where ECC is handled externally or not required; lower cost but adds design complexity for error resilience. Choose only if ECC is implemented in FPGA logic or system-level software, and pin-compatible drop-in is prioritized over integrated reliability.

Compared with CY7C1460KVE33, the CY7C1460KV33 trades 33 MHz bandwidth for relaxed timing margins and lower power; versus IS61WV102436BLL-167TQLI, it provides hardware ECC transparency and Cypress's mature NoBL timing model - critical for safety-certified systems.

Availability

CY7C1460KV33 is available at Aetrix Electronics and suitable for telecom infrastructure, network test equipment, and industrial control systems requiring stable component supply, long-lifecycle support, and guaranteed ECC-enabled memory performance.

Supply support for CY7C1460KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, with focus on reliability and integration.

This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-turnaround, high-throughput memory subsystems in networking and real-time signal processing applications.

FAQ

What is the function of the MODE pin on CY7C1460KV33?

The MODE pin is a strap input that selects burst address order: pulled HIGH (or left floating) enables interleaved burst mode; pulled LOW selects linear burst mode. It must be held static during operation and is sampled at power-up or reset. This setting determines how the internal address counter increments during burst accesses and affects compatibility with specific memory controller burst protocols.

Does CY7C1460KV33 require external termination resistors for its data bus?

No external series or parallel termination is required for standard 100-pin TQFP layout with controlled-impedance PCB traces. The device features internally calibrated output drivers compatible with 50 Ω transmission lines under 3.3-V VDDQ operation. Layout best practices (length matching, ground plane, short stubs) remain essential for signal integrity at 167 MHz.

How does the on-chip ECC operate during a partial byte write?

During partial writes enabled by BWa–BWd, ECC recalculates parity only over the written bytes and their associated parity bits (e.g., writing DQa/DQPa updates only those 9+1 bits). The unchanged data bytes retain their original parity, ensuring full SEC-DED coverage across the entire 36-bit word after each write - no software intervention or full-word rewrite is needed.

Can CY7C1460KV33 be used with a 2.5-V memory controller without level shifters?

Yes - when VDDQ is supplied at 2.5 V, the device's I/Os meet SSTL-2 input thresholds and drive strengths, allowing direct interface to 2.5-V controllers. Core logic remains at 3.3 V (VDD), and the datasheet specifies separate AC/DC parameters for 2.5-V VDDQ operation, including reduced output swing and adjusted timing margins.

CY7C1460KV33-167AXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1460KV33-167AXIT FAQ

1.How can I place an order for CY7C1460KV33-167AXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460KV33-167AXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460KV33-167AXIT reliable?

The price and inventory of CY7C1460KV33-167AXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV33-167AXIT is usually 5 days.

3.What payment methods are accepted for CY7C1460KV33-167AXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV33-167AXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1460KV33-167AXIT?

CY7C1460KV33-167AXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460KV33-167AXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460KV33-167AXIT?

For technical support, including CY7C1460KV33-167AXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV33-167AXIT requirements.

6.How does Aetrix verify that CY7C1460KV33-167AXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1460KV33-167AXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV33-167AXIT meets industry standards.

7.What is the process for return or replacement of CY7C1460KV33-167AXIT?

All CY7C1460KV33-167AXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV33-167AXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460KV33-167AXIT part is unused and in its original packaging.

Return procedure for CY7C1460KV33-167AXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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