Infineon Technologies CY7C1460KV33-167BZC
- Part No.:
- CY7C1460KV33-167BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1460KV33-167BZC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,381
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Product details
Overview
CY7C1460KV33 from Cypress Semiconductor is a 36-Mbit synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, configured as 1M × 36 or 2M × 18. It supports zero-wait-state 167 MHz bus operation (tAC = 3.4 ns), features fully registered I/O, byte-write capability, and 3.3-V core/2.5-V or 3.3-V I/O supply. It is used in high-throughput network packet buffers and telecom line-card data path memory.
For engineers reviewing the CY7C1460KV33 datasheet, CY7C1460KV33 pinout, CY7C1460KV33 application, or CY7C1460KV33 equivalent, key selection criteria include burst order control (MODE pin), ECC-enabled soft error resilience, synchronous self-timed write timing, and TQFP-100 package compatibility with ZBT™-legacy systems.
Technical Context
The device implements a fully synchronous, rising-edge-triggered pipeline with input registers for all address/control signals and output registers for DQ/DQP lines. Its NoBL™ logic enables true back-to-back read/write transitions without bus turnaround latency.
On-chip ECC encodes/decodes 36-bit data + 8-bit parity to detect and correct single-bit errors per access. Burst addressing supports both linear and interleaved orders, selected via the MODE strap pin - fixed at power-up and not runtime reconfigurable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 or 2M × 18 configuration) |
| Max Clock Frequency | 167 MHz - guarantees full-speed operation with zero wait states in synchronous bus systems |
| Access Time (tAC) | 3.4 ns - defines maximum clock-to-output delay under 167 MHz conditions |
| Voltage Supply | 3.3 V core (VDD), 2.5 V or 3.3 V I/O (VDDQ) - enables mixed-voltage system interfacing |
| ECC Support | On-chip encoder/decoder for single-bit error correction per 36-bit word - reduces SER in radiation-prone environments |
| Burst Capability | Linear or interleaved burst order - selected by MODE pin; determines address increment pattern during burst reads/writes |
| Package | 100-pin TQFP (JEDEC standard, Pb-free) - provides 0.5 mm pitch, surface-mount compatibility for dense PCB layouts |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard, Pb-free, 0.5 mm pitch, body size 14 mm × 14 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | Synchronous inputs sampled on rising CLK edge; select 1M-word location in 1M × 36 mode |
| BWa–BWd | Byte Write Select | Active-low controls write enable per 9-bit data group (DQa/DQPa through DQd/DQPd) |
| CLK, CEN | Clock & Enable | Rising-edge-triggered clock qualified by active-low CEN; CEN suspends clock recognition without deselection |
| DQa–DQd / DQPa–DQPd | Data I/O & Parity I/O | 36-bit data + 8-bit parity bidirectional buses; automatically tristated during write data phase |
| CE1, CE2, CE3 | Chip Enable Group | Three-level synchronous chip select (active LOW/HIGH/LOW combo) enables bank isolation in multi-SRAM systems |
| MODE | Burst Order Strap | Static input determining linear vs. interleaved burst sequence; must be stable before initialization |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables consecutive read/write operations with no bus turnaround delay - sustains 100% bus utilization at 167 MHz |
| Synchronous Self-Timed Writes | Internal timing logic eliminates external write pulse width constraints - simplifies controller design and improves timing margin |
| IEEE 1149.1 JTAG Boundary Scan | Supports production test and debug of solder joints and interconnects without requiring functional access to memory array |
| "ZZ" Sleep Mode | Asynchronous low-power state reducing ICC to ≤10 µA - preserves data while minimizing standby current in idle periods |
| Byte-Write Granularity | Four independent 9-bit write groups allow partial-word updates without read-modify-write cycles - critical for packet header manipulation |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency data buffer with ECC protection against cosmic-ray-induced bit flips in carrier-grade hardware. Use Value: 167 MHz zero-wait-state operation enables line-rate 10 Gbps packet buffering; on-chip ECC meets Telcordia GR-474 soft error reliability requirements. |
Use Scenario: Frame assembly/disassembly and OAM processing in optical transport (OTN/SONET) line cards. IC Role / Device Role / Timing Role: Synchronous burst SRAM serving as dual-port-accessible working memory for DSP-based framer logic. Use Value: Fully registered I/O and pipelined NoBL™ interface aligns with FPGA-based framer clock domains; MODE pin configures burst order to match framer DMA engine. |
| Industrial PLC Data Logging | Avionics Data Acquisition Buffer |
|
Use Scenario: Cyclic acquisition and timestamped storage of sensor data in deterministic real-time control systems. IC Role / Device Role / Timing Role: Deterministic-access memory buffer interfaced to ARM Cortex-R or PowerPC-based motion controllers. Use Value: Predictable 3.4 ns tAC and synchronous self-timed writes guarantee jitter-free data capture at 167 MHz sampling rates; ZZ sleep mode extends battery life during idle intervals. |
Use Scenario: Capturing high-speed analog-to-digital converter (ADC) streams in flight data recorders and health monitoring units. IC Role / Device Role / Timing Role: Radiation-tolerant buffer memory deployed in DO-254-compliant avionics subsystems. Use Value: On-chip ECC reduces soft error rate by >100× versus non-ECC SRAM; TQFP-100 package supports conformal coating and thermal cycling compliance per MIL-STD-883. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1460KVE33 | Same die, Pb-free 100-pin TQFP, rated for 200 MHz (tAC = 3.2 ns); identical pinout and feature set | Higher speed grade suitable for systems requiring margin above 167 MHz - e.g., 200 MHz backplane interfaces | Select when system clock budget allows tighter timing margins or future-proofing for speed upgrade paths |
| CY7C1462KVE33 | 2M × 18 organization only (no 1M × 36 mode); same 100-pin TQFP; supports same 167 MHz speed grade but uses BWa–BWb only | Optimized for 18-bit datapath systems (e.g., legacy DSPs or specific FPGA memory interfaces) - reduced pin count for byte selects | Choose when memory width matches 18-bit bus architecture and ECC + NoBL™ functionality is retained |
Compared with CY7C1460KVE33 and CY7C1462KVE33, the CY7C1460KV33 uniquely supports dual organization (1M × 36/2M × 18) in a 167 MHz speed bin with full BWa–BWd control - making it optimal for flexible-width, cost-sensitive telecom and industrial designs where speed margin is secondary to configurability.
Availability
CY7C1460KV33 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply across extended product lifecycles.
Supply support for CY7C1460KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.
The CY7C1460KV33 belongs to Cypress's NoBL™ SRAM product line, designed specifically for high-throughput, low-latency data buffering in networking, telecommunications, and real-time industrial control applications.
FAQ
Does CY7C1460KV33 require external termination resistors on DQ or CLK lines?
No. The device integrates programmable output drive strength and on-die termination (ODT) support via internal impedance control circuitry. External termination is optional and only recommended for long trace lengths exceeding 8 inches in high-speed layouts. Reference design guidelines in Application Note AN98522 specify layout rules for 167 MHz signal integrity.
Can the MODE pin be changed dynamically during operation?
No. The MODE pin is sampled only at power-up reset and latched internally. Changing its state after initialization has no effect on burst order. Systems requiring runtime burst order switching must use external logic or select a different SRAM family with dynamic mode control.
What happens to stored data during ZZ sleep mode?
Data retention is guaranteed across the full industrial temperature range (–40°C to +85°C) with VDD ≥ 2.2 V and VDDQ ≥ 1.7 V. Current draw drops to ≤10 µA, and all I/O pins enter high-impedance state. Exit time from ZZ to active mode is 20 ns max, with no clock required during wake-up.
Is JTAG boundary scan supported in all operating modes?
Yes. IEEE 1149.1 boundary scan remains fully functional regardless of CEN state, burst mode, or sleep entry. TAP controller operates independently of memory array activity. Scan chain integrity can be verified even while the SRAM performs normal read/write operations.
CY7C1460KV33-167BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1460KV33-167BZC FAQ
1.How can I place an order for CY7C1460KV33-167BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV33-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV33-167BZC reliable?
The price and inventory of CY7C1460KV33-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV33-167BZC is usually 5 days.
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CY7C1460KV33-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460KV33-167BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV33-167BZC?
For technical support, including CY7C1460KV33-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV33-167BZC requirements.
6.How does Aetrix verify that CY7C1460KV33-167BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV33-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV33-167BZC meets industry standards.
7.What is the process for return or replacement of CY7C1460KV33-167BZC?
All CY7C1460KV33-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV33-167BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV33-167BZC part is unused and in its original packaging.
Return procedure for CY7C1460KV33-167BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1460KV33-167BZC Tags

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