Infineon Technologies CY7C1460KV33-200AXC
- Part No.:
- CY7C1460KV33-200AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1460KV33-200AXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1460KV33 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, ECC support, and 200 MHz operation (3.2 ns access). It delivers zero-wait-state back-to-back read/write transfers in high-throughput memory subsystems for network packet buffers and telecom line cards.
For engineers reviewing the CY7C1460KV33 datasheet, CY7C1460KV33 pinout, CY7C1460KV33 application, or CY7C1460KV33 equivalent, key selection criteria include its 100-pin TQFP package, 3.3-V core/2.5-V I/O supply flexibility, synchronous self-timed writes, byte-write capability, and on-chip ECC for SER reduction in mission-critical systems.
Technical Context
This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK (qualified by CEN), and all outputs are clocked through output registers. Burst logic supports linear or interleaved orders via MODE strap.
The device integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, with dedicated parity I/O lines (DQPa–DQPd) mapped per data nibble group. Sleep mode (ZZ) reduces standby current to ≤5 mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 configuration) |
| Max Clock Frequency | 200 MHz - enables 200 million consecutive read/write cycles per second without wait states |
| Access Time | 3.2 ns - defines minimum clock-to-output delay for timing budgeting in 200-MHz systems |
| Supply Voltages | 3.3 V core (VDD), 2.5 V or 3.3 V I/O (VDDQ) - supports mixed-voltage system interfacing |
| ECC Support | On-chip encoder/decoder with DQPa–DQPd parity I/O - corrects single-bit errors in real time |
| Package | 100-pin TQFP (14 × 20 mm, 0.5 mm pitch) - JEDEC-standard, Pb-free, surface-mount compatible |
| Operating Temperature | 0 °C to +70 °C - commercial-grade thermal range suitable for indoor telecom and industrial control |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard, Pb-free, body size 14 mm × 20 mm, 0.5 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | 20-bit synchronous address bus sampled on rising CLK edge; selects one of 1M locations |
| BWa–BWd | Byte Write Select | Four active-low synchronous controls - BWa governs DQa/DQPa, BWb governs DQb/DQPb, etc. |
| CLK, CEN | Clock & Enable | CLK qualified by active-low CEN; deasserting CEN extends previous cycle without deselection |
| DQa–DQd / DQPa–DQPd | Data I/O & Parity I/O | 36-bit data + 4-bit parity bidirectional bus; automatically tristated during write data phase |
| CE1, CE2, CE3 | Chip Enable Group | Three synchronous enables (CE1/CE3 active-low, CE2 active-high) for bank decoding and power gating |
| OE | Asynchronous Output Enable | Active-low OE masks internal logic during write/data phases - prevents bus contention |
| MODE | Burst Order Strap | Static input: HIGH = interleaved burst, LOW = linear burst; must be stable during operation |
| ZZ | Deep Sleep Control | Active-low entry into low-power sleep mode (IDD ≤ 5 mA); retains memory contents |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables true back-to-back read/write operations with no turnaround cycles - eliminates pipeline stalls in burst-intensive traffic |
| Synchronous Self-Timed Writes | Internal write timing logic removes external write pulse width constraints - simplifies controller design and improves reliability |
| Byte-Write Granularity | Four independent 9-bit write enable groups (via BWa–BWd) allow partial-word updates without read-modify-write overhead |
| JTAG Boundary Scan (IEEE 1149.1) | Full scan chain support with TCK/TMS/TDI/TDO pins - enables in-system testability and board-level diagnostics |
| Flexible I/O Voltage | VDDQ supports 2.5 V or 3.3 V - allows direct interface to both legacy 2.5-V ASICs and modern 3.3-V FPGAs |
Applications
| Network Packet Buffer | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer between ingress/egress MACs and traffic manager. Use Value: 200-MHz zero-wait-state operation sustains 7.2 GB/s aggregate bandwidth (36-bit × 200 MHz), meeting line-rate requirements for 10Gbps interfaces. |
Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic access and radiation tolerance. IC Role / Device Role / Timing Role: Dual-port-accessible SRAM with ECC for storing ATM cells or GFP frames under continuous traffic load. Use Value: On-chip ECC reduces soft error rate by >99% in neutron-rich environments - critical for carrier-grade uptime compliance. |
| Industrial PLC Data Cache | Radar Signal Processing Buffer |
|
Use Scenario: Real-time I/O mapping and tag storage in programmable logic controllers operating in electrically noisy factory settings. IC Role / Device Role / Timing Role: Deterministic, jitter-free memory for cyclic process data exchange between CPU and fieldbus interface modules. Use Value: Fully registered inputs/outputs eliminate metastability risk at 200 MHz - ensures cycle-accurate timing across temperature and voltage variation. |
Use Scenario: Intermediate storage for chirp samples and FFT results in airborne synthetic aperture radar (SAR) front-ends. IC Role / Device Role / Timing Role: Burst-capable memory supporting interleaved addressing for efficient FFT memory access patterns. Use Value: MODE-selectable interleaved burst order aligns with radix-2 FFT address strides - cuts memory controller complexity by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1460KVE33 | Same die, Pb-free 100-pin TQFP, identical timing and ECC - differs only in RoHS compliance marking and moisture sensitivity level (MSL3 vs MSL2a) | Identical functional use; selected when full Pb-free compliance and extended floor life required | Drop-in replacement if MSL3 handling infrastructure is available; verify reflow profile compatibility |
| AS7C3364B-20JCIN | 36-Mbit ZBT SRAM (no ECC), 200 MHz, 100-pin TQFP - lacks on-chip ECC, parity I/O, and MODE-controlled burst order | Suitable for cost-sensitive, non-safety-critical applications where SER immunity is not mandated | Choose only when ECC is unnecessary and BOM cost reduction outweighs long-term field reliability risk |
Compared with CY7C1460KVE33, the CY7C1460KV33 offers identical electrical and functional behavior but with standard RoHS exemption status; versus AS7C3364B-20JCIN, it adds ECC, parity I/O, and flexible burst control at higher unit cost and power.
Availability
CY7C1460KV33 is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, industrial PLC data caches, and radar signal processing buffers requiring stable component supply across multi-year production cycles.
Supply support for CY7C1460KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets.
The NoBL™ SRAM product line targets latency-critical, high-bandwidth memory subsystems in networking and telecom infrastructure - emphasizing zero-turnaround operation, ECC resilience, and synchronous determinism.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst address order: HIGH enables interleaved burst, LOW enables linear burst. It is a strap pin - must be set before initialization and held static during operation. Floating defaults to HIGH (interleaved). Incorrect or dynamic toggling causes undefined burst addressing and data corruption.
Does CY7C1460KV33 support 2.5-V-only operation?
Yes - VDD must remain at 3.3 V ± 0.3 V, but VDDQ can be independently set to 2.5 V ± 0.2 V for I/O interfacing. This allows direct connection to 2.5-V FPGAs or ASICs without level shifters, while maintaining full 200-MHz timing performance and ECC functionality.
How does the ZZ (sleep) mode interact with data retention and wake-up latency?
In ZZ mode, core power drops to ≤5 mA and I/O drivers are disabled, but SRAM array contents are retained. Wake-up requires ≥100 ns stabilization after ZZ deassertion before first valid access; no refresh or reinitialization is needed. CEN and CLK may remain inactive during sleep.
Can OE be used to control output direction during burst reads?
No - OE is masked during the data portion of any write sequence and during the first clock after deselection. During burst reads, OE remains effective for tristating outputs, but internal logic automatically manages direction based on WE and CE states; manual OE control is redundant and discouraged for burst timing integrity.
CY7C1460KV33-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1460KV33-200AXC FAQ
1.How can I place an order for CY7C1460KV33-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV33-200AXC reliable?
The price and inventory of CY7C1460KV33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV33-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1460KV33-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV33-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1460KV33-200AXC?
CY7C1460KV33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460KV33-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV33-200AXC?
For technical support, including CY7C1460KV33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV33-200AXC requirements.
6.How does Aetrix verify that CY7C1460KV33-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV33-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1460KV33-200AXC?
All CY7C1460KV33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV33-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV33-200AXC part is unused and in its original packaging.
Return procedure for CY7C1460KV33-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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