Infineon Technologies CY7C1460KV33-250AXI

Overview

CY7C1460KV33 from Cypress Semiconductor is a 36-Mbit synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, configured as 1M × 36 or 2M × 18. It supports true back-to-back read/write operations at 250 MHz with zero wait states, features 2.5 ns clock-to-output delay, 3.3-V core supply with 3.3-V/2.5-V I/O support, and IEEE 1149.1 JTAG boundary scan - deployed in high-throughput network packet buffers and telecom line-card control planes.

For engineers reviewing the CY7C1460KV33 datasheet, CY7C1460KV33 pinout, CY7C1460KV33 application, or CY7C1460KV33 equivalent, key selection criteria include burst order (linear/interleaved via MODE pin), byte-write granularity (BWa–BWd), synchronous self-timed write timing, ZZ sleep mode entry latency, and ECC correction capability for soft error mitigation in mission-critical memory subsystems.

Technical Context

The device implements fully registered synchronous operation: all address, control, and data inputs are latched on the rising edge of CLK (qualified by CEN), and all outputs are driven from output registers synchronized to the same edge. Its NoBL™ logic eliminates bus turnaround latency by enabling consecutive read/write cycles without idle clocks.

Burst addressing is configurable via the MODE strap pin (interleaved or linear), and writes are controlled by four byte-write enables (BWa–BWd) paired with WE and qualified by CE1/CE2/CE3 chip enables. On-chip ECC encodes/decodes parity across DQa–DQd and DQPa–DQPd, correcting single-bit errors and detecting double-bit errors per access.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, body size 14 mm × 14 mm, 0.5 mm pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with CY7C1460KVE33 and CY7C1462KVE33, the CY7C1460KV33 uniquely offers dual organization (1M × 36/2M × 18) in a leaded TQFP package - balancing ease of prototyping, thermal visibility, and architectural flexibility for early-stage telecom and defense designs.

Availability

CY7C1460KV33 is available at Aetrix Electronics and suitable for telecom infrastructure, military avionics, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY7C1460KV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for embedded systems.

The CY7C1460KV33 belongs to Cypress's NoBL™ SRAM product line, engineered for high-bandwidth, low-latency memory subsystems in networking, aerospace, and real-time control where deterministic timing and ECC reliability are mandatory.

FAQ

What is the function of the MODE pin, and can it be changed dynamically?

The MODE pin selects burst addressing order: HIGH enables interleaved burst, LOW enables linear burst. It is a strap pin intended for static configuration at power-up; changing its state during operation violates timing and may cause undefined burst address generation. The pin must remain stable throughout device operation, and floating defaults to HIGH (interleaved).

How does the ZZ (sleep) mode interact with ongoing burst transfers?

Asserting ZZ asynchronously places the device into deep sleep, terminating all internal operations including burst sequences. Any active burst is truncated, and the device enters low-power state within one CLK cycle. Upon ZZ deassertion, the device resumes normal operation on the next CLK edge, but burst continuity is not preserved - new accesses require fresh address loading via ADV/LD or A0–A19.

Does the on-chip ECC cover both data and parity bits stored on DQP lines?

Yes. The ECC encoder/decoder operates across the full 40-bit bus: 36 data bits (DQa–DQd) plus 4 parity bits (DQPa–DQPd). It corrects any single-bit error anywhere within that 40-bit word and detects any two-bit error, ensuring end-to-end integrity for both user data and stored parity - critical for fault-tolerant systems.

Can CE2 be used as an active-low enable like CE1 and CE3?

No. CE2 is defined as active-HIGH in the datasheet and pin definitions. Using it as active-low would invert chip select logic and risk unintended device activation. Proper decoding requires CE1 and CE3 asserted LOW while CE2 is asserted HIGH to enable the device; all three signals must be evaluated together per the truth table in the datasheet.