Infineon Technologies CY7C1460KV33-200AXCT
- Part No.:
- CY7C1460KV33-200AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1460KV33-200AXCT.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,349
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Product details
Overview
CY7C1460KV33 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, ECC support, 3.3-V core supply, 200-MHz operation (3.2-ns access), and JEDEC-standard 100-pin TQFP packaging. It enables zero-wait-state back-to-back read/write in high-throughput networking buffers and packet processors.
For engineers reviewing the CY7C1460KV33 datasheet, CY7C1460KV33 pinout, CY7C1460KV33 application, or CY7C1460KV33 equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select mapping (BWa–BWd), synchronous self-timed write timing, on-chip ECC correction capability, and CEN-controlled clock gating behavior.
Technical Context
This SRAM implements fully registered synchronous I/O with rising-edge clock capture for all control, address, and data signals. Its NoBL™ logic eliminates bus turnaround latency by enabling consecutive read/write cycles without wait states, supported by internal burst counters and ADV/LD-controlled address sequencing.
The device integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing soft error rate in radiation-sensitive environments. It supports both linear and interleaved burst orders via the MODE strap pin and provides synchronous tristate control of DQ/DQP lines during write data phases.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 200 MHz - enables 5-ns cycle time for sustained burst throughput |
| Access Time | 3.2 ns - defines minimum clock-to-output delay for read operations |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing |
| ECC Support | On-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time |
| Burst Capability | Linear or interleaved - selectable via MODE pin; determines address increment pattern during burst reads/writes |
| Power Management | ZZ sleep mode - reduces standby current to <100 µA while preserving data |
Pinout & Package
Package: 100-pin TQFP (JEDEC standard, Pb-free), 14 mm × 14 mm body, 0.5-mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | Synchronous address inputs sampled on rising CLK edge; define 1M-word location (20-bit address space) |
| BWa–BWd | Byte Write Select | Active-low synchronous controls for DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd - enable partial writes per 9-bit data group |
| CLK, CEN | Timing Control | CLK qualified by CEN: when CEN = LOW, CLK advances state; when HIGH, previous cycle extends without state change |
| DQa–DQd, DQPa–DQPd | Data I/O | 36-bit bidirectional data bus + 4-bit parity bus; automatically tristated during write data phase regardless of OE state |
| CE1, CE2, CE3 | Chip Enable | Three-level synchronous chip select (active LOW/HIGH/LOW combo) for multi-bank memory decoding |
| MODE | Burst Configuration | Strap pin: HIGH = interleaved burst order; LOW = linear burst order; must be stable during operation |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables true back-to-back read/write with no wait states - critical for packet buffering in telecom line cards |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints - simplifies controller design and improves timing margin |
| IEEE 1149.1 JTAG Boundary Scan | Supports production test and board-level diagnostics without requiring additional test pads or fixtures |
| ZZ Sleep Mode | Reduces active standby current to <100 µA while retaining memory contents - extends power-down duration in portable systems |
| 3.3-V Core / 2.5-V I/O Option | Allows direct interface to 2.5-V ASIC/FPGA I/O banks without level shifters - lowers BOM cost and signal integrity risk |
Applications
| Telecom Line Card Buffering | High-Speed Test Equipment Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in OC-192/STM-64 line interface modules. IC Role / Device Role / Timing Role: Primary burst-access buffer between SERDES and traffic manager ASIC, operating at 200 MHz with zero-latency transitions. Use Value: NoBL™ architecture sustains 200-MHz throughput across mixed read/write sequences, eliminating pipeline stalls that degrade jitter-sensitive packet timing. | Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) with >100-MHz sampling rates. IC Role / Device Role / Timing Role: High-bandwidth acquisition memory interfaced directly to FPGA-based pattern generators and comparators. Use Value: Fully registered I/O and 3.2-ns access time ensure deterministic setup/hold margins at 200 MHz, enabling reliable capture at full instrument bandwidth. |
| Radar Signal Processing Buffer | Industrial PLC Data Logging |
Use Scenario: Temporary storage of digitized RF samples in phased-array radar front-end modules before FFT processing. IC Role / Device Role / Timing Role: Low-latency, ECC-protected memory buffer handling bursty ADC data streams with strict bit-error requirements. Use Value: On-chip SEC-DED ECC reduces uncorrectable soft errors caused by cosmic rays in airborne systems, improving mean time between failures (MTBF). | Use Scenario: Real-time logging of sensor data and control events in safety-critical programmable logic controllers (PLCs) deployed in factory automation. IC Role / Device Role / Timing Role: Nonvolatile-configurable SRAM used for event timestamping and fault history storage with guaranteed data integrity. Use Value: ZZ sleep mode maintains data retention at <100 µA during brown-out conditions, ensuring no loss of critical fault logs during power interruptions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-200JCIN | No on-chip ECC; 200-MHz speed grade; 100-pin TQFP; 3.3-V only (no VDDQ flexibility) | Lacks SEC-DED protection - unsuitable for radiation-prone or mission-critical data integrity applications | Select when ECC is not required and cost sensitivity outweighs reliability needs |
| IS61WV102436B-200TQLI | 200-MHz ZBT-compatible SRAM; no NoBL™ logic; requires external OE management; no ZZ sleep mode | Higher latency during read/write transitions; no low-power retention mode - limits use in battery-backed or energy-constrained systems | Select when legacy ZBT timing compatibility is mandatory and power budget allows higher standby current |
Compared with AS7C362000B-200JCIN and IS61WV102436B-200TQLI, CY7C1460KV33 uniquely combines NoBL™ zero-turnaround operation, integrated ECC, and ZZ sleep mode - making it optimal for telecom, defense, and industrial systems where throughput, data integrity, and power efficiency are jointly constrained.
Availability
CY7C1460KV33 is available at Aetrix Electronics and suitable for telecom line card buffering, high-speed test equipment memory, and radar signal processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C1460KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for automotive, industrial, and communications markets.
CY7C1460KV33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth buffering in packet-switched networks and real-time signal acquisition systems.
FAQ
What is the function of the MODE pin on CY7C1460KV33?
The MODE pin selects burst address order: pulled HIGH (or left floating) configures interleaved burst mode; pulled LOW selects linear burst mode. It must remain static during operation. Interleaved mode supports cache-line access patterns common in processor interfaces, while linear mode suits sequential streaming applications like video frame buffering.
How does the ZZ sleep mode operate and what is its current draw?
Asserting ZZ LOW places the device into low-power sleep mode, reducing ICC to less than 100 µA while retaining all stored data. The device wakes on the next valid CLK edge after ZZ returns HIGH. This mode is asynchronous to clock and independent of CEN, enabling rapid entry/exit without disrupting timing sequences.
Can CY7C1460KV33 interface directly with a 2.5-V FPGA I/O bank?
Yes. VDDQ supports 2.5-V operation independently of the 3.3-V VDD core supply. When VDDQ = 2.5 V, all DQ/DQP and BW pins operate at 2.5-V logic levels with compatible voltage thresholds, enabling direct connection to 2.5-V FPGA I/O without level shifters or external resistors.
What happens to outputs during a write cycle when OE is asserted LOW?
Outputs are automatically tristated during the data portion of any write sequence - even if OE is held LOW. This prevents bus contention and eliminates need for external OE timing control. Tristate behavior is enforced synchronously by internal logic and overrides OE state during write data windows.
CY7C1460KV33-200AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1460KV33-200AXCT FAQ
1.How can I place an order for CY7C1460KV33-200AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV33-200AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV33-200AXCT reliable?
The price and inventory of CY7C1460KV33-200AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV33-200AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1460KV33-200AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV33-200AXCT transactions.
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CY7C1460KV33-200AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460KV33-200AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV33-200AXCT?
For technical support, including CY7C1460KV33-200AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV33-200AXCT requirements.
6.How does Aetrix verify that CY7C1460KV33-200AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV33-200AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV33-200AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1460KV33-200AXCT?
All CY7C1460KV33-200AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV33-200AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV33-200AXCT part is unused and in its original packaging.
Return procedure for CY7C1460KV33-200AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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